MICROELECTRONIC PACKAGING: DEFINITIONS AND CHALLENGESSEELY JH.1972; INSULAT./CIRCUITS; U.S.A.; DA. 1972; VOL. 18; NO 12; PP. 31-35Serial Issue

NEW HEAT SINKING TECHNIQUES FOR HERMETIC DIPS. = NOUVELLES TECHNIQUES DE PLAQUES DE REFROIDISSEMENT POUR LES DISPOSITIFS DIP HERMETIQUESEMERALD PE.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 11; PP. 70-78 (6P.)Article

METALLURGICAL CONSIDERATIONS FOR BEAM TAPE ASSEMBLY.ROSE AS; SCHELINE FE; SIKINA TV et al.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 21; NO 3; PP. 49-68 (5P.); BIBL. 8 REF.Article

USING CHIP CARRIERS FOR HIGH DENSITY PACKAGING.BAUER JA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 85-91 (4P.)Article

CHEMICAL MILLING1971; IN: INT. ELECTRON. PACKAG. PROD. BRIGHTON, ENGL., 1971. PROC. TECH. PROGRAMME; CHICAGO; IND. SCI. CONF. MANAGE.; DA. 1971; PP. 337-374Conference Proceedings

IMPROVING THE QUALITY OF GLASS-SEALED CERAMIC DIPS.LAMSON MA; RAMSEY TH JR.1978; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1978; VOL. 18; NO 1; PP. 84-96 (7P.); BIBL. 8 REF.Article

MICROWAVE-PACKAGE MEASUREMENTS AT THE Q BANDDOWNING BJ; ROBSON PN.1973; ELECTRON LETTERS; G.B.; DA. 1973; VOL. 9; NO 11; PP. 245-246; BIBL. 3 REF.Serial Issue

CONNECTOR DESIGN GUIDELINES1972; IN: NEW HORIZ. INTERCONNECTION TECHNOL. PROC. 5TH ANNU. CONNECTOR SYMP. CHERRY HILL, N.J., 1972; PHILADELPHIA; ELECTRON. CONNECTOR STUDY GROUP.; DA. 1972; PP. 77-142; BIBL. DISSEM.Conference Proceedings

DYNAMIC 4096-BIT MOST MEMORY IN 18-LEAD DIL PACKAGE = MEMOIRE DYNAMIQUE A TRANSISTOR MOS DE 4096 BITS DANS UN BOITIER ENFICHABLE A 18 FILS DE SORTIEDUMMER GWA.1972; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1972; VOL. 11; NO 4; PP. 391-392; H.T. 2Serial Issue

PACKAGING THE FAST, HOT ICS1973; E.E./SYST. ENGNG TODAY; U.S.A.; DA. 1973; VOL. 32; NO 3; PP. 48-50Serial Issue

SELECTING THE OPTIMUM CIRCUIT-BOARD PACKAGEPEEL M.1973; ELECTRONICS; U.S.A.; DA. 1973; VOL. 46; NO 6; PP. 115-117Serial Issue

BEAM TAPE CARRIERS - A DESIGN GUIDE.CAIN RL.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 21; NO 3; PP. 53-58; BIBL. 1 P. 1/2Article

P-KANAL-MOS-DOPPELTRANSISTOR SMY 60.HESSLER U.1976; RADIO FERNSEHEN ELEKTRON.; DTSCH.; DA. 1976; VOL. 25; NO 15; PP. 494Article

RELIABILITY OF PLASTIC. ENCAPSULATED DEVICES1972; IN: RELIAB. PHYS. 1972. I.E.E.E. ANNU. PROC. LAS VEGAS, 1972; NEW YORK; INST. ELECTR. ELECTRON. ENG.; DA. 1972; PP. 72-105; BIBL. DISSEM.Serial Issue

CHIP CARRIER PACKAGING APPLICATIONSBAUER JA.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 1; PP. 120-125; BIBL. 5 REF.Article

EXPERIMENTAL INVESTIGATION OF MOUNTING THERMAL RESISTANCE OF FLATPACKS ON CIRCUIT BOARDSMOVIUS TF; JONES IR; KALLIS JM et al.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 512-517Article

L 141.CROS A.1974; CNET-7245340; FR.; DA. 1974; PP. 1-7; H.T. 5; (RAPP. FINAL, CENT. FIABILITE)Report

SPECIFICATIONS OF THRESHOLD-LOGIC GATES FOR OPTIMUM S.S.I. LOGIC PACKAGINGHURST SL.1972; ELECTRON. LETTERS; G.B.; DA. 1972; VOL. 8; NO 21; PP. 514-515; BIBL. 7 REF.Serial Issue

THERMAL STUDIES OF A PLASTIC DUAL-IN-LINE PACKAGEMITCHELL C; BERG HM.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 500-511; BIBL. 12 REF.Article

ENCAPSULATED LEAD FRAME - A PACKAGE DESIGN FOR MECHANICAL THERMAL PULSE BONDINGDEBOSKEY WR; RAJAC TJ.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 2; PP. 35-37; BIBL. 1 REF.Article

STATIONARY TEMPERATURE PROFILES AND HEAT FLUX DISTRIBUTION IN A PLASTIC-ENCAPSULATED CIRCUIT PACKAGEPAIVANAS JA.1972; I.B.M. J. RES. DEVELOP.; U.S.A.; DA. 1972; VOL. 16; NO 3; PP. 292-302; BIBL. 3 REF.Serial Issue

DEVELOPMENT OF A 68-PIN MULTIPLE IN-LINE PACKAGEBRODSKY WL; PARKER FD; SCHOENTHALER D et al.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 4; PP. 594-601; BIBL. 6 REF.Article

PRELIMINARY EVALUATION OF DIP/SOCKET CONNECTION RELIABILITYMILLS GW.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 476-487; BIBL. 8 REF.Article

A SINGLE-CHIP TELEVISION IF SYSTEMBASKERVILLE G.1972; I.E.E.E. J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1972; VOL. 7; NO 6; PP. 455-461; BIBL. 1 REF.Serial Issue

FILIERE TECHNOLOGIQUE POUR COMPOSANTS HYPERFREQUENCE MICROMINIATURISES PRESENTES EN BOITIERS DES SERIES DU TYPE TO OU FLAT PACK INTEGRABLESFACHE M; MICHEL B.1978; ; FRA; DA. 1978; DGRST 77 7 1489; 20-(52) P.: ILL.; 30 CM; ACTION CONCERT.: FILIERES TECHNOL. COMPOS.Report