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A review and prediction of chip scale solder joint reliabilityGHAFFARIAN, R.SPIE proceedings series. 1997, pp 109-110, isbn 0-930815-50-5Conference Paper

New wafer level structure for stress free area array solder attachFILLION, R; MEYER, L; DUROCHER, K et al.SPIE proceedings series. 2003, pp 687-692, isbn 0-8194-5189-4, 6 p.Conference Paper

Diode laser soldering of metallized fibers using gold-tin pre-formsHOULT, A. P; ONE, R. S.SPIE proceedings series. 2002, pp 98-103, isbn 0-930815-65-3Conference Paper

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Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

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Bewertung von Schädigungen an Lötverbindungen der oberflächenmontierten Bauelemente bei einem Temperaturschocktest = Evaluation des dommages subis par des brasures de composants montés en surface après des essais de chocs thermiques = Assessment of damages to soldered joints on surface mounted devices by a thermal shock testGABOR, H.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 180-183Conference Paper

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

2009 Pb-Free SoldersKANG, Sung K; ANDERSON, Iver; HANDWERKER, Carol et al.Journal of electronic materials. 2009, Vol 38, Num 12, issn 0361-5235, 362 p.Conference Proceedings

No-fault-found and intermittent failures in electronic productsHAIYU QI; GANESAN, Sanka; PECHT, Michael et al.Microelectronics and reliability. 2008, Vol 48, Num 5, pp 663-674, issn 0026-2714, 12 p.Article

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A micromachined Ball Grid Array test socket for fine-pitch interconnectHUANG, B; ANG, S. S; PORTER, E. V et al.SPIE proceedings series. 2000, pp 172-177, isbn 0-930815-62-9Conference Paper

Schallemissionsanalyse an Weichlötstellen = Analyse par émission acoustique des assemblages brasés = Sound emission analysis applied to soldered jointsSCHMITT-THOMAS, K. G; WATERSCHEK, R.Schweissen + Schneiden. 1984, Vol 36, Num 8, pp 359-364, issn 0036-7184Article

A novel measurement technique for stencil printed solder pasteDUSEK, Milos; HUNT, Christopher.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 5, 35-45 [12 p.]Article

Lead free soldering technology for mobile equipmentTANAKA, Yasunori; TAKAHASHI, Junichi; KAWASHIMA, Kazuyuki et al.SPIE proceedings series. 2000, pp 314-319, isbn 0-930815-62-9Conference Paper

Systemintegration in der Mikroelektronik (Nürnberg, 4-6 Mai 1999) = System integration in micro electronicsReichl, Herbert.Systemintegration in der Mikroelektronik. Kongress. 1999, isbn 3-8007-2456-1, 282 p., isbn 3-8007-2456-1Conference Proceedings

Soudage et techniques connexes. Assemblages exécutés avec des produits d'apport de brasage tendre et de brasage fort. Méthodes d'essai mécanique = Welding and allied processes. Assemblies made with soft solders and brazing filler metals. Mechanical test methods1985, 12 p.Report

Reliability evaluation for solder joints in embed electronic packageYAMABE, Masashi; QIANG YU; SHIBUTANI, Tadahiro et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 6798, pp 67980S.1-67980S.10, issn 0277-786X, isbn 978-0-8194-6969-4 0-8194-6969-6, 1VolConference Paper

Verbesserte Momentenübertragung in Welle-Nabe-Verbindungen durch Press-Presslöt-Verbindungen = Improved moment transfer in shaft hub joints through press soldered fittingsFÜSSEL, Uwe; KÜPPERS, Martin; LIPOTH, Istvan et al.VDI-Berichte. 2003, pp 247-258, issn 0083-5560, isbn 3-18-091790-3, 12 p.Conference Paper

Design guidelines to implement Six Sigma in assembly process yield of area array solder interconnect packagesCHUNHO KIM; BALDWIN, Daniel F.Proceedings - Electronic Components Conference. 2002, pp 1560-1568, issn 0569-5503, isbn 0-7803-7430-4, 9 p.Conference Paper