kw.\*:("ALUMINIUM COPPER SILICIDES")
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CONTACT RESISTANCE BEHAVIOR OF THE PD2 SI-AL CU SI SYSTEMSUGERMAN A; TSAI HJ; KRISTOFF JS et al.1982; JOURNAL OF ELECTRONIC MATERIALS; ISSN 0361-5235; USA; DA. 1982; VOL. 11; NO 5; PP. 943-955; BIBL. 4 REF.Article
THIN FILM METALLIZATION STUDIES AND DEVICE LIFETIME PREDICTION USING AL-SI AND AL-CU-SI CONDUCTOR TEST BARSDANSO KA; TULLOS L.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 4; PP. 513-527; BIBL. 26 REF.Article
