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au.\*:("CARRON, V")

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Realization and characterization of thin single crystal Ge films on sapphireBOGUMILOWICZ, Y; ABBADIE, A; DROUIN, A et al.Semiconductor science and technology. 2013, Vol 28, Num 3, issn 0268-1242, 035013.1-035013.8Article

High mobility CMOS: First demonstration of planar GeOI p-FETs with SOI n-FETsLE ROYER, C; DAMLENCOURT, J.-F; ARVET, C et al.Solid-state electronics. 2011, Vol 59, Num 1, pp 2-7, issn 0038-1101, 6 p.Conference Paper

Self-Aligned Planar Double-Gate MOSFETs by Bonding for 22-nm Node, With Metal Gates, High-κ Dielectrics, and Metallic Source/DrainVINET, M; POIROUX, T; BAUD, L et al.IEEE electron device letters. 2009, Vol 30, Num 7, pp 748-750, issn 0741-3106, 3 p.Article

Optimized nickel silicide process formation for high performance sub-65nm CMOS nodesFROMENT, B; CARRON, V; MORAND, Y et al.Proceedings - Electrochemical Society. 2004, pp 191-201, issn 0161-6374, isbn 1-56677-406-3, 11 p.Conference Paper

Measurement of As diffusivity in Ni2Si thin filmsBLUM, I; PORTAVOCE, A; MANGETINCK, D et al.Microelectronic engineering. 2010, Vol 87, Num 3, pp 263-266, issn 0167-9317, 4 p.Conference Paper

Characterization of CMOS sub-65 nm metallic contact by laser scattering : Thermal stability of Ni(Si1-xGex)ARRAZAT, B; DANEL, A; CAMPIDELLI, Y et al.Microelectronic engineering. 2007, Vol 84, Num 11, pp 2558-2562, issn 0167-9317, 5 p.Conference Paper

Redistribution of arsenic during the reaction of nickel thin films with silicon at relatively high temperature : Role of agglomerationHOUMMADA, K; MANGELINCK, D; PERRIN, C et al.Microelectronic engineering. 2006, Vol 83, Num 11-12, pp 2264-2268, issn 0167-9317, 5 p.Conference Paper

Work function tuning through dopant scanning and related effects in Ni fully silicided gate for sub-45nm nodes CMOSAIME, D; FROMENT, B; LAVIRON, C et al.International Electron Devices Meeting. 2004, pp 87-90, isbn 0-7803-8684-1, 1Vol, 4 p.Conference Paper

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