A New Power-Ground Plane Modeling Method With Rectangle and Triangle SegmentationCHUNTIAN LIU; JUNFA MAO; MIN TANG et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 639-646, issn 1521-3323, 8 p.Article

An Integration Technology for RF and Microwave Circuits Based on Interconnect ProgrammingRABIEIRAD, Laleh; MARTINEZ, Edgar J; MOHAMMADI, Saeed et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 362-369, issn 1521-3323, 8 p.Article

Analysis of Shielded Electromagnetic Bandgap Structures Using Multiconductor Transmission-Line TheoryPAYANDEHJOO, Kasra; TAVALLAEE, Amirali; ABHARI, Ramesh et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 236-245, issn 1521-3323, 10 p.Article

Collimated Aerosol Beam Deposition: Sub-5-μm Resolution of Printed Actives and PassivesSCHULZ, D. L; HOEY, J. M; THOMPSON, D et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 421-427, issn 1521-3323, 7 p.Article

Design and Modelling of Miniaturized Bandgap Structure for Wideband GHz-Noise Suppression Based on LTCC TechnologyHUANG, Yu-Wen; WANG, Ting-Kuang; WU, Tzong-Lin et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 630-638, issn 1521-3323, 9 p.Article

Electronic Packaging Materials for Extreme, Low Temperature, Fatigue EnvironmentsSHAPIRO, Andrew A; TUDRYN, Carissa; SCHATZEL, Donald et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 408-420, issn 1521-3323, 13 p.Article

Integrated Microfluidic Cooling and Interconnects for 2D and 3D ChipsBING DANG; BAKIR, Muhannad S; DEEPAK CHANDRA SEKAR et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 79-87, issn 1521-3323, 9 p.Article

Sensitivity Analysis of Lossy Nonuniform Multiconductor Transmission Lines With Nonlinear TerminationsLEI DOU; JIAO DOU.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 492-497, issn 1521-3323, 6 p.Article

Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered DielectricsBOPING WU; TSANG, Leung.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 510-516, issn 1521-3323, 7 p.Article

Tapered Through-Silicon-Via Interconnects for Wafer-Level Packaging of Sensor DevicesLEIB, Jüergen; BIECK, Florian; WILKE, Ralph et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 713-721, issn 1521-3323, 9 p.Article

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer TechnologyZOSCHKE, Kai; FISCHER, Thorsten; TÖPPER, Michael et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 398-407, issn 1521-3323, 10 p.Article

Wideband Circuit Model for Planar EBG StructuresMOHAJER-IRAVANI, Baharak; RAMAHI, Omar M.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 169-179, issn 1521-3323, 11 p.Article

A Homogeneous Electrically Conductive Silver PasteJIANGUO LIU; YU CAO; XIAOYE WANG et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 899-903, issn 1521-3323, 5 p.Article

A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach NetworksCHANDRAPPAN, Jayakrishnan; ZHANG JING; NG RUI JIE et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 868-875, issn 1521-3323, 8 p.Article

Guard Trace Design for Improvement on Transient Waveforms and Eye Diagrams of Serpentine Delay LinesSHIUE, Guang-Hwa; CHAO, Chia-Ying; WU, Ruey-Beei et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 1051-1060, issn 1521-3323, 10 p.Article

Parameterized Model Order Reduction of Electromagnetic Systems Using Multiorder ArnoldiAHMADLOO, Majid; DOUNAVIS, Anestis.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 1012-1020, issn 1521-3323, 9 p.Article

A Cost-Effective MEMS Cavity Packaging Technology for Mass Production : Packaging for micro/nano-scale systemsJUN SU LEE; FAHEEM, Faheem F; JEONG TAE KIM et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 453-460, issn 1521-3323, 8 p.Article

Advanced Modeling and Accurate Characterization of a 16 Gb/s Memory Interface : High-speed I/O channelsBEYENE, Wendemagegnehu T; MADDEN, Chris; PEREGO, Rich et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 306-327, issn 1521-3323, 22 p.Article

Characterization of Electrical Transitions Using Transmission Line MeasurementsTORRES-TORRES, Reydezel; HERNANDEZ-SOSA, Gaudencio; ROMO, Gerardo et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 45-52, issn 1521-3323, 8 p.Article

Electromagnetic Band Gap Synthesis Using Genetic Algorithms for Mixed Signal ApplicationsTAE HONG KIM; SWAMINATHAN, Madhavan; EGE ENGIN, Arif et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 13-25, issn 1521-3323, 13 p.Article

Enrichment of Package Antenna Approach With Dual Feeds, Guard Ring, and Fences of ViasZHANG, Y. P.IEEE transactions on advanced packaging. 2009, Vol 32, Num 3, pp 612-618, issn 1521-3323, 7 p.Article

Is 25 Gb/s On-Board Signaling Viable? : High-speed I/O channelsKAM, Dong G; RITTER, Mark B; HOUGHAM, Gareth et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 328-344, issn 1521-3323, 17 p.Article

Microcantilever Probe Cards With Silicon and Nickel Composite Micromachining Technique for Wafer-Level Burn-In Testing : Packaging for micro/nano-scale systemsFEI WANG; XINXIN LI; SONGLIN FENG et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 468-477, issn 1521-3323, 10 p.Article

On-Die Power Supply Noise Measurement Techniques : High-speed I/O channelsALON, Elad; ABRAMZON, Valentin; NEZAMFAR, Bita et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 248-259, issn 1521-3323, 12 p.Article

Passive Macromodeling of Lossy Multiconductor Transmission Lines Based on the Method of CharacteristicsDOUNAVIS, Anestis; POTHIWALA, Vrajesh A; BEYGI, Amir et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 184-198, issn 1521-3323, 15 p.Article