A Novel Nitric Acid Etchant and Its Application in Manufacturing Fine Lines for PCBsGUOYUN ZHOU; WEI HE; SHOUXU WANG et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 1, pp 25-30, issn 1521-334X, 6 p.Article

Environmental Influence on Sn Whisker Growth : Tin whiskersDIMITROVSKA, Aleksandra; KOVACEVIC, Radovan.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 193-197, issn 1521-334X, 5 p.Article

Study of 6 mil Cu Wire Replacing 10―15 mil Al Wire for Maximizing Wire-Bonding Process on Power ICsYINGWEI JIANG; RONGLU SUN; YOUMIN YU et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 2, pp 135-142, issn 1521-334X, 8 p.Article

A Neural-Network Approach for Defect Recognition in TFT-LCD Photolithography ProcessCHEN, Li-Fei; SU, Chao-Ton; CHEN, Meng-Heng et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 1, pp 1-8, issn 1521-334X, 8 p.Article

An Effective Scheduling Approach for Maximizing Polyimide Printing Weighted Throughput in Cell Assembly FactoriesCHUNG, S. H; TAI, Y. T; PEARN, W. L et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 185-197, issn 1521-334X, 13 p.Article

Application of a Genetic Algorithm to the Design Optimization of a Multilayer Probe Card for Wafer-Level TestingLIU, De-Shin; SHIH, Meng-Kae; CHANG, Chi-Ming et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 1, pp 49-58, issn 1521-334X, 10 p.Article

Parameter Modeling for Wafer Probe TestYONG LIU; LUK, Timwah; IRVING, Scott et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 2, pp 81-88, issn 1521-334X, 8 p.Article

Statistical Approach for Cycle Time Estimation in Semiconductor Packaging FactoriesPEAM, W. L; TAI, Yu-Ting; LEE, J. H et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 198-205, issn 1521-334X, 8 p.Article

Flexible Electronics: Thin Silicon Die on Flexible SubstratesTAN ZHANG; ZHENWEI HOU; WAYNE JOHNSON, R et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 291-300, issn 1521-334X, 10 p.Article

Thermal-Mechanical Process Simulation of an Advanced NCF TechnologyCHENG, Hsien-Chie; HWANG, Wan-Yu; KUO SHU KAO et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 301-310, issn 1521-334X, 10 p.Article

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip InterconnectionLEE, Kiwon; KIM, Hyoung-Joon; YIM, Myung-Jin et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 241-247, issn 1521-334X, 7 p.Article

An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit BoardsTICK, Timo; JANTUNEN, Heli.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 2, pp 168-173, issn 1521-334X, 6 p.Article

Automatic Microassembly Using Visual Servo ControlLIDAI WANG; MILLS, James K; CLEGHOM, William L et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 316-325, issn 1521-334X, 10 p.Article

Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit BoardsLINCOLN, John D; SHAPIRO, Andrew A; EARTHMAN, James C et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 3, pp 211-220, issn 1521-334X, 10 p.Article

Dynamic Characteristics of a New Jetting Dispenser Driven by Piezostack ActuatorQUOC HUNG NGUYEN; HAN, Young-Min; CHOI, Seung-Bok et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 3, pp 248-259, issn 1521-334X, 12 p.Article

Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable ElectronicsLADANI, Leila J; DASGUPTA, Abhijit; CARDOSO, Idelcio et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 51-60, issn 1521-334X, 10 p.Article

Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering ProcessWU, S. P; YUNG, K. C; XU, L. H et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 291-296, issn 1521-334X, 6 p.Article

Study on Contamination Control for Yield Enhancement in the Manufacturing Line of Cellular Phone ModulesNOH, Kwang-Chul; LEE, Hyeon-Cheol; KIM, Dae-Young et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 2, pp 143-149, issn 1521-334X, 7 p.Article

Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without UnderfillAGGARWAL, Ankur O; MARKONDEYA RAJ, P; LEE, Baik-Woo et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 341-354, issn 1521-334X, 14 p.Article

Automated solder inspection technique for BGA-mounted substrates by means of oblique computed tomographyTERAMOTO, Atsushi; MURAKOSHI, Takayuki; TSUZAKA, Masatoshi et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 285-292, issn 1521-334X, 8 p.Article

Effects of minor elements in Cu leadframe on whisker initiation from electrodeposited Sn/Cu coatingKATO, Takahiko; AKAHOSHI, Haruo; NAKAMURA, Masato et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 258-269, issn 1521-334X, 12 p.Article

Investigation into the release behavior and releasability evaluation of the encapsulation of semiconductor packagesYOSHII, Masaki; SUZUKI, Naoya.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 3, pp 228-235, issn 1521-334X, 8 p.Article

Optimizing embedded passive content in printed circuit boardsTHOMPSON ETIENNE, Bevin; SANDBOM, Peter A.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 246-257, issn 1521-334X, 12 p.Article

A statistical study of Sn whisker population and growth during elevated temperature and humidity tests : Special section on tin whiskersPENG SU; HOWELL, Jim; CHOPIN, Sheila et al.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 4, pp 246-251, issn 1521-334X, 6 p.Article

Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packagingLIE LIU; SUNG YI; LIN SENG ONG et al.IEEE transactions on electronics packaging manufacturing. 2005, Vol 28, Num 4, pp 355-363, issn 1521-334X, 9 p.Article