An AFM contribution to the understanding of surface effects caused by ageing and cleaning on acrylic glass. The Shadows by Lourdes Castro, a case studyDE SA, M. H; FERREIRA, Joana L; MELO, M. J et al.Surface and interface analysis. 2011, Vol 43, Num 8, pp 1165-1170, issn 0142-2421, 6 p.Article

Low temperature ageing of silicas Gasil-I and TK800COLLINS, K. E; GONCALVES, M. C; ROMERO, R. B et al.Applied surface science. 2008, Vol 254, Num 13, pp 4029-4035, issn 0169-4332, 7 p.Article

XPS study of five fluorinated compounds deposited on calcarenite stone Part II. Aged samplesTORRISI, Alberto.Applied surface science. 2008, Vol 254, Num 22, pp 7127-7136, issn 0169-4332, 10 p.Article

Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrateNISHIKAWA, Hiroshi; JIN YU PIAO; TAKEMOTO, Tadashi et al.Journal of electronic materials. 2006, Vol 35, Num 5, pp 1127-1132, issn 0361-5235, 6 p.Article

Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free soldersHUANG, M. L; LOEHER, T; MANESSIS, D et al.Journal of electronic materials. 2006, Vol 35, Num 1, pp 181-188, issn 0361-5235, 8 p.Article

Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal agingLIU, Chih-Yao; WANG, Moo-Chin; HON, Min-Hsiung et al.Journal of electronic materials. 2006, Vol 35, Num 5, pp 966-971, issn 0361-5235, 6 p.Article

Phase field simulations of morphological evolution and growth kinetics of solder reaction products : Phase stability, formation and transformation of electronic materialsHONG, K. K; HUH, J. Y.Journal of electronic materials. 2006, Vol 35, Num 1, pp 56-64, issn 0361-5235, 9 p.Conference Paper

Harmonic analysis of polarization hysteresis of aged PTZsSRILOMSAK, Sutham; SCHULZE, Walter A; PILGRIM, Steven M et al.Journal of the American Ceramic Society. 2005, Vol 88, Num 8, pp 2121-2125, issn 0002-7820, 5 p.Article

Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solderYU, Chung-Hee; EIM, Kyung-Seob; KIM, Hyung-Il et al.Journal of electronic materials. 2005, Vol 34, Num 2, pp 161-167, issn 0361-5235, 7 p.Article

Coarsening of spherical Cu particles in an α-Fe matrixMONZEN, Ryoichi; TAKADA, Kenichi; WATANABE, Chihiro et al.ISIJ international. 2004, Vol 44, Num 2, pp 442-444, issn 0915-1559, 3 p.Article

Determination of the rate of hardening of unsaturated polyesters by the measurement of the electric resistanceKALENDA, P.Pigment & resin technology. 2004, Vol 33, Num 1, pp 9-14, issn 0369-9420, 6 p.Article

Influence of the thermomechanical treatment on the microplastic behaviour of a wrought Al-Zn-Mg-Cu alloyADRIEN, J; MAIRE, E; ESTEVEZ, R et al.Acta materialia. 2004, Vol 52, Num 6, pp 1653-1661, issn 1359-6454, 9 p.Article

Interfacial segregation and influence of antiphase boundaries on rafting in a γ/γ' alloyCHEN, C. Y; STOBBS, W. M.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2004, Vol 35, Num 3, pp 733-740, issn 1073-5623, 8 p.Article

Mechanical strength of Sn-3.5Ag-based solders and related bondingsCHUANG, Chiang-Ming; SHIH, Po-Cheng; LIN, Kwang-Lung et al.Journal of electronic materials. 2004, Vol 33, Num 1, pp 1-6, issn 0361-5235, 6 p.Article

Microstructural evolution in the heat-affected zone of a friction stir weldFONDA, R. W; BINGERT, J. F.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2004, Vol 35, Num 5, pp 1487-1499, issn 1073-5623, 13 p.Article

Precipitation hardening in a 12%Cr-9%Ni-4%Mo-2%Cu stainless steelHÄTTESTRAND, Mats; NILSSON, Jan-Olof; STILLER, Krystyna et al.Acta materialia. 2004, Vol 52, Num 4, pp 1023-1037, issn 1359-6454, 15 p.Article

Study of chromium depletion by magnetic method in Ni-based alloysTAKAHASHI, S; SATO, Y; KAMADA, Y et al.Journal of magnetism and magnetic materials. 2004, Vol 269, Num 2, pp 139-149, issn 0304-8853, 11 p.Article

The effect of heat treatment on Mg₂Si coarsening in aluminum 6105 alloyUSTA, M; GLICKSMAN, M. E; WRIGHT, R. N et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2004, Vol 35, Num 2, pp 435-438, issn 1073-5623, 4 p.Article

DSC study of precipitation in an Al-Mg-Mn alloy microalloyed with CuSTARINK, M. J; DION, A.Thermochimica acta. 2004, Vol 417, Num 1, pp 5-11, issn 0040-6031, 7 p.Article

Hydrogen absorption of incoherent TiC particles in iron from environment at high temperaturesWEI, F. G; TSUZAKI, K.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2004, Vol 35, Num 10, pp 3155-3163, issn 1073-5623, 9 p.Article

Modelling of the microstructure and strength evolution in Al-Mg-Si alloys during multistage thermal processingMYHR, O. R; GRONG, Ø; FJAER, H. G et al.Acta materialia. 2004, Vol 52, Num 17, pp 4997-5008, issn 1359-6454, 12 p.Article

Ta-C micro-composite material formed by heat treatment of plasma carburized layerRAVEH, A; RUBINSHTEIN, A; WEISS, M et al.Thin solid films. 2004, Vol 466, Num 1-2, pp 151-157, issn 0040-6090, 7 p.Article

Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumpsWANG, S. J; KAO, H. J; LIU, C. Y et al.Journal of electronic materials. 2004, Vol 33, Num 10, pp 1130-1136, issn 0361-5235, 7 p.Conference Paper

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloysTELANG, A. U; BIELER, T. R; LUCAS, J. P et al.Journal of electronic materials. 2004, Vol 33, Num 12, pp 1412-1423, issn 0361-5235, 12 p.Conference Paper

Intermetallic phase detection in lead-free solders using synchrotron X-ray diffractionJACKSON, Gavin J; HUA LU; DURAIRAJ, Raj et al.Journal of electronic materials. 2004, Vol 33, Num 12, pp 1524-1529, issn 0361-5235, 6 p.Conference Paper