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Results 1 to 25 of 18238

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Closed-Form Design of Gysel Power Divider With Only One Isolation ResistorZAKER, Reza; ABDIPOUR, Abdolali; MIRZAVAND, Rashid et al.IEEE microwave and wireless components letters. 2014, Vol 24, Num 8, pp 527-529, issn 1531-1309, 3 p.Article

Design for reliability of multi-layer stretchable interconnectsHSU, Yung-Yu; PAPAKYRIKOS, Cole; LIU, Daniel et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 9, issn 0960-1317, 095014.1-095014.7Article

Analysis of heat dissipation of epitaxial graphene devices on SiCKANGMU LEE; MOON, Jeong-Sun; OH, Thomas et al.Solid-state electronics. 2014, Vol 101, pp 44-49, issn 0038-1101, 6 p.Conference Paper

A Varactor-Tuned Helix-Based Chiral LayerBAYATPUR, Farhad; WHEELAND, Sara; AMIRKHIZI, Alireza V et al.IEEE microwave and wireless components letters. 2013, Vol 23, Num 5, pp 246-248, issn 1531-1309, 3 p.Article

Artificial duplication of polarization fatigue in Pb(Zr0.54Ti0.46)O3 thin film capacitorsBOUREGBA, Rachid; SAMA, Nossikpendou; SOYER, Caroline et al.Thin solid films. 2013, Vol 527, pp 327-333, issn 0040-6090, 7 p.Article

Co-operating retrodirective systemCHAN, Pak; FUSCO, Vincent.IET microwaves, antennas & propagation (Print). 2013, Vol 7, Num 3, pp 187-194, issn 1751-8725, 8 p.Article

Design and analysis of a decade bandwidth 180° hybrid couplerCHAN, Kevin K. M; TAN, Adrian E. C; RAMBABU, Karumudi et al.IET microwaves, antennas & propagation (Print). 2013, Vol 7, Num 1, pp 71-77, issn 1751-8725, 7 p.Article

A Modified Wilkinson Power Divider With Isolation Bandwidth ImprovementKAO, Jui-Chih; TSAI, Zuo-Min; LIN, Kun-You et al.IEEE transactions on microwave theory and techniques. 2012, Vol 60, Num 9, pp 2768-2780, issn 0018-9480, 13 p.Article

Effect of Surface Roughness on Paper Substrate Circuit BoardRYAN, Alan; LEWIS, Huw.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2012, Vol 2, Num 7-8, pp 1202-1208, issn 2156-3950, 7 p.Article

Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer StructuresFRIEDRICH, Matthias; LEONE, Marco; BEDNARZ, Christian et al.IEEE transactions on electromagnetic compatibility. 2012, Vol 54, Num 5, pp 1097-1104, issn 0018-9375, 8 p.Article

Investigation of pickup effect for multi-fingered ESD devices in 0.5 μm 5V/ 18V CDMOS processACHENG ZHOU; YANG WANG; KEHAN ZHU et al.Electronics letters. 2012, Vol 48, Num 15, pp 911-913, issn 0013-5194, 3 p.Article

A Physics-Based Causal Bond-Wire Model for RF ApplicationsNAZARIAN, Alexé L; TIEMEIJER, Luuk F; JOHN, David L et al.IEEE transactions on microwave theory and techniques. 2012, Vol 60, Num 12, pp 3683-3692, issn 0018-9480, 10 p., 1Article

Approximation of Worst Case Crosstalk at High FrequenciesXIAOPENG DONG; HAIXIAO WENG; BEETNER, Daryl G et al.IEEE transactions on electromagnetic compatibility. 2011, Vol 53, Num 1, pp 202-208, issn 0018-9375, 7 p.Article

Experimental and Analytical Studies on the High Cycle Fatigue of Thin Film Metal on PET Substrate for Flexible Electronics ApplicationsALZOUBI, Khalid; LU, Susan; SAMMAKIA, Bahgat et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 1-2, pp 43-51, issn 2156-3950, 9 p.Article

Modeling and Optimal Design of Shorting Vias to Suppress Radiated Emission in High-Speed Alternating PCB PlanesWU, Kai-Bin; WU, Ruey-Beei; DE ZUTTER, Daniel et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 3-4, pp 566-573, issn 2156-3950, 8 p.Article

Nanocrystalline silicon thickness dependence of transmission characteristics of CPWs on surface-passivated high- resistivity silicon substratesWANG, R.-L; SU, Y.-K; CHEN, C.-J et al.Electronics letters. 2011, Vol 47, Num 20, pp 1133-1134, issn 0013-5194, 2 p.Article

Phase-shift control of dual half-bridge inverter feeding coupled loads for induction heating purposesCARRETERO, C; LUCIA, O; ACERO, J et al.Electronics letters. 2011, Vol 47, Num 11, pp 670-671, issn 0013-5194, 2 p.Article

Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part I - generic mechanical design procedureGEREN, Necdet; SARIGÜL, Cağdaş; BAYRAMOGLU, Melih et al.Soldering & surface mount technology. 2011, Vol 23, Num 4, pp 244-256, issn 0954-0911, 13 p.Article

Uniformity study of wafer-scale InP-to-silicon hybrid integrationDI LIANG; CHAPMAN, David C; BOWERS, John E et al.Applied physics. A, Materials science & processing (Print). 2011, Vol 103, Num 1, pp 213-218, issn 0947-8396, 6 p.Article

Verification of Stable Circuit Operation of 180 nm Current Controlled MOS Current Mode Logic under Threshold Voltage Fluctuation : Fundamentals and Applications of Advanced Semiconductor DevicesKAMIYANAGI, Masashi; IMAMOTO, Takuya; SASAKI, Takeshi et al.IEICE transactions on electronics. 2011, Vol 94, Num 5, pp 760-766, issn 0916-8524, 7 p.Article

A Modified Gysel Power Divider of Arbitrary Power Ratio and Real Terminated ImpedancesYONGLE WU; YUANAN LIU; SHULAN LI et al.IEEE microwave and wireless components letters. 2011, Vol 21, Num 11, pp 601-603, issn 1531-1309, 3 p.Article

Enhanced EBG-patterned PDN for suppressing power plane noisesKWON, J. H; SHIM, D. U; KWAK, S. I et al.Electronics letters. 2011, Vol 47, Num 24, pp 1317-1319, issn 0013-5194, 3 p.Article

Computational investigations into the operating window for memristive devices based on homogeneous ionic motionNOMAN, Mohammad; WENKAN JIANG; SALVADOR, Paul A et al.Applied physics. A, Materials science & processing (Print). 2011, Vol 102, Num 4, pp 877-883, issn 0947-8396, 7 p.Article

A Novel Miniaturized Forward-Wave Directional Coupler With Periodical Mushroom-Shaped Ground PlaneHSU, Sen-Kuei; TSAI, Chung-Hao; WU, Tzong-Lin et al.IEEE transactions on microwave theory and techniques. 2010, Vol 58, Num 8, pp 2277-2283, issn 0018-9480, 7 p.Article

Broadband Compact 180° Hybrid Derived From the Wilkinson DividerNING YANG; CALOZ, Christophe; KE WU et al.IEEE transactions on microwave theory and techniques. 2010, Vol 58, Num 4, pp 1030-1037, issn 0018-9480, 8 p.Article

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