Lead and its alloys welded with a hot current-conducting tool = Soudage avec élément chauffant du plomb et de ses alliagesBITSOEV, G. D.Automatic Welding. 1983, Vol 36, Num 11, pp 56-58, issn 0005-108XArticle

Optimisation des procédés de moulage d'alliages cuiverux sans plomb = Optimising casting processes for lead-free copper alloysSTUCKY, M; MONAT, T; LUCIANI, B et al.Fonderie, Fondeur d'aujourd'hui. 2007, Num 261, pp 20-34, issn 0249-3136, 15 p.Article

Using differential scanning calorimetry to determine the percent tin in high-lead solders = Utilisation de la calorimétrie à balayage différentiel pour déterminer la teneur en étain de métaux d'apport de brasage tendre à forte teneur en plombAMEEN, J. G; VEERARAGHAVAN, V. G.1986, Num 10, pp 43-47, issn 0263-0060Article

Good seam welds in painted steel = Soudage à la molette de tôles peintes en acierKARAGOULIS, M. J; PUSATERI, M. A.Welding design & fabrication. 1987, Vol 60, Num 2, pp 33-36, issn 0043-2253Article

A study of the effect on the mechanical strength of soldered joints made to brass of the presence of antimony in 40% tin 60% lead solder = Etude de l'influence de la présence d'antimoine dans les métaux d'apport de brasage tendre 40% Sn 60% Pb sur la résistance mécanique des joints brasés en laitonTHWAITES, C. J; MCDOWALL, D.1984, Num 6, pp 32-36, issn 0263-0060Article

The use of tin-lead alloy models to determine static strengthFESSLER, H; HYDE, T. H.ÖIAZ. 1996, Vol 141, Num 4, pp 176-178, issn 0721-9415Article

Development of Zinc based solders = Mise au point de produit d'apport de brasage tendre à base de zincHARRISON, K. T; KNIGHTS, C. F.1984, Num 6, pp 5-9, issn 0263-0060Article

Determination of lead in an Sb-Pb alloy by anodic linear scan voltammetryBLAGOJEVIC, N. Z; KASTRATOVIC, V. R; ZEJNILOVIC, R. M et al.Fresenius' journal of analytical chemistry. 2001, Vol 371, Num 7, pp 1023-1027, issn 0937-0633Article

Hot Deformation and Processing Map of Pb-Mg-10Al-1B AlloyDUAN, Y. H.Journal of materials engineering and performance. 2013, Vol 22, Num 10, pp 3049-3054, issn 1059-9495, 6 p.Article

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature DepressionCHANG DONG ZOU; YU LAI GAO; BIN YANG et al.Journal of electronic materials. 2009, Vol 38, Num 2, pp 351-355, issn 0361-5235, 5 p.Article

Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop testsYANGHUA XIA; CHUANYAN LU; XIAOMING XIE et al.Journal of electronic materials. 2007, Vol 36, Num 9, pp 1129-1136, issn 0361-5235, 8 p.Article

Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEMYING DING; CHUNQING WANG; LI MINGYU et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2004, Vol 384, Num 1-2, pp 314-323, issn 0921-5093, 10 p.Article

The influence of Pb on the friction and wear behavior of Al-Si-Pb alloysAN, J; LIU, Y. B; LU, Y et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2004, Vol 373, Num 1-2, pp 294-302, issn 0921-5093, 9 p.Article

Neutron powder diffraction study of strain and crystallite size in mechanically alloyed PbTeBOUAD, N; CHAPON, L; MARIN-AYRAL, R.-M et al.Journal of solid state chemistry (Print). 2003, Vol 173, Num 1, pp 189-195, issn 0022-4596, 7 p.Article

Thermomechanical fatigue of Sn-37 wt.% Pb model solder jointsLIU, X. W; PLUMBRIDGE, W. J.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2003, Vol 362, Num 1-2, pp 309-321, issn 0921-5093, 13 p.Article

Creep behavior and deformation mechanism map of Sn-Pb eutectic solder alloySHI, X. Q; WANG, Z. P; YANG, Q. J et al.Journal of engineering materials and technology. 2003, Vol 125, Num 1, pp 81-88, issn 0094-4289, 8 p.Article

Rheological behavior of the mushy zone at small strainsMARTIN, Christophe L; BRACCINI, Muriel; SUERY, Michel et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2002, Vol 325, Num 1-2, pp 292-301, issn 0921-5093Article

Interaction relation in 60Sn-Pb-0.05La ternary solder alloyMA, Xin; YOSHIDA, Fusahito.Materials letters (General ed.). 2002, Vol 56, Num 4, pp 441-445, issn 0167-577X, 5 p.Article

Leaded brass rods C 38500 for automatic machining operations: A technical reportPANTAZOPOULOS, G.Journal of materials engineering and performance. 2002, Vol 11, Num 4, pp 402-407, issn 1059-9495, 6 p.Article

Selective infiltration of superheated micro-sized droplets of a tin-lead alloy into a preheated powder layer for a novel solid freeform fabrication processSOHN, Hyonkee; YANG, Dong-Yol.Journal of materials science letters. 2002, Vol 21, Num 21, pp 1717-1719, issn 0261-8028, 3 p.Article

Influence of alloy composition on fillet-lifting phenomenon in tin binary alloysTAKAO, H; HASEGAWA, H.Journal of electronic materials. 2001, Vol 30, Num 5, pp 513-520, issn 0361-5235Article

Microstructure coarsening during static annealing of 60Sn40Pb solder joints : II Eutectic coarsening kineticsJUNG, Kang; CONRAD, Hans.Journal of electronic materials. 2001, Vol 30, Num 10, pp 1303-1307, issn 0361-5235Article

Mixed mode I/II fracture and fatigue crack growth along 63Sn-37Pb solder/brass interfaceNAYEB-HASHEMI, H; PINGHU YANG.International journal of fatigue. 2001, Vol 23, pp S325-S335, issn 0142-1123, SUPConference Paper

Behaviour of F82H mod. stainless steel in lead-bismuth under temperature gradientGOMEZ BRICENO, D; MUNOZ, F. J; SOLER CRESPO, L et al.Journal of nuclear materials. 2001, Vol 296, pp 265-272, issn 0022-3115Conference Paper

Corrosion behavior of steels in flowing lead-bismuthBARBIER, F; RUSANOV, A.Journal of nuclear materials. 2001, Vol 296, pp 231-236, issn 0022-3115Conference Paper