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Results 1 to 25 of 758

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The formulation of electroless nickel-phosphorus plating baths = Formulation de bains de dépôt chimique de nickel-phosphorePARKER, K.Plating and surface finishing. 1987, Vol 74, Num 2, pp 60-65, issn 0360-3164Article

Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper filmBARBOSA, L. L; DE ALMEIDA, M. R. H; CARLOS, R. M et al.Surface & coatings technology. 2005, Vol 192, Num 2-3, pp 145-153, issn 0257-8972, 9 p.Article

Types and characteristics of precious metal plating bathsKITADA, Katsutsugu.Hyomen gijutsu. 2004, Vol 55, Num 10, pp 626-629, issn 0915-1869, 4 p.Article

Recyclage des bains chromiques : le procédé Chromapur® sur le site de Trédi HombourgGalvano organo traitements de surface. 2003, Num 733, pp 632-635, issn 0982-7870, 4 p.Article

Phosphorus speciation in nickel plating baths by ion chromatographyBIESAGA, M; TROJANOWICZ, M.Journal of chromatography. A. 1995, Vol 705, Num 2, pp 390-395Article

Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor AdditivesHAI, Nguyen T. M; ODERMATT, Jan; GRIMAUDO, Valentine et al.Journal of physical chemistry. C. 2012, Vol 116, Num 12, pp 6913-6924, issn 1932-7447, 12 p.Article

Siebec, l'innovation au service de la galvanoGalvano organo traitements de surface. 2004, Num 738, pp 54-55, issn 0982-7870, 2 p.Article

A review of acid copper plating bath life extension & copper recovery from acid copper bathsBLESS, D.Plating and surface finishing. 2001, Vol 88, Num 10, pp 58-63, issn 0360-3164Article

Evaluation of Selective Separation of Phosphorous Components from Plating Baths Using SchwertmanniteOKIDO, Masazumi; TAKAKUWA, Toshihiro; ESKANDARPOUR, Akbar et al.ISIJ international. 2008, Vol 48, Num 5, pp 685-689, issn 0915-1559, 5 p.Article

Three-additive model of superfilling of copperYANG CAO; TAEPHAISITPHONGSE, Premratn; CHALUPA, Radek et al.Journal of the Electrochemical Society. 2001, Vol 148, Num 7, pp C466-C472, issn 0013-4651Article

Die Chemie muss stimmen = The chemistry must correctPODS, R.Metalloberfläche. 1999, Vol 53, Num 7, pp 21-22, issn 0026-0797Article

Effect of solution composition on double zincate process of aluminumAZUMI, K; FUJISHIGE, Y; SEO, M et al.Hyomen gijutsu. 1996, Vol 47, Num 9, pp 802-807, issn 0915-1869Article

Recuperación de baños mediante evaporador atmosférico = Bath recovery by means of an atmospheric evaporatorSANCHEZ, P.Pinturas y acabados industriales. 1993, Vol 35, Num 204, pp 33-36, issn 0031-9953Article

Effects of deposition temperature on the performance of CdS films with chemical bath depositionLIMEI ZHOU; XIAOFEI HU; SUMEI WU et al.Surface & coatings technology. 2013, Vol 228, issn 0257-8972, S171-S174, SUP1Conference Paper

Optimized bath for electroless deposition of palladium on amorphous alumina membranesVOLPE, Maurizio; INGUANTA, Rosalinda; PIAZZA, Salvatore et al.Surface & coatings technology. 2006, Vol 200, Num 20-21, pp 5800-5806, issn 0257-8972, 7 p.Article

Characteristics of non - cyanide acid zinc plating baths and coatingsCHANDRAN, M; LEKSHMANA SARMA, R; KRISHNAN, R. M et al.Transactions of the Institute of Metal Finishing. 2003, Vol 81, pp 207-209, issn 0020-2967, 3 p., 6Article

The influence of 2,2'-dipyridyl on non-formaldehyde electroless copper platingJUN LI; HAYDEN, Harley; KOHL, Paul A et al.Proceedings - Electrochemical Society. 2003, pp 99-111, issn 0161-6374, isbn 1-56677-390-3, 13 p.Conference Paper

Purification of hard chromium plating baths: Options & challengesDONEPUDI, V. S; KHALILI, N. R; KIZILEL, R et al.Plating and surface finishing. 2002, Vol 89, Num 4, pp 62-65, issn 0360-3164Article

Comparative performance of a Copper sulphamate bath with conventional acid-sulphate and cyanide bathsKOKILA, P; LEKSHMANA SARMA, R; SRIVEERARAGHAVAN, S et al.Transactions of the Institute of Metal Finishing. 2001, Vol 79, pp 219-223, issn 0020-2967, 6Article

Development of electroless nickel bath life extension : the EDEN systemORGILL, Graham; BORN, Rainer; RICHTERING, Werner et al.Transactions of the Institute of Metal Finishing. 2001, Vol 79, pp B87-B91, issn 0020-2967, 5Article

L'electroformage = ElectroformingMANASTERSKI, Christian.Galvano organo traitements de surface. 2001, Num 714, issn 0982-7870, 526, 597-599 [4 p.]Article

Lebensdauer stromloser Nickelbäder verlängern = Service life of chemical nickel bathsRICHTERING, W.Metalloberfläche. 1999, Vol 53, Num 5, pp 11-15, issn 0026-0797Article

Abhängigkeit von den Prozessparametern der Vorbehandlung : Zinkaschebildung und Zinkverbrauch beim Feuerverzinken = Zinc ash formation and zinc consumption in dependence on parameters of pretreatment in hot dip galvanizingKATZUNG, W; RITTIG, R.Metall (Berlin, West). 1998, Vol 52, Num 5, pp 282-291, issn 0026-0746Article

Analyses des bains d'electroplastie (suite) = Analysis of electroplating baths (following)TOURNIER, R.Galvano organo traitements de surface. 1998, Vol 67, Num 686, pp 417-418, issn 0982-7870Article

Aluminum electroplating on steel from a fused bromide electrolyteTRIPATHY, Prabhat K; WURTH, Laura A; DUFEK, Eric J et al.Surface & coatings technology. 2014, Vol 258, pp 652-663, issn 0257-8972, 12 p.Article

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