au.\*:("CHAN, Yan-Cheong")
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Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn―58Bi solder jointISMATHULLAKHAN, Shafiq; LAU, Hungyin; CHAN, Yan-Cheong et al.Microsystem technologies. 2013, Vol 19, Num 7, pp 1069-1080, issn 0946-7076, 12 p.Article
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesivesCHUNYAN YIN; HUA LU; BAILEY, Chris et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 254-259, issn 1521-334X, 6 p.Conference Paper
Surfactant-assisted processing of polyimide/ multiwall carbon nanotube nanocomposites for microelectronics applicationsTANG, Qing-Yuan; CHAN, Yan-Cheong; WONG, Ning-Bew et al.Polymer international. 2010, Vol 59, Num 9, pp 1240-1245, issn 0959-8103, 6 p.Article
Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processesANDRAE, Anders S. G; MÖLLER, Patrik; ANDERSON, Johan et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 233-245, issn 1521-334X, 13 p.Conference Paper
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumpsCHU, Kun-Mo; LEE, Jung-Sub; HAN SEO CHO et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 246-253, issn 1521-334X, 8 p.Conference Paper