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Results 1 to 25 of 10273

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Reducing the input test data volume under transparent scanPOMERANZ, Irith.IET computers & digital techniques (Print). 2014, Vol 8, Num 1, pp 1-10, issn 1751-8601, 10 p.Article

Bending stress analysis of flexible touch panelYEH, Meng-Kao; CHANG, Li-Yu; LU, Min-Ru et al.Microsystem technologies. 2014, Vol 20, Num 8-9, pp 1641-1646, issn 0946-7076, 6 p.Conference Paper

Crystal-plasticity based thermo-mechanical modeling of Al-components in integrated circuitsMEIER, Felix; SCHWARZ, Cornelia; WERNER, Ewald et al.Computational materials science. 2014, Vol 94, pp 122-131, issn 0927-0256, 10 p.Conference Paper

Establishment of Production Process of JK2LB Jacket Section for ITER CSOZEKI, H; HAMADA, K; TAKAHASHI, Y et al.IEEE transactions on applied superconductivity. 2014, Vol 24, Num 3, issn 1051-8223, 4800604.1-4800604.4Conference Paper

Scanning spreading resistance microscopy for failure analysis of nLDMOS devices with decreased breakdown voltageDOERING, S; RUDOLF, R; PINKERT, M et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 2128-2132, issn 0026-2714, 5 p.Conference Paper

Signal noise perturbation on automotive mixed-mode semiconductor device generated by graded substrate defectWEBER, Y; BUFFO, L; VANHUFFEL, B et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 2064-2069, issn 0026-2714, 6 p.Conference Paper

Accurate Permittivity Estimation Method with Iterative Waveform Correction for UWB Internal Imaging RadarSOUMA, Ryunosuke; KIDERA, Shouhei; KIRIMOTO, Tetsuo et al.IEICE transactions on electronics. 2013, Vol 96, Num 5, pp 730-737, issn 0916-8524, 8 p.Article

Transition Fault Simulation Considering Broadside Tests as Partially-Functional Broadside TestsPOMERANZ, Irith.IEEE transactions on very large scale integration (VLSI) systems. 2013, Vol 21, Num 7, pp 1359-1363, issn 1063-8210, 5 p.Article

Functional Broadside Templates for Low-Power Test GenerationPOMERANZ, Irith.IEEE transactions on very large scale integration (VLSI) systems. 2013, Vol 21, Num 12, pp 2321-2324, issn 1063-8210, 4 p.Article

Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditionsGUANGHUA WU; BO TAO; ZHOUPING YIN et al.Microelectronics and reliability. 2013, Vol 53, Num 12, pp 2030-2035, issn 0026-2714, 6 p.Article

Friction, wear and tribofilm formation on electrical contact materials in reciprocating sliding against silver-graphiteGRANDIN, M; WIKLUND, U.Wear. 2013, Vol 302, Num 1-2, pp 1481-1491, issn 0043-1648, 11 p.Conference Paper

A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate PairZHANG, Yao-Jiang; JUN FAN.IEEE transactions on microwave theory and techniques. 2012, Vol 60, Num 7, pp 2035-2045, issn 0018-9480, 11 p.Article

A health indicator method for degradation detection of electronic productsKUMAR, Sachin; VICHARE, Nikhil M; DOLEV, Eli et al.Microelectronics and reliability. 2012, Vol 52, Num 2, pp 439-445, issn 0026-2714, 7 p.Article

Design-Dependent Process Monitoring for Wafer Manufacturing and Test Cost ReductionCHAN, Tuck-Boon; PANT, Aashish; CHENG, Lerong et al.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 3, pp 447-459, issn 0894-6507, 13 p.Article

Model-Based Mutation Testing Using Pushdown Automata : Software Reliability EngineeringBELLI, Fevzi; BEYAZIT, Mutlu; TAKAGI, Tomohiko et al.IEICE transactions on information and systems. 2012, Vol 95, Num 9, pp 2211-2218, issn 0916-8532, 8 p.Article

Study on the Dielectric Properties of Biological Cells Using the Electrokinetic MethodCHENG LIN; ZHONG LISHENG; ZHANG YUE et al.IEEJ transactions on electrical and electronic engineering. 2012, Vol 7, Num 5, pp 443-449, issn 1931-4973, 7 p.Article

Ensuring a High Quality Digital Device through Design for TestabilityUMERAH NGENE, Christopher.CIT. Journal of computing and information technology. 2012, Vol 20, Num 4, pp 235-246, issn 1330-1136, 12 p.Article

A design for robust wide metal tracksACKERMANN, M; HEIN, V; KOVACS, C et al.Microelectronics and reliability. 2012, Vol 52, Num 9-10, pp 2447-2451, issn 0026-2714, 5 p.Conference Paper

Harsh environment application of electronics - Reliability of copper wiring and testability thereofRATHGEBER, S; BAUER, R; OTTO, A et al.Microelectronics and reliability. 2012, Vol 52, Num 9-10, pp 2452-2456, issn 0026-2714, 5 p.Conference Paper

Time dependent dielectric breakdown physics: Models revisitedMCPHERSON, J. W.Microelectronics and reliability. 2012, Vol 52, Num 9-10, pp 1753-1760, issn 0026-2714, 8 p.Conference Paper

When adequate and predictable reliability is imperativeSUHIR, E.Microelectronics and reliability. 2012, Vol 52, Num 9-10, pp 2342-2346, issn 0026-2714, 5 p.Conference Paper

A Current-Controlled Variable InductorHOOPER, Rich; GUY, Bill; PERRAULT, Rick et al.IEEE instrumentation & measurement magazine. 2011, Vol 14, Num 4, pp 39-44, issn 1094-6969, 6 p.Article

Evaluation of image reconstruction algorithms for non-destructive characterization of thermal interfacesERTURK, Hakan.International journal of thermal sciences. 2011, Vol 50, Num 6, pp 906-917, issn 1290-0729, 12 p.Article

F-Scan: A DFT Method for Functional Scan at RTLOBIEN, Marie Engelene J; OHTAKE, Satoshi; FUJIWARA, Hideo et al.IEICE transactions on information and systems. 2011, Vol 94, Num 1, pp 104-113, issn 0916-8532, 10 p.Article

Test Strength: A Quality Metric for Transition Fault Tests in Full-Scan CircuitsPOMERANZ, Irith; REDDY, Sudhakar M.IEEE transactions on very large scale integration (VLSI) systems. 2011, Vol 19, Num 10, pp 1907-1911, issn 1063-8210, 5 p.Article

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