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AUGER ANALYSIS OF SURFACE FILMS ON AG3SNGRENGA HE; CARDEN JL; OKABE T et al.1975; J. BIOMED. MATER. RES.; U.S.A.; DA. 1975; VOL. 9; NO 2; PP. 207-211; BIBL. 7 REF.Article

Evolution of nano-Ag3Sn particle formation on Cu-Sn intermetallic compounds of Sn3:5Ag0.5Cu composite solder/Cu during solderingTSAO, L. C.Journal of alloys and compounds. 2011, Vol 509, Num 5, pp 2326-2333, issn 0925-8388, 8 p.Article

Dépôts électrolytiques d'alliages argent-étain par courants pulsés = Electrodeposition of Ag-Sn alloys by pulsed currentsMORTIER, F; SUTTER, B; VASSEUR, G et al.CETIM informations. 1983, Num 80-81, pp 80-85, issn 0399-0001Article

Interfacial Reactions in Sn-Ag/Co CouplesCHEN, Sinn-Wen; CHEN, Tung-Kai; CHANG, Jui-Shen et al.Journal of electronic materials. 2014, Vol 43, Num 2, pp 636-639, issn 0361-5235, 4 p.Article

Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free soldersKANTARCIOGLU, A; KALAY, Y. E.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 593, pp 79-84, issn 0921-5093, 6 p.Article

Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based SoldersXU ZHAO; SAKA, Masumi; MURAOKA, Mikio et al.Journal of electronic materials. 2014, Vol 43, Num 11, pp 4179-4185, issn 0361-5235, 7 p.Article

The Role of Silver in Mitigation of Whisker Formation on Thin Tin FilmsSTEIN, J; REHM, S; WELZEL, U et al.Journal of electronic materials. 2014, Vol 43, Num 11, pp 4308-4316, issn 0361-5235, 9 p.Article

Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn―58Bi solder jointISMATHULLAKHAN, Shafiq; LAU, Hungyin; CHAN, Yan-Cheong et al.Microsystem technologies. 2013, Vol 19, Num 7, pp 1069-1080, issn 0946-7076, 12 p.Article

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu JointsZHOU, M. B; MA, X; ZHANG, X. P et al.Journal of electronic materials. 2012, Vol 41, Num 11, pp 3169-3178, issn 0361-5235, 10 p.Article

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical FatigueLIANG YIN; LUKE WENTLENT; LINLIN YANG et al.Journal of electronic materials. 2012, Vol 41, Num 2, pp 241-252, issn 0361-5235, 12 p.Article

Evolution of Ag3Sn at Sn―3.0Ag―0.3Cu―0.05Cr/Cu joint interfaces during thermal agingFEI LIN; WENZHEN BI; GUOKUI JU et al.Journal of alloys and compounds. 2011, Vol 509, Num 23, pp 6666-6672, issn 0925-8388, 7 p.Article

The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperaturesCHE, F. X; ZHU, W. H; POH, Edith S. W et al.Journal of alloys and compounds. 2010, Vol 507, Num 1, pp 215-224, issn 0925-8388, 10 p.Article

Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag SolderLEE, Hwa-Teng; CHEN, Yin-Fa.Journal of electronic materials. 2009, Vol 38, Num 10, pp 2148-2157, issn 0361-5235, 10 p.Article

Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg SolderCHEN, Hsiao-Yun; CHEN, Chih; WU, Pu-Wei et al.Journal of electronic materials. 2008, Vol 37, Num 2, pp 224-230, issn 0361-5235, 7 p.Article

The formation of none-Ag3Sn particles on the intermetallic compounds during wetting reactionYU, D. Q; WANG, L; WU, C. M. L et al.Journal of alloys and compounds. 2005, Vol 389, pp 153-158, issn 0925-8388, 6 p.Article

Liquidus Projections of Sn-Co-Ni and Sn-Rich Sn-Ag-Co-Ni SystemsCHEN, Sinn-Wen; CHEN, Tung-Kai; HSU, Chia-Ming et al.Journal of electronic materials. 2014, Vol 43, Num 7, pp 2487-2497, issn 0361-5235, 11 p.Article

Tensile creep characteristics of Sn-3.5Ag-0.5Cu (SAC355) solder reinforced with nano-metric ZnO particlesFAWZY, A; FAYEK, S. A; SOBHY, M et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 603, pp 1-10, issn 0921-5093, 10 p.Article

Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder jointsQIN, H. B; ZHANG, X. P; ZHOU, M. B et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 617, pp 14-23, issn 0921-5093, 10 p.Article

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALSJAEWON CHANG; KANG, Sung K; LEE, Jae-Ho et al.Journal of electronic materials. 2014, Vol 43, Num 1, pp 259-269, issn 0361-5235, 11 p.Conference Paper

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics ApplicationsSHNAWAH, Dhafer Abdul-Ameer; SUHANA BINTI MOHD SAID; MOHD FAIZUL MOHD SABRI et al.Journal of electronic materials. 2012, Vol 41, Num 8, pp 2073-2082, issn 0361-5235, 10 p.Article

Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn additionLUO, Z.-B; ZHAO, J; GAO, Y.-J et al.Journal of alloys and compounds. 2010, Vol 500, Num 1, pp 39-45, issn 0925-8388, 7 p.Article

Spectroscopic ellipsometry study of the dielectric response of Au-In and Ag-Sn thin-film couplesWRONKOWSKA, A. A; WRONKOWSKI, A; KUKLINSKI, K et al.Applied surface science. 2010, Vol 256, Num 15, pp 4839-4844, issn 0169-4332, 6 p.Conference Paper

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer BoardLIN, Chi-Pu; CHEN, Chih-Ming.Journal of electronic materials. 2009, Vol 38, Num 6, pp 908-914, issn 0361-5235, 7 p.Article

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy DesignANDERSON, Iver E; WALLESER, Jason W; HARRINGA, Joel L et al.Journal of electronic materials. 2009, Vol 38, Num 12, pp 2770-2779, issn 0361-5235, 10 p.Conference Paper

On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder AlloysSIDHU, Rajen S; MADGE, Shantanu V; XIN DENG et al.Journal of electronic materials. 2007, Vol 36, Num 12, pp 1615-1620, issn 0361-5235, 6 p.Article

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