Abrasive and additive interactions in high selectivity STI CMP slurriesPRAVEEN, B. V. S; MANIVANNAN, R; UMASHANKAR, T. D et al.Microelectronic engineering. 2014, Vol 114, pp 98-104, issn 0167-9317, 7 p.Article

An integrated planar magnetic micropumpJUNHUI NI; BIN WANG; CHANG, Stanley et al.Microelectronic engineering. 2014, Vol 117, pp 35-40, issn 0167-9317, 6 p.Article

Characteristics and mechanism of Al_1.3Sb₃Te etched by Cl₂/BCl₃ inductively coupled plasmasZHONGHUA ZHANG; SANNIAN SONG; BO LIU et al.Microelectronic engineering. 2014, Vol 115, pp 51-54, issn 0167-9317, 4 p.Article

Cluster based dynamic area-array I/O planning for flip chip technologyKISHORE KUMAR MUCHHERLA; JAI GANESH KUMAR; WANG ROVEDA, Janet M et al.Microelectronic engineering. 2014, Vol 114, pp 57-69, issn 0167-9317, 13 p.Article

Development of a heat-generable mold insert and its application to the injection molding of microstructuresLIOU, A. C; CHEN, R. H; HUANG, C. K et al.Microelectronic engineering. 2014, Vol 117, pp 41-47, issn 0167-9317, 7 p.Article

Etching properties of Na_0.5K_0.5NbO₃ thin films by using inductively coupled CF₄/Ar plasmaJOO, Young-Hee; WOO, Jong-Chang; KIM, Chang-Ii et al.Microelectronic engineering. 2014, Vol 114, pp 1-6, issn 0167-9317, 6 p.Article

Fabrication of high-aspect-ratio (up to 10) one-dimensional organic/inorganic hybrid nanogratings via holographic lithographyJIE LI; SHU YANG.Microelectronic engineering. 2014, Vol 128, pp 7-11, issn 0167-9317, 5 p.Article

Growth assay of individual pollen tubes arrayed by microchannel deviceHORADE, Mitsuhiro; YANAGISAWA, Naoki; MIZUTA, Yoko et al.Microelectronic engineering. 2014, Vol 118, pp 25-28, issn 0167-9317, 4 p.Article

Hierarchical fabrication of TiO₂ nanotubes on 3-D microstructures for enhanced dye-sensitized solar cell photoanode for seamless microsystems integrationDAWAN, Fareed; MORAMPUDI, Niteesh; YOONYOUNG JIN et al.Microelectronic engineering. 2014, Vol 114, pp 105-111, issn 0167-9317, 7 p.Article

High-fidelity replica molding for large-area PMMA 3D nanostructures with high performance surface-enhanced Raman scattering and hydrophobicityJINHE WANG; WEIMIN ZHOU; JING ZHANG et al.Microelectronic engineering. 2014, Vol 115, pp 2-5, issn 0167-9317, 4 p.Article

Mechanical properties of surface modified silica low- k thin filmsMHAISAGAR, Yogesh S; JOSHI, Bhavana N; MAHAJAN, Ashok M et al.Microelectronic engineering. 2014, Vol 114, pp 112-116, issn 0167-9317, 5 p.Article

Organic solvent-free water-developable sugar resist material derived from biomass in green lithographyTAKEI, Satoshi; OSHIMA, Akihiro; ICHIKAWA, Takumi et al.Microelectronic engineering. 2014, Vol 122, pp 70-76, issn 0167-9317, 7 p.Article

Physical mechanism responsible for degradation of organic light-emitting diodesYOUBONG LIM; DONGHEE YOON; HOONHEE KIM et al.Microelectronic engineering. 2014, Vol 129, pp 21-23, issn 0167-9317, 3 p.Article

Quantitative evaluation of the depletion efficiency of nanofractures generated by nanoparticle-assisted junction gap breakdown for protein concentrationCHIANG, Pei-Ju; KUO, Chen-Chi; ZAMAY, Tatyana N et al.Microelectronic engineering. 2014, Vol 115, pp 39-45, issn 0167-9317, 7 p.Article

Rapid fabrication of semiellipsoid microlens using thermal reflow with two different photoresistsLIAN, Zhen-Jie; HUNG, Shih-Yu; SHEN, Ming-Ho et al.Microelectronic engineering. 2014, Vol 115, pp 46-50, issn 0167-9317, 5 p.Article

Structural, morphological and ac conductivity study of PrFe_0.5Ni_0.5O₃ thin filmMIR, Feroz A.Microelectronic engineering. 2014, Vol 122, pp 59-63, issn 0167-9317, 5 p.Article

Study on dissolution behavior of polymer-bound and polymer-blended photo acid generator (PAG) resists by using quartz crystal microbalance (QCM) methodYAMAMOTO, Hiroki; KOZAWA, Takahiro; TAGAWA, Seiichi et al.Microelectronic engineering. 2014, Vol 129, pp 65-69, issn 0167-9317, 5 p.Article

Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distributionHAIYONG CAO; TAO HANG; HUIQIN LING et al.Microelectronic engineering. 2014, Vol 116, pp 1-5, issn 0167-9317, 5 p.Article

Sub-10 nm patterning by focused He-ion beam milling for fabrication of downscaled graphene nano devicesKALHOR, Nima; BODEN, Stuart A; MIZUTA, Hiroshi et al.Microelectronic engineering. 2014, Vol 114, pp 70-77, issn 0167-9317, 8 p.Article

Phase-shift lithography for sub-wavelength patterns of varying aspect ratiosKLEMM, Angeline; LYLE, Andrew; KLEIN, Todd et al.Microelectronic engineering. 2014, Vol 130, pp 57-61, issn 0167-9317, 5 p.Article

Alternative semiconductor integration in Si microelectronics: materials, techniques & applications (Selected papers from the E-MRS 2013 Fall Meeting, Symposium A)SCHROEDER, Thomas; CAPELLINI, Giovanni; LOO, Roger et al.Microelectronic engineering. 2014, Vol 125, issn 0167-9317, 94 p.Conference Proceedings

Diamond nanoprobes for electrical probing of nanoelectronics device structuresHANTSCHEL, T; CLARYSSE, T; VANDERVORST, W et al.Microelectronic engineering. 2014, Vol 121, pp 19-23, issn 0167-9317, 5 p.Article

Fabrication of TiO₂ micro-structures by cathodic depositionMARK CHANG, Tso-Fu; SATO, Tatsuo; SONE, Masato et al.Microelectronic engineering. 2014, Vol 121, pp 80-82, issn 0167-9317, 3 p.Article

Single-spot e-beam lithography for defining large arrays of nano-holesHØJLUND-NIELSEN, Emil; GREIBE, Tine; ASGER MORTENSEN, N et al.Microelectronic engineering. 2014, Vol 121, pp 104-107, issn 0167-9317, 4 p.Article

Micro/Nano Biotechnologies and Systems 2013GREEN, Nicolas G; GADEGAARD, Nikolaj.Microelectronic engineering. 2014, Vol 124, issn 0167-9317, 100 p.Serial Issue