kw.\*:("ALLIAGE AG-CU")
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ELECTRODEPOSITION D'UN ALLIAGE D'ARGENT-CUIVRE A PARTIR D'UN ELECTROLYTE AUX THYOCIANATESVYACHESLAVOV PM; BURKAT GK; LOGINOVA OE et al.1975; ZASHCH. METALLOV; S.S.S.R.; DA. 1975; VOL. 11; NO 2; PP. 232-233; BIBL. 6 REF.Article
On the hierarchie of interfacial dislocation structure = Ueber die Hierarchie der GrenzflaechenversetzungsstrukturBALLUFFI, R.W; OLSON, G.B.Metallurgical transactions. A, Physical metallurgy and materials science. 1985, Vol 16, Num 4, pp 529-541, issn 0360-2133Article
Thermal and electrical properties of Ag-Au and Ag-Cu alloy tapes for metal stabilizers of oxide superconductorsFUJISHIRO, H; IKEBE, M; NOTO, K et al.Cryogenics (Guildford). 1993, Vol 33, Num 11, pp 1086-1090, issn 0011-2275Article
Backscattered electron imaging of dental amalgam = Formation d'images électroniques par rétrodiffusion d'amalgame dentaireSMITH, F. E; WILLIAMS, D. F; POND, R et al.Journal of materials science. 1987, Vol 22, Num 7, pp 2382-2386, issn 0022-2461Article