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au.\*:("CHUNYAN YIN")

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Design for reliability of power electronics modulesHUA LU; BAILEY, Chris; CHUNYAN YIN et al.Microelectronics and reliability. 2009, Vol 49, Num 9-11, pp 1250-1255, issn 0026-2714, 6 p.Conference Paper

Prevalence and risk factors of obesity among school-aged children in Xi'an, ChinaXIAOQING YI; CHUNYAN YIN; MING CHANG et al.European journal of pediatrics. 2012, Vol 171, Num 2, pp 389-394, issn 0340-6199, 6 p.Article

Action of tenuazonic acid, a natural phytotoxin, on photosystem II of spinachSHIGUO CHEN; CHUNYAN YIN; XINBIN DAI et al.Environmental and experimental botany. 2008, Vol 62, Num 3, pp 279-289, issn 0098-8472, 11 p.Article

Reactive oxygen species from chloroplasts contribute to 3-acetyl-5-isopropyltetramic acid-induced leaf necrosis of Arabidopsis thalianaSHIGUO CHEN; CHUNYAN YIN; RETO JÖRG STRASSER et al.Plant physiology and biochemistry (Paris). 2012, Vol 52, pp 38-51, issn 0981-9428, 14 p.Article

Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesivesCHUNYAN YIN; HUA LU; BAILEY, Chris et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 254-259, issn 1521-334X, 6 p.Conference Paper

Geochemistry of trace metals and Pb isotopes of sediments from the lowermost Xiangjiang River, Hunan Province (P. R. China): implications on sources of trace metalsBO PENG; XIAOYA TANG; CHANGXUN YU et al.Environmental earth sciences (Print). 2011, Vol 64, Num 5, pp 1455-1473, issn 1866-6280, 19 p.Article

Application of fast chlorophyll a fluorescence kinetics to probe action target of 3-acetyl-5-isopropyltetramic acidSHIGUO CHEN; FENGYAN ZHOU; CHUNYAN YIN et al.Environmental and experimental botany. 2011, Vol 73C, pp 31-41, issn 0098-8472, 11 p., NSConference Paper

Modelling methodology for thermal analysis of hot solder dip process : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMSSTOYANOV, Stoyan; BAILEY, Chris; ALAM, M. O et al.Microelectronics and reliability. 2013, Vol 53, Num 8, pp 1055-1067, issn 0026-2714, 13 p.Conference Paper

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