Confinement Effects on Evolution of Intermetallic Compounds During Metallurgical Joint FormationPARK, M. S; GIBBONS, S. L; ARROYAVE, R et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2510-2520, issn 0361-5235, 11 p.Article

Defects and Resistive Switching of Zinc Oxide Nanorods with Copper Addition Grown by Hydrothermal MethodYUNFENG LAI; YUZHU WANG; SHUYING CHENG et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2676-2682, issn 0361-5235, 7 p.Article

Effects of Laser Excitation and Temperature on Ag/GaSe_0.5S_0.5/C Microwave FiltersQASRAWI, A. F; KHANFAR, H. K.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3121-3127, issn 0361-5235, 7 p.Article

Effects of Reaction Conditions on the Properties of Spherical Silver Powders Synthesized by Reduction of an Organometallic CompoundCHIANG, Ying-Jung; WANG, Sea-Fue; LU, Chun-An et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3397-3403, issn 0361-5235, 7 p.Article

Electromagnetic Properties and Impedance Matching Effect of Flaky Fe-Si-Al/Co₂Z Ferrite CompositeQIFAN LI; ZEKUN FENG; SHUOQING YAN et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3688-3694, issn 0361-5235, 7 p.Article

Enhanced Thermoelectric Properties of BiCuSeO/Polyaniline CompositesBIN ZHENG; YAOCHUN LIU; BIN ZHAN et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3695-3700, issn 0361-5235, 6 p.Article

Enhancing the Thermoelectric Properties of Ca₃Co₄O₉ Thin Films by the Addition of a Nanoscale NbN_x Second PhaseCHUNHUI ZHU; ZHUANGZHI LI; HEPING AN et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3666-3671, issn 0361-5235, 6 p.Article

Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature ApplicationLEE, Jong-Bum; AW, Jie-Li; RHEE, Min-Woo et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3317-3323, issn 0361-5235, 7 p.Article

High Mobility and Stability of Thin-Film Transistors Using Silicon-Doped Amorphous Indium Tin Oxide SemiconductorsSEO, T. W; KIM, Hyun-Suk; LEE, Kwang-Ho et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3177-3183, issn 0361-5235, 7 p.Article

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil PrintingZIYU LIU; JIAN CAI; QIAN WANG et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3341-3350, issn 0361-5235, 10 p.Article

Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with Weak OxideSU, Chien-Hao; HAO CHEN; LEE, Hsin-Yi et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3290-3295, issn 0361-5235, 6 p.Article

Monodisperse and 1D Cross-Linked Multi-branched Cu@Ni Core―Shell Particles Synthesized by Chemical ReductionHAILONG HU; DIAN ZHANG; WEIMING YU et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2548-2552, issn 0361-5235, 5 p.Article

Orientation-Dependent Performance Analysis of Benzene/ Graphene-Based Single-Electron TransistorsSRIVASTAVA, Anurag; KAUR, Kamalpreet; SHARMA, Ritu et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3449-3457, issn 0361-5235, 9 p.Article

Photocurrent Spectroscopic Study of Temperature-Dependent Photoresponse and Valence-Band Splitting in MnAl₂S₄ LayersHONG, K. J; JEONG, T. S; YOUN, C. J et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3092-3097, issn 0361-5235, 6 p.Article

Preparation of LaOBr:Er³⁺ Up-conversion Luminescent Nanobelts by Electrospinning Then BrominationWENWEN MA; XIANGTING DONG; JINXIAN WANG et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3701-3707, issn 0361-5235, 7 p.Article

Secondary Electron Intensity Contrast Imaging and Friction Properties of Micromechanically Cleaved Graphene Layers on Insulating SubstratesGUPTA, S; HEINTZMAN, E; JASINSKI, J et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3458-3469, issn 0361-5235, 12 p.Article

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its InterconnectionMIYAUCHI, Kazuhiro; YAMASHITA, Yukihiko; SUZUKI, Naoya et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3411-3422, issn 0361-5235, 12 p.Article

Sn-Zn/Ni-Co Interfacial Reactions at 250°CLIN, Hsin-Fu; CHANG, Ya-Chun; CHEN, Chih-Chi et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3333-3340, issn 0361-5235, 8 p.Article

Strain Distribution Across HVPE GaN Layer Grown on Large Square-Patterned Template Studied by Micro-Raman ScatteringYANPING SUI; BIN WANG; ZHIDE ZHAO et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2715-2722, issn 0361-5235, 8 p.Article

Synthesis and Electrochemical Properties of LiNi_1/3Co_1/3Mn_1/3O₂ Cathode MaterialLIN LI; CHUANQI FENG; HAO ZHENG et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3508-3513, issn 0361-5235, 6 p.Article

Thermoelectric Properties of CdTe_1-xCl_x Material Prepared by Spark Plasma Sintering MethodMENGLEI WU; YUKUN XIAO; ZHENGPING FU et al.Journal of electronic materials. 2014, Vol 43, Num 9, pp 3087-3091, issn 0361-5235, 5 p.Article

A Method for Quantification of the Effects of Size and Geometry on the Microstructure of Miniature InterconnectsHUA XIONG; ZHIHENG HUANG; CONWAY, Paul et al.Journal of electronic materials. 2014, Vol 43, Num 2, pp 618-629, issn 0361-5235, 12 p.Article

An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA PackagingCHEN, K. M; WU, C. Y; WANG, C. H et al.Journal of electronic materials. 2014, Vol 43, Num 11, pp 4229-4240, issn 0361-5235, 12 p.Article

Carbon-Incorporated Amorphous Indium Zinc Oxide Thin-Film TransistorsPARTHIBAN, S; PARK, K; KIM, H.-J et al.Journal of electronic materials. 2014, Vol 43, Num 11, pp 4224-4228, issn 0361-5235, 5 p.Article

Characterization and Electrical Properties of Al-Doped Cu(In,Ga)Se₂ Semiconductors with Various Cu ContentsMONSEFI, Mehrdad; KUO, Dong-Hau.Journal of electronic materials. 2014, Vol 43, Num 4, pp 1214-1218, issn 0361-5235, 5 p.Article