kw.\*:("Barrière diffusion")
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Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnectsHSU, Kuo-Chung; PERNG, Dung-Ching; YEH, Jia-Bin et al.Applied surface science. 2012, Vol 258, Num 18, pp 7225-7230, issn 0169-4332, 6 p.Article
Ultrathin amorphous Ni―Ti film as diffusion barrier for Cu interconnectionLIU, B. T; YANG, L; LI, X. H et al.Applied surface science. 2011, Vol 257, Num 7, pp 2920-2922, issn 0169-4332, 3 p.Article
Analytical W―He and H―He interatomic potentials for a W―H―He systemLI, Xiao-Chun; XIAOLIN SHU; LIU, Yi-Nan et al.Journal of nuclear materials. 2012, Vol 426, Num 1-3, pp 31-37, issn 0022-3115, 7 p.Article
Evaluation of the diffusion barrier continuity on porous low-k films using positronium time of flight spectroscopyTANAKA, H. K. M; KURIHARA, T; MILLS, A. P et al.Physical review B. Condensed matter and materials physics. 2005, Vol 72, Num 19, pp 193408.1-193408.4, issn 1098-0121Article
Impact of the unique physical properties of copper in silicon on characterization of copper diffusion barriersISTRATOV, A. A; FLINK, C; WERER, E. R et al.Physica status solidi. B. Basic research. 2000, Vol 222, Num 1, pp 261-277, issn 0370-1972Article
Titanium nitride as a diffusion barrier between nickel silicide and aluminumFINETTI, M; SUNI, I; NICOLET, M.-A et al.Journal of electronic materials. 1984, Vol 13, Num 2, pp 327-340, issn 0361-5235Article
Remarks on the sintering behavior of UO2―Gd2O3 fuelDURAZZO, M; SALIBA-SILVA, A. M; URANO DE CARVALHO, E. F et al.Journal of nuclear materials. 2010, Vol 405, Num 2, pp 203-205, issn 0022-3115, 3 p.Article
Interdiffusion reaction in the CrN interlayer in the NiCrAlY/CrN/DSM11 system during thermal treatmentLI, W. Z; WANG, Q. M; GONG, J et al.Applied surface science. 2009, Vol 255, Num 18, pp 8190-8193, issn 0169-4332, 4 p.Article
Understanding nitrogen-induced effects on the performance of ultra low-k dielectric systems through ab initio simulationsLING DAI; TAN, V. B. C; YANG, Shuo-Wang et al.Surface science. 2007, Vol 601, Num 16, pp 3366-3371, issn 0039-6028, 6 p.Article
Tantalum carbide and nitride diffusion barriers for Cu metallisationLAURILA, T; ZENG, K; KIVILAHTI, J. K et al.Microelectronic engineering. 2002, Vol 60, Num 1-2, pp 71-80, issn 0167-9317Conference Paper
Self-diffusion on Pd(111)STELTENPOHL, A; MEMMEL, N.Surface science. 2000, Vol 454-56, pp 558-561, issn 0039-6028Conference Paper
Scaling of hopping self-diffusion barriers on fcc(100) surfaces with bulk bond energiesFEIBELMAN, P. J.Surface science. 1999, Vol 423, Num 2-3, pp 169-174, issn 0039-6028Article
Internal transport barrier with improved confinement in the JT-60U tokamakKOIDE, Y; TAKIZUKA, T; TSUJI-IIO, S et al.Plasma physics and controlled fusion. 1996, Vol 38, Num 7, pp 1011-1022, issn 0741-3335Article
High-fidelity chemical patterning on oxide-free germanium : SPECIAL SECTION ON NANOELECTRONICS, SENSORS AND SINGLE MOLECULE BIOPHYSICSNATHANHOHMAN, J; MOONHEE KIM; LAWRENCE, Jeffrey A et al.Journal of physics. Condensed matter (Print). 2012, Vol 24, Num 16, issn 0953-8984, 164214.1-164214.4Article
Preparation and annealing study of TaNx coatings on WC-Co substratesCHEN, Yung-I; LIN, Bo-Lu; KUO, Yu-Chu et al.Applied surface science. 2011, Vol 257, Num 15, pp 6741-6749, issn 0169-4332, 9 p.Article
Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrierBUM HO CHOI; JONG HO LEE; HONG KEE LEE et al.Applied surface science. 2011, Vol 257, Num 22, pp 9654-9660, issn 0169-4332, 7 p.Article
First-principles investigation on dissolution and diffusion of oxygen in tungstenALKHAMEES, Abdullah; LIU, Yue-Lin; ZHOU, Hong-Bo et al.Journal of nuclear materials. 2009, Vol 393, Num 3, pp 508-512, issn 0022-3115, 5 p.Article
Lateral electronic confinement in unidimensional noble metal (Au, Pt) nanowiresZHU, Z. H; YAN, X. H; LU, D et al.Surface science. 2008, Vol 602, Num 14, pp 2354-2357, issn 0039-6028, 4 p.Article
A diffusion barrier maintains distribution of membrane proteins in polarized neuronsWINCKLER, B; FORSCHER, P; MELLMAN, I et al.Nature (London). 1999, Vol 397, Num 6721, pp 698-701, issn 0028-0836Article
Step-edge barriers : truths and kinetic consequencesKYUNO, K; EHRLICH, G.Surface science. 1997, Vol 383, Num 2-3, pp L766-L774, issn 0039-6028Article
Effect of vacancy on the dissolution and diffusion properties of hydrogen and helium in molybdenumYOU, Yu-Wei; KONG, Xiang-Shan; WU, Xue-Bang et al.Journal of nuclear materials. 2013, Vol 433, Num 1-3, pp 167-173, issn 0022-3115, 7 p.Article
Nuclear magnetic resonance detection of the nuclear spins near paramagnetic impurities in solidsFURMAN, G. B; GOREN, S. D.Journal of physics. Condensed matter (Print). 2002, Vol 14, Num 4, pp 873-881, issn 0953-8984Article
Schéma d'Euler continu pour des diffusions tuées et options barrière = Continuous Euler scheme for killed diffusions and barrier optionsGOBET, E.Comptes rendus de l'Académie des sciences. Série 1, Mathématique. 1998, Vol 326, Num 12, pp 1411-1414, issn 0764-4442Article
Ion mobility and transport barriers in the tokamak plasmasXIAO, H; HAZELTINE, R. D; ZHANG, Y. Z et al.Physics of fluids. B, Plasma physics. 1993, Vol 5, Num 12, pp 4499-4501, issn 0899-8221Article
UTILISATION POSSIBLE DES REVETEMENTS PROTECTEURS DANS LES MATERIAUX RENFORCES PAR DES FIBRESKARPINOS DM; BORISENKO AI; GORSKIJ VV et al.1974; ZASHCH. POKRYT. METALL., U.S.S.R.; S.S.S.R.; DA. 1974; NO 8; PP. 146-150; H.T. 2; BIBL. 13 REF.Article