Vibration fracture behavior of Sn-9Zn-xCu lead-free soldersHUNG, Fei-Yi; LUI, Truan-Sheng; CHEN, Li-Hui et al.Journal of materials science. 2007, Vol 42, Num 11, pp 3865-3873, issn 0022-2461, 9 p.Article

Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi pasteSHIH, Po-Cheng; LIN, Kwang-Lung.Journal of materials science. 2007, Vol 42, Num 8, pp 2574-2581, issn 0022-2461, 8 p.Article

Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide ElectrolyteMUI CHEE LIEW; AHMAD, Ibrahym; LIU MEI LEE et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 10, pp 3742-3747, issn 1073-5623, 6 p.Article

Modeling of the in-flight solidification of droplets produced by the uniform-droplet spray processSURESH KUMAR PILLAI; ANDO, Teiichi.International journal of thermal sciences. 2009, Vol 48, Num 8, pp 1494-1500, issn 1290-0729, 7 p.Article

Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free soldersNAKAMURA, Y; ONO, T.Journal of materials science. 2005, Vol 40, Num 12, pp 3267-3269, issn 0022-2461, 3 p.Article

Propriétés des alliages. Etain et alliages d'étain = Alloys properties. Tin anad tin alloysDELWASSE, André.Techniques de l'ingénieur. Matériaux métalliques. 1983, Vol MB5, Num M520, pp M520.1-M520.14, issn 1762-8733Article

Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine AtmosphereZHONG YAN; XIAN, Ai-Ping.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2013, Vol 44, Num 3, pp 1462-1474, issn 1073-5623, 13 p.Article

Effect of Ag addition on the corrosion properties of Sn-based solder alloysBUI, Q. V; NAM, N. D; NOH, B.-I et al.Materials and corrosion (1995). 2010, Vol 61, Num 1, pp 30-33, issn 0947-5117, 4 p.Article

Effect of solidification parameters on the microstructure of Sn-3.7Ag-0.9Zn solderBÖYÜK, U; ENGIN, S; KAYA, H et al.Materials characterization. 2010, Vol 61, Num 11, pp 1260-1267, issn 1044-5803, 8 p.Article

Effect of underfill on electromigration lifetime in flip chip jointsYAMANAKA, Kimihiro; OOYOSHI, Takafumi; NEJIME, Takayuki et al.Journal of alloys and compounds. 2009, Vol 481, Num 1-2, pp 659-663, issn 0925-8388, 5 p.Article

Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn soldersMONTESPERELLI, G; RAPONE, M; NANNI, F et al.Materials and corrosion (1995). 2008, Vol 59, Num 8, pp 662-669, issn 0947-5117, 8 p.Article

Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrateCHANG, Tao-Chih; WANG, Moo-Chin; HON, Min-Hsiung et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2005, Vol 36, Num 11, pp 3019-3029, issn 1073-5623, 11 p.Article

Refinement of the crystal structure of the clathrate Ba₈Ga_17.2Sn_28.8CARRILLO-CABRERA, W; CARDOSO GIL, R; TRAN, V.-H et al.Zeitschrift für Kristallographie. New crystal structures. 2002, Vol 217, Num 2, pp 181-182, issn 1433-7266Article

Microstructure of a lead-free composite solder produced by an in-situ processHWANG, Seong-Yong; LEE, Joo-Won; LEE, Zin-Hyoung et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1304-1308, issn 0361-5235, 5 p.Conference Paper

Refinement of the crystal structure of pentascandium tristannide, Sc₅Sn₃DERKACH, V. O; KOTUR, B. Y; CERNY, R et al.Zeitschrift für Kristallographie. New crystal structures. 1997, Vol 212, Num 2, issn 1433-7266, p. 290Article

The crystal structures of the closely related CrSn₂, NiCr₅Sn₁₂ and NiCr₃Sn₈ phasesLARSSON, A.-K; LIDIN, S.Journal of alloys and compounds. 1995, Vol 221, Num 1-2, pp 136-142, issn 0925-8388Article

Solidification of Sn-0.7Cu-0.15Zn Solder: In Situ ObservationGUANG ZENG; MCDONALD, Stuart D; GOURLAY, Christopher M et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2014, Vol 45, Num 2, pp 918-92626, issn 1073-5623, 91709 p.Article

Effect of Sn Grain Orientation on the Cu₆Sn₅ Formation in a Sn-Based Solder Under Current StressingLIN, Chih-Fan; LEE, Shang-Hua; CHEN, Chih-Ming et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 8, pp 2571-2573, issn 1073-5623, 3 p.Article

Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb AlloyVIANCO, Paul T; REJENT, Jerome A; ZENDER, Gary L et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 12, pp 3053-3064, issn 1073-5623, 12 p.Article

Thermal Fatigue Behavior of Sn-Rich (Pb-Free) SoldersSIDHU, R. S; CHAWLA, N.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2008, Vol 39, Num 4, pp 799-810, issn 1073-5623, 12 p.Article

Coupling effect in Pt/Sn/Cu sandwich solder joint structuresWANG, S. J; LIU, C. Y.Acta materialia. 2007, Vol 55, Num 10, pp 3327-3335, issn 1359-6454, 9 p.Article

Asymmetrical solder microstructure in Ni/Sn/Cu solder jointWANG, S. J; LIU, C. Y.Scripta materialia. 2006, Vol 55, Num 4, pp 347-350, issn 1359-6462, 4 p.Article

Structure of Mn₈Sn₅ELDING-PONTEN, M; STENBERG, L; LIDIN, S et al.Acta crystallographica. Section B, Structural science. 1997, Vol 53, Num 3, pp 364-372, issn 0108-7681Article

Study of cooperative grain boundary sliding by using macroscopic marker linesZELIN, M. G; MUKHERJEE, A. K.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 1995, Vol 26, Num 3, pp 747-750, issn 1073-5623Article

The Measurement of Thermal Conductivity Variation with Temperature for Sn-Based Lead-Free Binary SoldersDEMIR, Mustafa; AKSÖZ, Sezen; ÖZTÜRK, Esra et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2014, Vol 45, Num 5, pp 1739-1749, issn 1073-5615, 11 p.Article