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140 GHz broadband crossbar stripline mixers with over 20 GHz instantaneous RF bandwidthNGUYEN, C; CHANG, K.Electronics Letters. 1984, Vol 20, Num 11, issn 0013-5194, 441Article

35 GHz integrated circuit rectifying antenna with 33% efficiencyYOO, T.-W; CHANG, K.Electronics Letters. 1991, Vol 27, Num 23, issn 0013-5194, p. 2117Article

Assessment of fatigue strength of beam lead in μBGA package using mechanical fatigue testerLEE, H; JUN HYUB PARK; MOON CHEOL KIM et al.SPIE proceedings series. 1999, pp 694-698, isbn 0-930815-58-0Conference Paper

Bottom side alignment technique for the fabrication of microwave devices with integral beam leadsKBOSLA, Y. P; DAHIYA, K. K; KUMAR, P et al.SPIE proceedings series. 2000, pp 602-604, isbn 0-8194-3601-1Conference Paper

Glass reinforced GaAs beam lead Schottky diode with airbridge for millimetre wavelengthsMILLS, K; AZAN, F; PERRUCHE, H et al.Electronics Letters. 1984, Vol 20, Num 19, pp 787-788, issn 0013-5194Article

The design and development of a 140GHz beam-lead diode subharmonically pumped mixerDUBHGHAILL, R. N. O; LYONS, B. N.International journal of infrared and millimeter waves. 1992, Vol 13, Num 3, pp 267-274, issn 0195-9271Article

A METALLIZATION PROVIDING TWO LEVELS OF INTERCONNECT FOR BEAM-LEADED SILICON INTEGRATED CIRCUITS.RYDEN WD; LABUDA EF.1977; I.E.E.E.J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1977; VOL. 12; NO 4; PP. 376-382; BIBL. 17 REF.Article

The influence of ion beam mixed TiSi2 layers on reverse characteristics of diodesDEHM, C; BURTE, E. P; GYULAI, J et al.Journal of applied physics. 1992, Vol 71, Num 9, pp 4365-4369, issn 0021-8979Article

Superconducting microcircuit and fluxoid quantization: a new quantum interferometerFINK, H. J; LOO, J; ROBERTS, S. M et al.Physical review. B, Condensed matter. 1988, Vol 37, Num 10, pp 5050-5057, issn 0163-1829, part AArticle

PRELOADING COMPLIANT BONDING TAPE WITH BEAM-LEAD INTEGRATED CIRCUITS.GRUSZKA RF.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 61-65Article

WIRELESS BONDING TECHNIQUES.AWATAR SINGH.1976; J. INSTIT. ENGRS (INDIA), ELECTRON. TELECOMMUNIC. ENGNG DIV.; INDIA; DA. 1976; VOL. 56; NO 3; PP. 85-87; BIBL. 15 REF.Article

TECHNOLOGIE DES ELEMENTS CAPACITIFS A CONNEXION DEPASSANTEHALAS I; KAMPA J.1977; PRACE OSRODKA BADAWCZO-ROZWOJOW-ELEKTRON. PROZNIOW.; POLOGNE; DA. 1977; VOL. 5; NO 10; PP. 53-59; ABS. ANGL. RUSSE; BIBL. 7 REF.Article

Basis property of a Rayleigh beam with boundary stabilizationGUO, B. Z.Journal of optimization theory and applications. 2002, Vol 112, Num 3, pp 529-547, issn 0022-3239Article

Gaseous cleaning beneath surface mounted components: evaluation using a beam lead test chipCOOK, J. M; HANNON, J. J.IEEE transactions on components, hybrids, and manufacturing technology. 1984, Vol 7, Num 4, pp 328-335, issn 0148-6411Conference Paper

22 GHz band low noise down converter for satellite broadcastingUTSUMI, Y; IMAI, K.IEEE transactions on broadcasting. 1984, Vol 30, Num 1, pp 1-7, issn 0018-9316Article

Solid-state devices in H-guide, grove guide and fence guideBENSON, F. A; CUDD, P. A; TISCHER, F. J et al.Electronics Letters. 1983, Vol 19, Num 17, pp 657-658, issn 0013-5194Article

Encapsulation techniques for millimeter-wave Impatt drodesFREYER, J; PIERZINA, R.AEU. Archiv für Elektronik und Übertragungstechnik. 1986, Vol 40, Num 5, pp 321-325, issn 0001-1096Article

Overview of IC socket applicationCONLON, N. A.Electri.onics. 1985, Vol 31, Num 6, pp 73-79, issn 0745-4309Article

Tape automated bondingSMALL, D. J; BLAIN, A. A.British Telecom technology journal. 1985, Vol 3, Num 3, pp 86-92, issn 0265-0193Article

DETECTION OF SPUTTER CONTAMINATION AND SPUTTER ETCH RESIDUE BY ION MICROPROBE ANALYSISANDREWS JM; KATE LE; COLBY JW et al.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 67; NO 2; PP. 325-340; BIBL. 20 REF.Article

MILLIMETER-WAVE MIXERS FORGE AHEAD WITH GUNN AND BEAM-LEAD DIODES1979; MICROWAVES; USA; DA. 1979; VOL. 18; NO 4; PP. 25-26Article

METHODS FOR PRODUCING SOLDERABLE, RIGID TERMINALS ON FLEXIBLE PRINTED CIRCUITS.JEAN LH.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 2; PP. 45-47Article

CHIPFUEGEN-EIN UEBERBLICK. = ASSEMBLAGE DE PUCES-APERCULABS J; SCHEEL W.1978; NACHR.-TECH., ELEKTRON.; DDR; DA. 1978; VOL. 28; NO 7; PP. 284-287; ABS. RUS/ENG; BIBL. 24 REF.Article

A HIGH SPEED ECL MULTIPLEXER IN BEAM LEAD, HYBRID TECHNOLOGY.COUGHLIN JB; HUGHES JB; WATTS RS et al.1977; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1977; VOL. 4; NO 3-4; PP. 185-191; BIBL. 4 REF.Article

FAILURE MODES OF BEAM-LEAD SEMICONDUCTORS IN THIN-FILM HYBRID MICROCIRCUITS.SWAFFORD JH.1976; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1976; VOL. 12; NO 4; PP. 298-304; BIBL. 12 REF.Article

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