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Thermal-flow techniques for sub-35 nm contact-hole fabrication using Taguchi method in electron-beam lithographyLI, Te-Sheng; CHEN, Szu-Hung; CHEN, Hsuen-Li et al.Microelectronic engineering. 2009, Vol 86, Num 11, pp 2170-2175, issn 0167-9317, 6 p.Article

Enhanced Piezoelectricity of Nanoimprinted Sub-20 nm Poly(vinylidene fluoride―trifluoroethylene) Copolymer NanograssHONG, Chien-Chong; HUANG, Sheng-Yuan; SHIEH, Jiann et al.Macromolecules (Print). 2012, Vol 45, Num 3, pp 1580-1586, issn 0024-9297, 7 p.Article

Extreme UV diffraction grating fabricated by nanoimprint lithographyLIN, Chun-Hung; LIN, Yi-Ming; LIANG, Chia-Ching et al.Microelectronic engineering. 2012, Vol 98, pp 194-197, issn 0167-9317, 4 p.Conference Paper

Comparison of silicon nanocrystals embedded silicon oxide films by sputtering and PECVDHSIAO, Chu-Yun; SHIH, Chuan-Feng; CHEN, Szu-Hung et al.Thin solid films. 2011, Vol 519, Num 15, pp 5086-5089, issn 0040-6090, 4 p.Conference Paper

Fabrication of 0.15-μm Γ-shaped gate In0.52Al0.48As /In0.6Ga0.4As metamorphic HEMTs using DUV lithography and tilt dry-etching techniqueLIEN, Yi-Chung; CHEN, Szu-Hung; YI CHANG, Edward et al.IEEE electron device letters. 2007, Vol 28, Num 2, pp 93-95, issn 0741-3106, 3 p.Article

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