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Results 1 to 25 of 37993

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A novel method to overcome photoresist collapse with high aspect ratio structuresMINGYAN YU; SHIRUI ZHAO; CHAOQUN GAO et al.Microsystem technologies. 2014, Vol 20, Num 12, pp 2185-2189, issn 0946-7076, 5 p.Article

Effects of structural parameters on flow boiling performance of reentrant porous microchannelsDAXIANG DENG; YONG TANG; HAORAN SHAO et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 6, issn 0960-1317, 065025.1-065025.14Article

Mathematical Modeling and Simulations for Machine Directional Register in Hybrid Roll-to-Roll Printing SystemsHYUNKYOO KANG; BAUMANN, Reinhard R.International journal of precision engineering and manufacturing. 2014, Vol 15, Num 10, pp 2109-2116, 8 p.Article

Simultaneous filling of through silicon vias (TSVs) with different aspect ratios using multi-step direct current densityZHAOYU WANG; HONG WANG; PING CHENG et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 8, issn 0960-1317, 085013.1-085013.8Article

Capillary self-alignment of polygonal chips: a generalization for the shift-restoring forceBERTHIER, Jean; MERMOZ, Sébastien; BRAKKE, Kenneth et al.Microfluidics and nanofluidics (Print). 2013, Vol 14, Num 5, pp 845-858, issn 1613-4982, 14 p.Article

Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle TrajectoriesDEWEN ZHAO; TONGQING WANG; YONGYONG HE et al.IEEE transactions on semiconductor manufacturing. 2013, Vol 26, Num 4, pp 556-563, issn 0894-6507, 8 p.Article

Natural resin shellac as a substrate and a dielectric layer for organic field-effect transistorsIRIMIA-VLADU, Mihai; GLOWACKI, Eric Daniel; SCHWABEGGER, Günther et al.Green chemistry (Print). 2013, Vol 15, Num 6, pp 1473-1476, issn 1463-9262, 4 p.Article

Novel photodefined polymer-embedded vias for silicon interposersTHADESAR, Paragkumar A; BAKIR, Muhannad S.Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 3, issn 0960-1317, 035003.1-035003.6Article

Petri Net-Based Optimal One-Wafer Scheduling of Single-Arm Multi-Cluster Tools in Semiconductor ManufacturingQINGHUA ZHU; NAIQI WU; YAN QIAO et al.IEEE transactions on semiconductor manufacturing. 2013, Vol 26, Num 4, pp 578-591, issn 0894-6507, 14 p.Article

Planar patterned stretchable electrode arrays based on flexible printed circuitsTAYLOR, R. E; BOYCE, C. M; BOYCE, M. C et al.Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 10, issn 0960-1317, 105004.1-105004.7Article

Preheating and heat addition by LASER beam in hybrid LASER-ultrasonic weldingSAVU, I. D; SAVU, S. V; SEBES, G et al.Journal of thermal analysis and calorimetry. 2013, Vol 111, Num 2, pp 1221-1226, issn 1388-6150, 6 p.Article

Trends of deposition and patterning techniques of TiO2 for memristor based bio-sensing applicationsNOR SHAHANIM MOHAMAD HADIS; ASRULNIZAM ABD MANAF; SUKREEN HANA HERMAN et al.Microsystem technologies. 2013, Vol 19, Num 12, pp 1889-1896, issn 0946-7076, 8 p.Article

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitationCOSTELLO, S; STRUSEVICH, N; FLYNN, D et al.Microsystem technologies. 2013, Vol 19, Num 6, pp 783-790, issn 0946-7076, 8 p.Conference Paper

Magnetic field assisted microcontact printing: A new concept of fully automated and calibrated process : Nanolithography 2012CAU, Jean-Christophe; LUDOVIC, Lafforgue; MARIE, Nogues et al.Microelectronic engineering. 2013, Vol 110, pp 207-214, issn 0167-9317, 8 p.Conference Paper

Multiparametric Virtual Metrology Model Building by Job-Shop Data Fusion Using a Markov Chain Monte Carlo MethodTAMAKI, Kenji; KANEKO, Shun'ichi.IEEE transactions on semiconductor manufacturing. 2013, Vol 26, Num 3, pp 319-327, issn 0894-6507, 9 p.Conference Paper

On the mechanism of material removal by fixed abrasive lapping of various glass substratesCHO, Byoung-Jun; KIM, Hyuk-Min; MANIVANNAN, R et al.Wear. 2013, Vol 302, Num 1-2, pp 1334-1339, issn 0043-1648, 6 p.Conference Paper

Scaling of Copper Seed Layer Thickness Using Plasma-Enhanced ALD and Optimized PrecursorsJIAJUN MAO; EISENBRAUN, Eric; OMARJEE, Vincent et al.IEEE transactions on semiconductor manufacturing. 2013, Vol 26, Num 1, pp 17-22, issn 0894-6507, 6 p.Conference Paper

A predictive divergence compensation approach for the fabrication of three-dimensional microstructures using focused ion beam machiningSUN, J; LUO, X; RITCHIE, J et al.Proceedings of the Institution of Mechanical Engineers. Part B. Journal of engineering manufacture. 2012, Vol 226, Num 2, pp 229-238, issn 0954-4054, 10 p.Article

Adhesion of Contaminant Particles to Advanced Photomask MaterialsKILROY, Caitlin M; JAISWAL, Ravi P; BEAUDOIN, Stephen P et al.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 1, pp 37-44, issn 0894-6507, 8 p.Article

An Adaptive-Tuning Scheme for G&P EWMA Run-to-Run ControlCHANG, Chun-Cheng; PAN, Tian-Hong; WONG, David Shan-Hill et al.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 2, pp 230-237, issn 0894-6507, 8 p.Article

An effective light-extracting microstructure for a single-sheet backlight unit for liquid crystal displayYEON, Jeongho; LEE, Joo-Hyung; LEE, Hong-Seok et al.Journal of micromechanics and microengineering (Print). 2012, Vol 22, Num 9, issn 0960-1317, 095006.1-095006.9Article

Critical Variables in the Decision-Making Process for AMHS Technology Selection in Semiconductor Wafer Size Transitions: Exploratory StudyTEMPONI, Cecilia; JIMENEZ, Jesus A; MENDEZ MEDIAVILLA, Francis A et al.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 3, pp 408-419, issn 0894-6507, 12 p.Article

Cyclic Scheduling of Cluster Tools With Nonidentical Chamber Access Times Between Parallel ChambersKIM, Dae-Kyu; JUNG, Yu-Ju; JUNG, Chihyun et al.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 3, pp 420-431, issn 0894-6507, 12 p.Article

Estimating the Process Yield of Multiple Characteristics with One-Sided SpecificationsWANG, Fu-Kwun.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 1, pp 57-62, issn 0894-6507, 6 p.Article

Fabrication of a Multimode Interference Device in a Low-Loss Flat-Fiber Platform Using Physical Micromachining TechniqueAMBRAN, Sumiaty; HOLMES, Christopher; GATES, James C et al.Journal of lightwave technology. 2012, Vol 30, Num 17-20, pp 2870-2875, issn 0733-8724, 6 p.Article

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