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Results 1 to 25 of 824

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Quantification of grain boundary equilibrium segregation by NanoSIMS analysis of bulk samplesCHRISTIEN, F; DOWNING, C; MOORE, K. L et al.Surface and interface analysis. 2012, Vol 44, Num 3, pp 377-387, issn 0142-2421, 11 p.Article

Crystallographic aspects of intergranular failure of archaeological silver artefactsLEJCEK, Pavel; GÄRTNEROVA, Viera; JÄGER, Aleš et al.Surface and interface analysis. 2011, Vol 43, Num 8, pp 1128-1133, issn 0142-2421, 6 p.Article

Positron annihilation in vacancies at grain boundaries in metalsKURIPLACH, J; MELIKHOVA, O; HOU, M et al.Applied surface science. 2008, Vol 255, Num 1, pp 128-131, issn 0169-4332, 4 p.Article

Co-energy of surface and grain boundary in Ag filmWEI, Xiu-Mei; ZHANG, Jian-Min; XU, Ke-Wei et al.Applied surface science. 2007, Vol 253, Num 12, pp 5214-5217, issn 0169-4332, 4 p.Article

Coincidences of hypercubic lattices in 4 dimensionsZEINER, Peter.Zeitschrift für Kristallographie. 2006, Vol 221, Num 2, pp 105-114, issn 0044-2968, 10 p.Article

Cooperative grain boundary sliding in nanocrystalline materialsSERGUEEVA, A. V; MARA, N. A; KRASILNIKOV, N. A et al.Philosophical magazine (2003. Print). 2006, Vol 86, Num 36, pp 5797-5804, issn 1478-6435, 8 p.Article

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substratesDARIAVACH, N; CALLAHAN, P; LIANG, J et al.Journal of electronic materials. 2006, Vol 35, Num 7, pp 1581-1592, issn 0361-5235, 12 p.Article

Preferential penetration path of gallium into grain boundary in practical aluminium alloyKOBAYASHI, M; TODA, H; UESUGI, K et al.Philosophical magazine (2003. Print). 2006, Vol 86, Num 28, pp 4351-4366, issn 1478-6435, 16 p.Article

The structure and ordering of ε-MnO2KIM, Chang-Hoon; AKASE, Zentaro; LICHUN ZHANG et al.Journal of solid state chemistry (Print). 2006, Vol 179, Num 3, pp 753-774, issn 0022-4596, 22 p.Article

Phase field simulations of morphological evolution and growth kinetics of solder reaction products : Phase stability, formation and transformation of electronic materialsHONG, K. K; HUH, J. Y.Journal of electronic materials. 2006, Vol 35, Num 1, pp 56-64, issn 0361-5235, 9 p.Conference Paper

Stress and strain around grain-boundary dislocations measured by high-resolution electron microscopyHYTCH, M. J; PUTAUX, J.-L; THIBAULT, J et al.Philosophical magazine (2003. Print). 2006, Vol 86, Num 29-31, pp 4641-4656, issn 1478-6435, 16 p.Article

Metrics, measures, and parametrizations for grain boundaries : a dialogCAHN, John W; TAYLOR, Jean E.Journal of materials science. 2006, Vol 41, Num 23, pp 7669-7674, issn 0022-2461, 6 p.Conference Paper

Coincidence-site lattices as rational approximants to irrational twinsRANGANATHAN, S; SRIVASTAVA, A. K; LORD, E. A et al.Journal of materials science. 2006, Vol 41, Num 23, pp 7696-7703, issn 0022-2461, 8 p.Conference Paper

Special grain boundaries based on local symmetriesBENDERSKY, L. A; CAHN, J. W.Journal of materials science. 2006, Vol 41, Num 23, pp 7683-7690, issn 0022-2461, 8 p.Conference Paper

Twin quintuplet surfaces in CVD diamondSHECHTMAN, Dan.Journal of materials science. 2006, Vol 41, Num 23, pp 7720-7724, issn 0022-2461, 5 p.Conference Paper

Zincblende and wurtzite phases in InN epilayers and their respective band transitionsSPECHT, P; HO, J. C; XU, X et al.Journal of crystal growth. 2006, Vol 288, Num 2, pp 225-229, issn 0022-0248, 5 p.Conference Paper

(001) silicon surfacial grain boundaries obtained by direct wafer bonding process : accurate control of the structure before bondingROUSSEAU, K; EYMERY, J; FOURNEL, F et al.Philosophical magazine (2003. Print). 2005, Vol 85, Num 21, pp 2415-2448, issn 1478-6435, 34 p.Article

On equilibrium conditions at junctions of anisotropic interfaces : Interface science sectionMORAWIEC, A.Journal of materials science. 2005, Vol 40, Num 11, pp 2803-2806, issn 0022-2461, 4 p.Article

On the design of controlled tricrystal specimens for the systematic investigation of static grain boundary triple junction properties : Interface science sectionKREMER, R; NARAYANAN, R; SHEKHAR, S et al.Journal of materials science. 2005, Vol 40, Num 11, pp 2795-2802, issn 0022-2461, 8 p.Article

The influence of annealing twinning on microstructure evolution : Grain boundary and interface engineeringRANDLE, V.Journal of materials science. 2005, Vol 40, Num 4, pp 853-859, issn 0022-2461, 7 p.Article

Thermal grain boundary grooving with anisotropic surface free energy in three dimensionsZHANG, W; GLADWELL, I.Journal of crystal growth. 2005, Vol 277, Num 1-4, pp 608-622, issn 0022-0248, 15 p.Article

Direct evidence of dopant-enhanced grain-boundary sliding in yttria- stabilized zirconia bicrystalsNAKAMURA, Atsutomo; SHIBATA, Naoya; MORISHIGE, Nobusato et al.Journal of the American Ceramic Society. 2005, Vol 88, Num 4, pp 938-942, issn 0002-7820, 5 p.Article

First-principles examination of the (1012) twin boundary in hcp metalsMORRIS, James R; YIYING YE; YOO, Man H et al.Philosophical magazine (2003. Print). 2005, Vol 85, Num 2-3, pp 233-238, issn 1478-6435, 6 p.Conference Paper

HRTEM study on grain boundary atomic structures related to the sliding behavior in alumina bicrystalsMATSUNAGA, K; NISHIMURA, H; HANYU, S et al.Applied surface science. 2005, Vol 241, Num 1-2, pp 75-79, issn 0169-4332, 5 p.Conference Paper

Comparison of the intergranular segregation for eight dilute binary metallic systems in the Σ11' {332} tilt grain boundaryDUPARC, O. Hardouin; LARERE, A; LEZZAR, B et al.Journal of materials science. 2005, Vol 40, Num 12, pp 3169-3176, issn 0022-2461, 8 p.Conference Paper

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