Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

A case study of lead free thick film conductors with lead free solder alloysBOKALO, Peter; SHAHBAZI, Samson; SLIMS, Theresa D et al.SPIE proceedings series. 2003, pp 71-76, isbn 0-8194-5189-4, 6 p.Conference Paper

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

Mechanism of fillet lifting in Sn-Bi alloysBOETTINGER, W. J; HANDWERKER, C. A; NEWBURY, B et al.Journal of electronic materials. 2002, Vol 31, Num 5, pp 545-550, issn 0361-5235Article

New lead-free thick film resistorsHORMADALY, J.SPIE proceedings series. 2002, pp 543-547, isbn 0-930815-66-1, 5 p.Conference Paper

Results of comparative reliability tests on lead-free solder alloysGROSSMANN, Gunter; NICOLETTI, Giovanni; SOLER, Ursin et al.Proceedings - Electronic Components Conference. 2002, pp 1232-1237, issn 0569-5503, isbn 0-7803-7430-4, 6 p.Conference Paper

Selection of Sn-Ag-Cu lead-free alloysSUGANUMA, K; KIM, K. S; HUH, S. H et al.SPIE proceedings series. 2001, pp 529-534, isbn 0-8194-4317-4Conference Paper

Epoxy flux for lead-free solderingWUSHENG YIN; LEE, Ning-Cheng.SPIE proceedings series. 2003, pp 731-738, isbn 0-8194-5189-4, 8 p.Conference Paper

Reliability of tin-lead balled BGAs soldered with lead-free solder pasteNURMI, Sami Tapani; RISTOLAINEN, Eero Olavi.Soldering & surface mount technology. 2002, Vol 14, Num 2, issn 0954-0911, 5, 7, 9, 35-39 [8 p.]Article

Lead-free soldering for CSP : The impact of higher temperature SMT assembly processingSOLBERG, Vern.SPIE proceedings series. 2000, pp 611-616, isbn 0-930815-62-9Conference Paper

On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersDI MAIO, D; HUNT, C. P.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 24-31, issn 0954-0911, 8 p.Article

Reliability and microstructure of lead-free solder die attach interface in silicon power devicesHUFF, D; KATSIS, D; STINSON-BAGBY, K et al.IEEE international reliability physics symposium. 2004, pp 567-568, isbn 0-7803-8315-X, 1Vol, 2 p.Conference Paper

Reliability of lead free BGA packagesPRASAD, Swaminath; CARSON, Flynn; KIM, G. S et al.SPIE proceedings series. 2000, pp 722-726, isbn 0-930815-62-9Conference Paper

Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloysKOBAYASHI, Takuji; SASAKI, Katsuhiko.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 4, pp 343-353, issn 0957-4522, 11 p.Article

Rapid assessment of steady-state creep rates and stress dip effects in solder alloysGREASLEY, A.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 1, pp 43-47, issn 0957-4522Article

Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixingTAY, S. L; HASEEB, A. S. M. A; MOHD RAFIE JOHAN et al.Soldering & surface mount technology. 2011, Vol 23, Num 1, pp 10-14, issn 0954-0911, 5 p.Article

Enthalpies of mixing of liquid systems for lead free soldering: Al-Cu-Sn systemFLANDORFERA, Hans; RECHCHACH, Meryem; ELMAHFOUDI, A et al.Journal of chemical thermodynamics. 2011, Vol 43, Num 11, pp 1612-1622, issn 0021-9614, 11 p.Article

Pb-Free Synthesis: Decision Matrix as a Tool for Alloy SelectionQUINTERO, Pedro O; VALENTIN, Ricky; MA, David et al.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 1, pp 25-34, issn 1551-4897, 10 p.Article

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERSWANG, Y. W; LIN, Y. W; KAO, C. R et al.Microelectronics and reliability. 2009, Vol 49, Num 3, pp 248-252, issn 0026-2714, 5 p.Article

Dissolution of copper on Sn-Ag-Cu system lead free solderIZUTA, Goro; TANABE, Tsuyoshi; SUGANUMA, Katsuaki et al.Soldering & surface mount technology. 2007, Vol 19, Num 2, pp 4-11, issn 0954-0911, 8 p.Article

Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packagingBAILEY, Christopher; LIU, Johan.Soldering & surface mount technology. 2006, Vol 18, Num 2, issn 0954-0911, 53 p.Serial Issue

Lead-free solder flip chips on FR-4 substrates with different surface finishes, underfills and fluxesSJOBERG, Jonas; GEIGER, David A; SHANGGUAN, Dongkai et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 31-36, isbn 0-7803-8582-9, 1Vol, 6 p.Conference Paper

Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallizationLIU, C. Y; WANG, S. J.Journal of electronic materials. 2003, Vol 32, Num 1, pp L1-L3, issn 0361-5235Article