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Results 1 to 25 of 811

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Thermal characterization of liquids and pastes using the flash techniqueBLUMM, J; LINDEMANN, A; MIN, S et al.Thermochimica acta. 2007, Vol 455, Num 1-2, pp 26-29, issn 0040-6031, 4 p.Conference Paper

The linear thermal expansion and the thermal diffusivity measurements for near-stoichiometric (U, Ce)O2 solid solutionsKIM, Dong-Joo; KIM, Yong-Soo; KIM, Si-Hyung et al.Thermochimica acta. 2006, Vol 441, Num 2, pp 127-131, issn 0040-6031, 5 p.Article

Thermal analysis for transient radiative cooling of a conducting semitransparent layer of ceramic in high-temperature applicationsSADOOGHI, Parham; AGHANAJAFI, Cyrus.Infrared physics & technology. 2006, Vol 47, Num 3, pp 278-285, issn 1350-4495, 8 p.Article

Thermal characterization of a multilayer material through the flash methodPERRY, I; REMY, B; MAILLET, D et al.Journal of thermophysics and heat transfer. 2006, Vol 20, Num 2, pp 231-237, issn 0887-8722, 7 p.Article

Influence of interfacial layers on resonance phonon transportSYRKIN, E. S; MINAEV, P. A; SHKORBATOV, A. G et al.Microelectronic engineering. 2005, Vol 81, Num 2-4, pp 503-509, issn 0167-9317, 7 p.Article

Thermal conductivity modeling of periodic two-dimensional nanocompositesRONGGUI YANG; GANG CHEN.Physical review B. Condensed matter and materials physics. 2004, Vol 69, Num 19, pp 195316.1-195316.10, issn 1098-0121Article

Hot strip method: application to thermal characterisation of orthotropic mediaGOBBE, Claire; ISERNA, Sébastien; LADEVIE, Bruno et al.International journal of thermal sciences. 2004, Vol 43, Num 10, pp 951-958, issn 1290-0729, 8 p.Article

Simultaneous determination of thermophysical properties using a thermistor, Part 2: ExperimentCHERIF QUID LAHOUCINE; SAKASHITA, Hiroto; KUMADA, Toshiaki et al.Journal of thermophysics and heat transfer. 2004, Vol 18, Num 3, pp 302-308, issn 0887-8722, 7 p.Article

The role of structure on the thermal properties of graphitic foamsKLETT, J. W; MCMILLAN, A. D; GALLEGO, N. C et al.Journal of materials science. 2004, Vol 39, Num 11, pp 3659-3676, issn 0022-2461, 18 p.Article

Two-dimensional transient thermal analysis of diamond/Si structures heated by a pulsed circular Gaussian laser beamMI, X. B; GAO, H. D; ZHANG, S. Y et al.International journal of heat and mass transfer. 2004, Vol 47, Num 10-11, pp 2481-2485, issn 0017-9310, 5 p.Article

Lattice thermal conductivity crossovers in semiconductor nanowiresMINGO, N; BROIDO, D. A.Physical review letters. 2004, Vol 93, Num 24, pp 246106.1-246106.4, issn 0031-9007Article

Possible mechanism for glass-like thermal conductivities in crystals with off-center atomsBRIDGES, F; DOWNWARD, L.Physical review B. Condensed matter and materials physics. 2004, Vol 70, Num 14, pp 140201.1-140201.4, issn 1098-0121Article

Equilibrium molecular dynamics study of phonon thermal transport in nanomaterialsZHANRONG ZHONG; XINWEI WANG; JUN XU et al.Numerical heat transfer. Part B, fundamentals. 2004, Vol 46, Num 5, pp 429-446, issn 1040-7790, 18 p.Article

Submicron heat transport model in silicon accounting for phonon dispersion and polarizationNARUMANCHI, Sreekant V. J; MURTHY, Jayathi Y; AMON, Cristina H et al.Journal of heat transfer. 2004, Vol 126, Num 6, pp 946-955, issn 0022-1481, 10 p.Article

A self-similarity model for effective thermal conductivity of porous mediaYONGTING MA; BOMING YU; DUANMING ZHANG et al.Journal of physics. D, Applied physics (Print). 2003, Vol 36, Num 17, pp 2157-2164, issn 0022-3727, 8 p.Article

An analytical solution method for composite layer diffusion problems with an application in metallurgyFREDMAN, T. P.Heat and mass transfer. 2003, Vol 39, Num 4, pp 285-295, issn 0947-7411, 11 p.Article

Improving thermal conductivity of Sm2O3-doped AlN ceramics by changing sintering conditionsXINRUI XU; HANRUI ZHUANG; WENLAN LI et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2003, Vol 342, Num 1-2, pp 104-108, issn 0921-5093, 5 p.Article

Low-temperature thermal conductivity of CaB6 and EuB6GIANNO, K; SOLOGUBENKO, A. V; OTT, H. R et al.Journal of physics. Condensed matter (Print). 2003, Vol 15, Num 40, pp 6739-6748, issn 0953-8984, 10 p.Article

Measuring method of three thermophysical parameters of solids by a thermal probe with instantaneous point contact: Measuring principleTAKAHASHI, Ichiro; EMORI, Masaaki.Heat transfer, Asian research. 2003, Vol 32, Num 3, pp 191-201, issn 1099-2871, 11 p.Article

Thermal properties of thiourea studied using photopyroelectric techniquePREETHY MENON, C; PHILIP, J.Ferroelectrics (Print). 2003, Vol 287, pp 63-70, issn 0015-0193, 8 p.Article

Universal behavior of spin-mediated energy transport in S = 1/2 chain cuprates: BaCu2Si2O7 as an exampleSOLOGUBENKO, A. V; OTT, H. R; DHALENNE, G et al.Europhysics letters (Print). 2003, Vol 62, Num 4, pp 540-546, issn 0295-5075, 7 p.Article

Microthermal analysis of heat conduction in silicon nitridesJIPING YE; OKADA, Akira.Journal of the American Ceramic Society. 2003, Vol 86, Num 8, pp 1365-1369, issn 0002-7820, 5 p.Article

Analytical investigations for heat conduction problems in anisotropic thin-layer media with embedded heat sourcesHSIEH, Ming-Hsien; MA, Chien-Ching.International journal of heat and mass transfer. 2002, Vol 45, Num 20, pp 4117-4132, issn 0017-9310Article

Mapping nanometre-scale temperature gradients in patterned cobalt-nickel silicide filmsCANNAERTS, M; CHAMIRIAN, O; MAEX, K et al.Nanotechnology (Bristol. Print). 2002, Vol 13, Num 2, pp 149-152, issn 0957-4484Article

On the effects of secondary phase on thermal conductivity of AlN ceramic substrates using a microstructural modeling approachBOEY, F; TOK, A. I. Y; LAM, Y. C et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2002, Vol 335, Num 1-2, pp 281-289, issn 0921-5093Article

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