Reflow-Löttechnik von SMDs aus der Sicht des Anwenders = Brasage avec refusion de CMS; point de vue de l'utilisateur = Reflow soldering of SMDs; the user's viewpointJILLEK, W.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 23-26Conference Paper

Techniques for soldering surface mounted devices to printed circuit boards = Technique de brasage tendre de composants sur des cartes de circuits imprimésBRIERLEY, C. J; CONSIDINE, L; PEDDER, D. J et al.1984, Num 7, pp 25-30, issn 0263-0060Article

Dampfphasen-Loetverfahren = Vapour-phase-soldering1985, Vol 35, Num 4, pp 37-38, issn 0036-7257Article

Perfluoropolyethers ― The most versatile fluids for vapour phase reflow soldering = Perfluoropolyéthers ― Les fluides les plus performants pour le brasage tendre avec refusion en phase vapeurBRIGGS, S.1984, Num 7, pp 6-12, issn 0263-0060Article

Increasing solder joint reliability of leaded surface mounted components = Augmentation de la fiabilité des joints brasés de composants de circuits intégrésDIERKE, J. H.1984, Num 7, pp 13-24, issn 0263-0060Article

Soldering of surface mounted devices : new tasks and their solutions = Brasage tendre des composants montés en surface: nouveaux problèmes et leurs solutionsSTRAUSS, R.1986, Num 10, pp 21-23, issn 0263-0060Article

Development of method to model surface of reflowed square microlens for image sensorKIM, S.-M; CHOI, M; KIM, H et al.Electronics Letters. 2008, Vol 44, Num 7, pp 492-493, issn 0013-5194, 2 p.Article

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

Design and Fabrication of High Numerical Aperture and Low Aberration Bi-Convex Micro Lens ArrayTSAI, Jhy-Cherng; CHEN, Ming-Fong; YANG, Hsiharng et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 174-176, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Effects of reflow on wettability, microstructure and mechanical properties in lead-free soldersGUO, F; CHOI, S; LUCAS, J. P et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1241-1248, issn 0361-5235Conference Paper

Montage en surface = Surface mount technologyANDRE, F.1987, Num 83, pp 10-16, issn 0336-7436Article

Umschmelzen von bestückten Leiterplatten = Méthodes de refusion lors du brasage de plaquettes munies de leurs éléments = Reflow soldering of complete printed circuit boardsRAHN, A.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 57-65Conference Paper

EXAMINATION OF AN AUTOMATED METHOD OF MELTING THE COATING OF PRINTED CIRCUITS WITH SCATTERED INFRA-RED RADIATION = ETUDE D'UNE METHODE AUTOMATISEE DE FUSION DU REVETEMENT DE CIRCUITS IMPRIMES A L'AIDE DE RAYONNEMENTS INFRAROUGES DISPERSESKUDRYAVTSEV VS; OVSEEVICH VL; TRYAPITSYNA AN et al.1979; WELDG PRODUCT.; ISSN 0043-230X; GBR; DA. 1979; VOL. 26; NO 11; PP. 43-44; BIBL. 4 REF.; DE RUS; LOC. IS;[SVAR. PROIZVOD.; SUN; DA. 1979; NO 11; PP. 30-31]Article

Reliability testing of SnAgCu solder surface mount assemblySTAM, F. A; DAVITT, E; BARRETT, J et al.SPIE proceedings series. 1999, pp 259-263, isbn 0-930815-58-0Conference Paper

Aufrichteffekt der drahtlosen Bauteile = Phénomène de relèvement des composants électroniques sans fils lors du brasage = Drawbridging effect during the reflow soldering of leadless componentsKLEIN WASSINK, R. J.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 68-81Conference Paper

Stability of AuSn eutectic solder cap on Au socket during reflowYU, D. Q; OPPERMANN, H; KLEFF, J et al.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 1, pp 55-59, issn 0957-4522, 5 p.Article

Thermal profiling : a reflow process based on the heating factorJIN GANG GAO; YI PING WU; HAN DING et al.Soldering & surface mount technology. 2008, Vol 20, Num 4, pp 20-27, issn 0954-0911, 8 p.Article

Design of a flexible assembly and remanufacturing cell for advanced SM components : selection of cell design concept based on reflow toolsGEREN, N; CAKIRCA, M; BAYRAMOGLU, M et al.Soldering & surface mount technology. 2006, Vol 18, Num 1, pp 29-43, issn 0954-0911, 15 p.Article

Innovations in defluxing engineered chemistries for removing flux residue on back end solder reflowed bumped wafersBIXENMAN, Mike.IEEE/CPMT International Electronics Manufacturing Technology Symposium. 2002, pp 67-72, issn 1089-8190, isbn 0-7803-7301-4, 6 p.Conference Paper

On enhancing eutectic solder joint reliability using a second-reflow-process approachCHIANG, K.-N; LIN, Y.-T; CHENG, H.-C et al.IEEE transactions on advanced packaging. 2000, Vol 23, Num 1, pp 9-14, issn 1521-3323Article

Développements récents du brasage tendreOSAWA, T.Kinzoku Hyomen Gijutsu. 1987, Vol 38, Num 10, pp 462-470, issn 0026-0614Article

La soudure en phase vapeur est une nouvelle technique de soudure en masse développée dans l'industrie électronique = Vapor phase soldering: a new mass-soldering system in the electronic industryFRANCHIMONT, E; DE SMET, C.Revue de la soudure (Bruxelles). 1983, Vol 39, Num 3, pp 89-98, issn 0035-127XArticle

THE HYDROSTATIC MODEL OF THE REDISTRIBUTION OF TIN-LEAD ALLOY IN THE MELTING OF THE COATING OF PRINTED CIRCUIT BOARDS = MODELE HYDROSTATIQUE DE LA REDISTRIBUTION DE L'ALLIAGE ETAIN-PLOMB LORS DE LA FUSIONGOLACHEV SM; KUDRYAVTSEV VS; OVSEEVICH VL et al.1980; WELDG PRODUCT.; ISSN 0043-230X; GBR; DA. 1980; VOL. 27; NO 2; PP. 19-21; BIBL. 6 REF.; DE RUS; LOC. IS;[SVAR PROIZVOD.; SUN; DA. 1980; NO 2; PP. 13-14]Article

RATIONELLE IC-MONTAGE MITTELS IMPULSLOETEN = ECONOMICAL IC-MOUNTING WITH PULSE-SOLDERING TECHNOLOGY = RATIONALISATION DU MONTAGE DES CIRCUITS INTEGRES GRACE AU BRASAGE PAR IMPULSIONSLINDNER K.1981; WEICHLOETEN UND SCHWEISSEN IN ELEKTRONIK UND FEINWERKTECHNIK. INTERNATIONALES KOLLOQUIUM/1981/MUENCHEN; DEU; DUESSELDORF: DVS; DA. 1981; PP. 45-51; BIBL. 2 REF.; LOC. ISConference Paper

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid agingJUN SHEN; CHANGFEI PENG; MALI ZHAO et al.Journal of materials science. Materials in electronics. 2012, Vol 23, Num 7, pp 1409-1414, issn 0957-4522, 6 p.Article