Monolith package : A novel FBGA using 3-D TLC process and the new assembly by printing methodSHIMADA, Osamu; SUZUKI, Kazuhisa; WAKASHIMA, Yoshiaki et al.SPIE proceedings series. 2000, pp 178-183, isbn 0-930815-62-9Conference Paper

The coming of CSPWANG, Fei-Yue; MINGKUAN LIU.IEEE robotics & automation magazine. 2004, Vol 11, Num 1, pp 59-69, issn 1070-9932, 11 p.Article

A micromachined Ball Grid Array test socket for fine-pitch interconnectHUANG, B; ANG, S. S; PORTER, E. V et al.SPIE proceedings series. 2000, pp 172-177, isbn 0-930815-62-9Conference Paper

BGA reliability of Multilayer Ceramic Integrated Circuit (MCIC) devicesFU, Chia-Yu; HUANG, Rong-Fong.SPIE proceedings series. 2000, pp 40-45, isbn 0-930815-62-9Conference Paper

Low cost and high effective Thermal management using PBGA MCM packageKIM, S. G; CHUNG, D. E; WOO, J. H et al.SPIE proceedings series. 2000, pp 518-523, isbn 0-930815-62-9Conference Paper

Evaluation of gas chemistry effects on wire bond integrity and package interfacial adhesion in the BGA packageLEONI, Michael; MILLER, Jeannie; O'CONNOR, Shawn et al.SPIE proceedings series. 2000, pp 697-701, isbn 0-930815-62-9Conference Paper

Materials characterization of the effect of mechanical bending on area array package interconnectsROONEY, Daniel T; CASTELLO, N. Todd; CIBULSKY, Mike et al.SPIE proceedings series. 2002, pp 668-678, isbn 0-930815-66-1, 11 p.Conference Paper

Reliability of lead free BGA packagesPRASAD, Swaminath; CARSON, Flynn; KIM, G. S et al.SPIE proceedings series. 2000, pp 722-726, isbn 0-930815-62-9Conference Paper

Thermal limit of enhanced BGA packageHWANG, Jack G; CHEN, Hung-Nan; LEE, Lin-Wei et al.SPIE proceedings series. 2000, pp 524-529, isbn 0-930815-62-9Conference Paper

Thermal management performance and attachment reliability using urethane film adhesivesLIOTINE, Frank JR; VACCARO, Joseph F.SPIE proceedings series. 2000, pp 743-748, isbn 0-930815-62-9Conference Paper

Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe packageNANSEN CHEN; HONGCHIN LIN.Microsystem technologies. 2009, Vol 15, Num 3, pp 367-374, issn 0946-7076, 8 p.Article

Effect of isothermal aging on the intermetallic compound layer growth in BGA joints with Sn-Ag-Cu solderYOON, Jeong-Won; LEE, Chang-Bae; QUESNEL, David J et al.SPIE proceedings series. 2003, pp 465-470, isbn 0-8194-5189-4, 6 p.Conference Paper

Mechanical reinforcement for sphere attach applicationsBROWN, Maureen; JUNG, Richard; JIN LIU et al.SPIE proceedings series. 2003, pp 937-942, isbn 0-8194-5189-4, 6 p.Conference Paper

An efficient ball grid array routerXIAOYU SONG; SHAODI GAO; CHAKRAVARTHYT, Tejasvi P et al.International journal of electronics. 2002, Vol 89, Num 4, pp 317-324, issn 0020-7217Article

Corrosion studies of μ BGA packageCHUNG, Tae-Gyeong; AHN, Sang-Ho; KIM, Shin et al.SPIE proceedings series. 2000, pp 15-20, isbn 0-930815-62-9Conference Paper

A study on oval type solder ball land for high density BGA package applicationsKIM, S. J; SON, S. J; SYED, A et al.SPIE proceedings series. 2000, pp 788-795, isbn 0-930815-62-9Conference Paper

Lead-free ball-grid array balls: Production method and propertiesKEMPF, B; GRAFF, M; HUTIN, O et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1270-1275, issn 0361-5235, 6 p.Conference Paper

Epoxy flux for lead-free solderingWUSHENG YIN; LEE, Ning-Cheng.SPIE proceedings series. 2003, pp 731-738, isbn 0-8194-5189-4, 8 p.Conference Paper

Effect of thermal cycling on the solder joints' reliability of ceramic ball grid arraySARKAR, G; WEE, P. H; MASRENA et al.Journal of materials science letters. 2002, Vol 21, Num 1, pp 61-63, issn 0261-8028Article

Reliability of tin-lead balled BGAs soldered with lead-free solder pasteNURMI, Sami Tapani; RISTOLAINEN, Eero Olavi.Soldering & surface mount technology. 2002, Vol 14, Num 2, issn 0954-0911, 5, 7, 9, 35-39 [8 p.]Article

On the reliability and failure of PBGA interconnects under bending cyclic testHO, S. H; ZHENG, P. J; WU, J. D et al.SPIE proceedings series. 2000, pp 247-252, isbn 0-930815-62-9Conference Paper

Lead-free soldering for CSP : The impact of higher temperature SMT assembly processingSOLBERG, Vern.SPIE proceedings series. 2000, pp 611-616, isbn 0-930815-62-9Conference Paper

Thermal characterization of flip-chip BGACHEN, H. N; WU, C. T; LIN, P. J et al.SPIE proceedings series. 2000, pp 357-361, isbn 0-930815-62-9Conference Paper

High-performance FCBGA based on multi-layer thin-substrate packaging technology : Packaging technologySHIMOTO, Tadanori; KIKUCHI, Katsumi; BABA, Kazuhiro et al.NEC research & development. 2003, Vol 44, Num 3, pp 213-218, issn 0547-051X, 6 p.Article

An analysis of semiconductor package by X-ray CT instrumentTAKADO, Tsumoru; ARITA, Hiroshi; OHNO, Yasuhide et al.SPIE proceedings series. 2000, pp 128-133, isbn 0-930815-62-9Conference Paper