VERFAHREN ZUR HERSTELLUNG VON LEITERPLATTEN, SYSTEMATISIERUNG, GEGENWAERTIGER STAND UND TECHNOLOGISCHE PERSPEKTIVE. III. FORTIGUNGSVERFAHREN FUER MEHRLAGEN-MEHRSCHICHTLEITERPLATTEN. = PROCEDES DE FABRICATION DES PLAQUETTES POUR CIRCUITS IMPRIMES. SYSTEMATISATION, SITUATION ACTUELLE ET PERSPECTIVES TECHNOLOGIQUES. III. PROCEDES DE FABRICATION DES PLAQUETTES MULTICOUCHES A CIRCUITS SUPERPOSESFABIAN H; FRANCK P.1974; FEINGERAETETECHNIK; DTSCH.; DA. 1974; VOL. 23; NO 5; PP. 205-209Article

PRINTED-WIRING PROCESSING MATERIALS AND TECHNIQUES. = MATERIAUX ET TECHNIQUES DE TRAITEMENT DE CABLAGES IMPRIMESSCHNORR DP.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 98-114 (9P.); BIBL. 4 REF.Article

PRINTED-WIRING SUBSTRATES.SAMPSON RN.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 70-82 (8P.); BIBL. 11 REF.Article

LE CIRCUIT IMPRIME EN EVOLUTION1980; COMPOS. MEC., ELECTR. ELECTRON.; ISSN 0339-1558; FRA; DA. 1980; NO 119; PP. 41-44; 3 P.Article

FABRICATING RELIABILITY INTO FLEXIBLE PRINTED WIRING.HAYS SA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 7; PP. 111-117Article

MACHINE STAKABLE MULTILAYER BOARD TERMINATIONS SPEED ASSEMBLY, MINIMIZE HOLE DAMAGE.FITTING PE.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 6; PP. 45-47Article

FLEXIBLE CIRCUITS BEND TO DESIGNERS' WILL.LYMAN J.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 19; PP. 97-105Article

PC BOARD LAMINATORS CUT COSTS BY DOLLAR-THOUSANDS PER YEAR WITH NEW PRESSPAD1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 40Article

SOLDER FUSED INTERCONNECTIONS IN MULTILAYER CIRCUITS.VOIDA G.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 10; PP. 77-82; BIBL. 2 REF.Article

TROUBLE SHOOTING MANUAL FOR PRINTED CIRCUIT PRODUCTION.JAWITZ MW.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 4; PP. P.5-P.38(28P.)Article

INTERCONNECTING WITH FLEXIBLE CIRCUITRY.RAUSCH JM.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 5; PP. 91-98 (5P.); BIBL. 5 REF.Article

TOLERANCE ANALYSIS FOR MULTILAYER PC'S. = ANALYSE DE TOLERANCE POUR CIRCUITS IMPRIMES MULTICOUCHESJONES RA.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 6; PP. 62-68 (5P.)Article

LES CIRCUITS IMPRIMES SOUPLES.1974; COMPOSANTS MEC., ELECTR. ELECTRON.; FR.; DA. 1974; NO 53; PP. 68-77 (6P.)Article

FLEXIBLE CIRCUITS USING A POLYIMIDE FILM SUBSTRATESIMPSON SK.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 12; PP. 27-29Article

FACTORS TO CONSIDER WHEN USING AND FABRICATING FLEXIBLE CIRCUITSLAMOUREUX RT.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 7; PP. 176-179Article

IMPLANTATION DES LIAISONS CONDUCTRICES DES PLAQUES IMPRIMEES A PLUSIEURS COUCHES EN UTILISANT DES MICROCIRCUITS DE COMMUTATIONTESLENKO VP; ROMASHKO VI; POLYANSKIJ GA et al.1975; ELEKTRON. I MODELIROVAN, U.S.S.R.; S.S.S.R.; DA. 1975; NO 7; PP. 82-83; BIBL. 2 REF.Article

SURVEYING TODAY'S MULTILAYER PC SUPPLIERS.MARKSTEIN HW.1978; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1978; VOL. 18; NO 6; PP. 64-68; (4 P.)Article

PC PROFILING: A CHOICE OF METHODS.BRONIS R.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 6; PP. 44-48 (4P.)Article

NEW TOPOLOGICAL METHOD FOR LAYING OUT PRINTED CIRCUITSBASDEN A; NICHOLS KG.1973; PROC. INSTN ELECTR. ENGRS; G.B.; DA. 1973; VOL. 120; NO 3; PP. 325-328; BIBL. 5 REF.Serial Issue

DESIGNING FLEXIBLE CIRCUITS: WHAT THE MANUFACTURER NEEDS TO KNOW. ISAWYER NJ; TAYLOR ML.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 4; PP. 93-94Article

FLEXIBLE CIRCUITS. A PACKAGING PRODUCT WHOSE TIME HAS COME.POLLACK HW.1975; IN: ANNU. CONNECTOR SYMP. 8. PROC.; CHERRY HILL, N.J.; 1975; CAMDEN; ELECTRON. CONNECTOR STUDY GROUP INC.; DA. 1975; PP. 265-274Conference Paper

KONSTRUKTIVE UND TECHNOLOGISCHE PROBLEME BEIM EINSATZ FLEXIBLER KUPFERKASCHIERTER BASISMATERIALIEN IN DER GERAETEVERDRAHTUNG. = LES PROBLEMES TECHNOLOGIQUES ET DE CONSTRUCTION LORS DE L'EMPLOI DE MATERIAUX CONDUCTEURS FLEXIBLES A MASQUE DANS LE CABLAGEBRUNNER E.1975; FEINGERAETETECHNIK; DTSCH.; DA. 1975; VOL. 24; NO 12; PP. 554-559; BIBL. 12 REF.Article

DRAWING MICROWAVE PRINTED CIRCUIT MASKS BY COMPUTER1973; SOLID STATE TECHNOL.; U.S.A.; DA. 1973; VOL. 16; NO 6; PP. 59Serial Issue

METHODE D'ELABORATION DE DISPOSITIFS MICRO-ELECTRONIQUES A L'AIDE D'UN CALCULATEURMOROZOV KK.1973; IZVEST. VYSSH. UCHEBN. ZAVED., RADIOELEKTRON.; S.S.S.R.; DA. 1973; VOL. 16; NO 4; PP. 35-39Serial Issue

AN ALGORITHM FOR SINGLE-ROW ROUTING WITH PRESCRIBED STREET CONGESTIONSTSUKIYAMA S; KUH ES; SHIRAKAWA J et al.1980; I.E.E.E. TRANS. CIRCUITS SYST.; USA; DA. 1980; VOL. 27; NO 9; PP. 765-772; BIBL. 12 REF.Article