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VERFAHREN ZUR HERSTELLUNG VON LEITERPLATTEN, SYSTEMATISIERUNG, GEGENWAERTIGER STAND UND TECHNOLOGISCHE PERSPEKTIVE. III. FORTIGUNGSVERFAHREN FUER MEHRLAGEN-MEHRSCHICHTLEITERPLATTEN. = PROCEDES DE FABRICATION DES PLAQUETTES POUR CIRCUITS IMPRIMES. SYSTEMATISATION, SITUATION ACTUELLE ET PERSPECTIVES TECHNOLOGIQUES. III. PROCEDES DE FABRICATION DES PLAQUETTES MULTICOUCHES A CIRCUITS SUPERPOSESFABIAN H; FRANCK P.1974; FEINGERAETETECHNIK; DTSCH.; DA. 1974; VOL. 23; NO 5; PP. 205-209Article

DU NOUVEAU EN MATIERE DE FABRICATION DE CIRCUITS IMPRIMES SIMPLE ET DOUBLE FACE1973; SOC. R. BELGE ELECTRICIENS, BULL.; BELG.; DA. 1973; VOL. 89; NO 1; PP. 25Serial Issue

METHODS FOR ACHIEVING HIGH DENSITY CIRCUIT PATTERNS.DANZIG AC.1975; INSULAT. CIRCUITS; U.S.A.; DA. 1975; VOL. 21; NO 9; PP. 36-37Article

PRINTED-WIRING PROCESSING MATERIALS AND TECHNIQUES. = MATERIAUX ET TECHNIQUES DE TRAITEMENT DE CABLAGES IMPRIMESSCHNORR DP.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 98-114 (9P.); BIBL. 4 REF.Article

PRINTED-WIRING SUBSTRATES.SAMPSON RN.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 70-82 (8P.); BIBL. 11 REF.Article

LE CIRCUIT IMPRIME EN EVOLUTION1980; COMPOS. MEC., ELECTR. ELECTRON.; ISSN 0339-1558; FRA; DA. 1980; NO 119; PP. 41-44; 3 P.Article

FABRICATING RELIABILITY INTO FLEXIBLE PRINTED WIRING.HAYS SA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 7; PP. 111-117Article

MACHINE STAKABLE MULTILAYER BOARD TERMINATIONS SPEED ASSEMBLY, MINIMIZE HOLE DAMAGE.FITTING PE.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 6; PP. 45-47Article

MICROSECTION EVALUATION OF PLATED THROUGH-HOLE BOARDSSTROHMER J.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 10; PP. 39Article

OPTIMUM PROCEDURES FOR FABRICATING RIGID-FLEXIBLE MULTILAYER BOARDS.CURRIER RF.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 5; PP. 29-31Article

LE CIRCUIT IMPRIME: METALLISATION-PTH-METHODES ADDITIVESLEMEUNIER P.1980; ELECTRON. APPL.; FRA; DA. 1980; NO 14; PP. 81-89Article

BEARBEITUNG VON MULTILAYER- UND FLEXSCHALTUNGEN = MISE EN OEUVRE DES CIRCUITS IMPRIMES MULTICOUCHES ET DES CIRCUITS IMPRIMES SOUPLESGRAPENTIN HJ; WOLFF J.1979; GALVANOTECHNIK; DEU; DA. 1979; VOL. 70; NO 10; PP. 958-960; ABS. ENG/FREArticle

FLEXIBLE CIRCUITS BEND TO DESIGNERS' WILL.LYMAN J.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 19; PP. 97-105Article

PC BOARD LAMINATORS CUT COSTS BY DOLLAR-THOUSANDS PER YEAR WITH NEW PRESSPAD1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 40Article

SOLDER FUSED INTERCONNECTIONS IN MULTILAYER CIRCUITS.VOIDA G.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 10; PP. 77-82; BIBL. 2 REF.Article

TROUBLE SHOOTING MANUAL FOR PRINTED CIRCUIT PRODUCTION.JAWITZ MW.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 4; PP. P.5-P.38(28P.)Article

INTERCONNECTING WITH FLEXIBLE CIRCUITRY.RAUSCH JM.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 5; PP. 91-98 (5P.); BIBL. 5 REF.Article

TOLERANCE ANALYSIS FOR MULTILAYER PC'S. = ANALYSE DE TOLERANCE POUR CIRCUITS IMPRIMES MULTICOUCHESJONES RA.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 6; PP. 62-68 (5P.)Article

LES CIRCUITS IMPRIMES SOUPLES.1974; COMPOSANTS MEC., ELECTR. ELECTRON.; FR.; DA. 1974; NO 53; PP. 68-77 (6P.)Article

RECHNERGESTUETZTER ENTWICKLUNGSPROZESS FUER DIE HERSTELLUNG DER VERDRAHTUNGSUNTERLAGEN EINER HYBRIDEN RUECKVERDRAHTUNG. = PROCESSUS DE DEVELOPPEMENT ASSISTE PAR CALCULATEUR POUR LA PRODUCTION DES SUPPORTS DE CABLAGE D'UN CABLAGE ARRIERE HYBRIDEHOCHSTRATE H.1974; NACHR.-TECH., ELEKTRON.; DTSCH.; DA. 1974; VOL. 24; NO 12; PP. 466-467Article

THROUGH-SECTIONING: TO THE ROOT CAUSES OF PCB DEFECTS.NELSON JA.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 11; PP. 120-127 (7P.)Article

TRACE AUTOMATIQUE DES PLAQUETTES A CIRCUITS IMPRIMESBOWDEN FG; LOVITT GJ.1972; REV. TELECOMMUNIC.; FR.; DA. 1972; VOL. 47; NO 4; PP. 264-269; BIBL. 7 REF.Serial Issue

DESIGNING FLEXIBLE CIRCUITS: WHAT THE MANUFACTURER NEEDS TO KNOW-PART TWOSAWYER NJ; TAYLOR ML.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 6; PP. 49-52; BIBL. 5 REF.Article

PHOTOGRAPHIC TECHNIQUES FOR DOUBLE-SIDED PRINTED CIRCUITS.DOLBY RF.1974; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGR.; BRUSSELS; 1974; SURBITON, ENGL.; KIVER COMMUN.; DA. 1974; PP. 87-93; BIBL. 2 REF.Conference Paper

VERFAHREN ZUR HERSTELLUNG VON LEITERPLATTEN. SYSTEMATISIERUNG, GEZENWAERTIGER STAND UND TECHNOLOGISCHE PERSPEKTIVE. V. FERTIGUNGSVERFAHREN FUER EIN- UND MEHRSCHICHTIGE VERDRAHTUNGSTRAEGER; TECHNOLOGISCHE PERSPEKTIVE DER LEITERPLATTEN. = METHODE PAR LA PRODUCTION DE PLAQUETTES POUR CIRCUITS IMPRIMES. SYSTEMATISATION, ETAT ACTUEL ET PERSPECTIVES ECONOMIQUES. V. METHODES DE FABRICATION POUR DES SUPPORTS DE CABLAGE A UNE ET PLUSIEURS COUCHES; PERSPECTIVES TECHNOLOGIQUES DE PLAQUETTES POUR CIRCUITS IMPRIMESFABIAN H; FRACK P.1974; FEINGERAETETECHNIK; DTSCH.; DA. 1974; VOL. 23; NO 8; PP. 373-375; BIBL. 12 REF.Article

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