au.\*:("BALDE JW")
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WORKSHOP REPORT. II: COMPUTER PACKAGING WORKSHOP EXPLORES IMPACT OF LSIBALDE JW.1980; COMPUTER; ISSN 0018-9162; USA; DA. 1980; VOL. 13; NO 11; PP. 100-103Article
CIRCUIT-BOARD PACKAGING CONSIDERATIONS FOR OPTIMUM UTILIZATION OF CHIP CARRIERSAMEY DI; BALDE JW.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 1; PP. 105-110; BIBL. 8 REF.Article
CROSSTALK PERFORMANCE OF FLAT CABLE FOR TELEPHONE APPLICATIONS.BALDE JW; DELANEY RH; LAHTI JN et al.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 5; PP. 49-56 (5P.); BIBL. 7 REF.Article