au.\*:("BONDUR JA")
Results 1 to 3 of 3
Selection :
DRY PROCESS TECHNOLOGY (REACTIVE ION ETCHING).BONDUR JA.1976; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1976; VOL. 13; NO 5; PP. 1023-1029; BIBL. 14 REF.Article
CF4 ETCHING IN A DIODE SYSTEMBONDUR JA.1979; J. ELECTROCHEM. SOC.; USA; DA. 1979; VOL. 126; NO 2; PP. 226-231; BIBL. 17 REF.Article
PLASMA ETCHING FOR SIO2 PROFILE CONTROLBONDUR JA; CLARK HA.1980; SOLID STATE TECHNOL.; USA; DA. 1980; VOL. 23; NO 4; PP. 122-128; BIBL. 10 REF.Article
