Customized glass sealant for ceramic substrates for high temperature electronic applicationSHARIF, Ahmed; CHEE LIP GAN; ZHONG CHEN et al.Microelectronics and reliability. 2014, Vol 54, Num 12, pp 2905-2910, issn 0026-2714, 6 p.Article

Shape Memory and Superelastic Ceramics at Small ScalesALAN LAI; ZEHUI DU; CHEE LIP GAN et al.Science (Washington, D.C.). 2013, Vol 341, Num 6153, pp 1505-1508, issn 0036-8075, 4 p.Article

Effect of direct current stressing to Cu―Cu bond interface imperfection for three dimensional integrated circuitsMADE, Riko I; PENG LAN; HONG YU LI et al.Microelectronic engineering. 2013, Vol 106, pp 149-154, issn 0167-9317, 6 p.Conference Paper

Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrateSHARMA, Gaurav; SER CHOONG CHONG; EBIN, Liao et al.Thin solid films. 2007, Vol 515, Num 7-8, pp 3315-3322, issn 0040-6090, 8 p.Article

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizationsALAM, Syed M; CHEE LIP GAN; THOMPSON, Carl V et al.Microelectronics journal. 2007, Vol 38, Num 4-5, pp 463-473, issn 0959-8324, 11 p.Conference Paper

Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin FilmsSASANGKA, Wardhana A; CHEE LIP GAN; THOMPSON, Carl V et al.Journal of electronic materials. 2011, Vol 40, Num 11, pp 2329-2336, issn 0361-5235, 8 p.Article

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stressMENG KEONG UMA; JINGYUAN LIN; YONG CHIANG EE et al.Microelectronics and reliability. 2012, Vol 52, Num 8, pp 1553-1558, issn 0026-2714, 6 p.Conference Paper

Crystallization and thermal stability of Sn-doped Ge₂Sb₂Te₅ phase change materialMEI LING LEE; KOK THONG YONG; CHEE LIP GAN et al.Journal of physics. D, Applied physics (Print). 2008, Vol 41, Num 21, issn 0022-3727, 215402.1-215402.5Article

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parametersLIM, Adeline B. Y; CHANG, Andrew C. K; YAUW, Oranna et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2555-2563, issn 0026-2714, 9 p.Article

Vapor―Liquid―Solid Growth of Endotaxial Semiconductor NanowiresSHAOZHOU LI; XIAO HUANG; QING LIU et al.Nano letters (Print). 2012, Vol 12, Num 11, pp 5565-5570, issn 1530-6984, 6 p.Article

Study of Ag-In solder as low temperature wafer bonding intermediate layerMADE, Riko I; CHEE LIP GAN; LEE, Chengkuo et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 68840H.1-68840H.9, issn 0277-786X, isbn 978-0-8194-7059-1Conference Paper