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Results 1 to 25 of 1673

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Properties of EWMA Controllers With Gain Adaptation : Advanced process controlJIN WANG.IEEE transactions on semiconductor manufacturing. 2010, Vol 23, Num 2, pp 159-167, issn 0894-6507, 9 p.Article

Real Time Redundancy Study of a Exponential Time Dependent ModelSHARIFI, M; HAMEDANIAN, M; NAGHIZADEH, M et al.Computer design. International conferenceWorldComp'2010. 2010, pp 46-52, isbn 1-60132-135-X, 7 p.Conference Paper

GRACE-2: integrating fine-grained application adaptation with global adaptation for saving energyVARDHAN, Vibhore; WANGHONG YUAN; HARRIS, Albert F et al.International journal of embedded systems (Print). 2009, Vol 4, Num 2, pp 152-169, issn 1741-1068, 18 p.Article

Causal and stable reduced-order model for linear high-frequency systemsCONDON, M; GRAHOVSKI, G; DESCHRIJVER, D et al.Electronics Letters. 2008, Vol 44, Num 14, pp 843-844, issn 0013-5194, 2 p.Article

Industry Survey of Wafer Fab Reticle Quality Control Strategies in the 90nm -45nm design-rule ageDOVER, Russell.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 67305B.1-67305B.5, issn 0277-786X, isbn 978-0-8194-6887-1Conference Paper

Eco-efficiency of take-back and recycling, a comprehensive approachHUISMAN, Jaco; STEVELS, Ab L. N.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 2, pp 83-90, issn 1521-334X, 8 p.Article

Potential influence on copper electrodeposition on scratched silicon surfacesZHANG, Y; BALAUR, E; SCHMUKI, P et al.Journal of electroceramics. 2006, Vol 16, Num 1, pp 65-70, issn 1385-3449, 6 p.Conference Paper

DFM requirements and solution roadmaps : The multi- layer approachCARBALLO, Juan Antonio; NASSIF, Sani.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 61560Y.1-61560Y.9, issn 0277-786X, isbn 0-8194-6199-7, 1VolConference Paper

A low dynamics recursive least-squares lattice adaptive algorithmPALEOLOGU, C; CIOCHINA, S; ENESCU, A. A et al.International conference on signals and electronic systems. 2005, pp 195-198, isbn 83-906074-7-6, 1Vol, 4 p.Conference Paper

Integrated infrastructure for sustainable electronic design systemMILOJKOVIC, J; JOVANOVIC, S; STOJILKOVIC, S et al.International conference on microelectronics. 2004, isbn 0-7803-8166-1, 2Vol, vol 2, 785-788Conference Paper

Ultrafast laser applications in semiconductor industryBO GU.SPIE proceedings series. 2004, pp 226-230, isbn 0-8194-5247-5, 5 p.Conference Paper

Semiconductor technologies support new generation hybrid carFUJIKAWA, Touma.Symposium on VLSI Circuits. 2003, pp 6-9, isbn 0-7803-8287-0, 1Vol, 4 p.Conference Paper

Fulfilling the speed imperative: New product development and enterprise project management in the new economyIMMELMAN, Raimond E.ASMC proceedings. 2002, pp 43-48, issn 1078-8743, isbn 0-7803-7158-5, 6 p.Conference Paper

Accuracy of yield impact calculation based on kill ratioONO, Makoto; IWATA, Hisafumi; WATANABE, Kenji et al.ASMC proceedings. 2002, pp 87-91, issn 1078-8743, isbn 0-7803-7158-5, 5 p.Conference Paper

ABC modeling: Advanced featuresMIRAGLIA, Stephanie; BLOUIN, Cathy; BOLDMAN, Gary et al.ASMC proceedings. 2002, pp 336-339, issn 1078-8743, isbn 0-7803-7158-5, 4 p.Conference Paper

Semiconductor fab maintenance challenge and BKM in downturn economyMASSIE, Todd J.ASMC proceedings. 2002, pp 228-230, issn 1078-8743, isbn 0-7803-7158-5, 3 p.Conference Paper

Scenario analysis of demand in a technology market using leading indicatorsMEIXELL, Mary J; WU, S. David.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 1, pp 65-75, issn 0894-6507Article

Challenges in thermal modeling of electronics at the system level: summary of panel held at the Therminic 2000JOSHI, Y; BAELMANS, M; COPELAND, D et al.Microelectronics journal. 2001, Vol 32, Num 10-11, pp 797-800, issn 0959-8324Article

Photonic technologies in the 21st century : Creation of new industriesHIRUMA, Teruo.SPIE proceedings series. 2000, pp 2-6, isbn 0-8194-3720-4Conference Paper

SEMI, fer de lance des semi-conducteurs : Fluides et gaz ultrapurs = SEMI, spearhead for semiconductorsLUCAS, Pierre.Salles propres & maîtrise de la contamination. 2000, Num 9, pp 22-26, issn 1291-6978, 4 p.Article

The design for the environment printed wiring board project : A partnership to identify cleaner technologiesHART, K; SINGH, D; EVANS, H et al.Plating and surface finishing. 1999, Vol 86, Num 1, pp 46-49, issn 0360-3164Article

Menaces sur la Corée du Sud = Threat on South CoreaFERRARI, T.Technologies internationales (Strasbourg). 1999, Num 51, pp 7-10, issn 1165-8568Article

Color grading of randomly textured ceramic tiles using color histogramsBOUKOUVALAS, C; KITTLER, J; MARIK, R et al.IEEE transactions on industrial electronics (1982). 1999, Vol 46, Num 1, pp 219-226, issn 0278-0046Article

À toute allure vers la haute technologie = At full speed towards high technologyREISE, W; GRÜNINGER, J.-C.Galvano organo traitements de surface. 1999, Vol 68, Num 692, pp 202-205, issn 0982-7870Article

Fab facility restructuring using a high-temperature Al alloy sputtering metallization techniqueNISHIMURA, H; YAMADA, K; TAKEGAWA, K et al.IEEE international symposium on semiconductor manufacturing conference. 1999, pp 337-340, isbn 0-7803-5403-6Conference Paper

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