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THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

GLOSSARY OF THICK FILM CIRCUIT TERMINOLOGYDRYDEN W.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 3; PP. 31-32Article

SCREENS FOR SCREEN PRINTING OF ELECTRONIC CIRCUITS.DUBEY GC.1974; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1974; VOL. 13; NO 3; PP. 203-207; BIBL. 9 REF.Article

RICERCA DI UNA NORMALIZZAZIONE NELLA RELIZZAZIONE DI UN IBRIDO A STRATO SPESSO. = RECHERCHE D'UNE NORMALISATION DANS LA REALISATION D'UN CIRCUIT HYBRIDE A COUCHE EPAISSECASTRACANI G; GORLA G.1976; ALTA FREQ.; ITAL.; DA. 1976; VOL. 45; NO 1; PP. 77-81Article

A THICK-FILM MICROCIRCUIT LABORATORYLUCAS MSP; DAWES WH.1973; I.E.E.E. TRANS. EDUC.; U.S.A.; DA. 1973; VOL. 16; NO 3; PP. 130-137; BIBL. 42 REF.Serial Issue

LOW COST SUBSTRATE FOR THICK FILM CIRCUITS USING PORCELAIN.1978; NEW ELECTRON.; G.B.; DA. 1978; PP. 36Article

FINE LINE SCREEN PRINTING YIELDS AS A FUNCTION OF PHYSICAL DESIGN PARAMETERS.WEBSTER R.1975; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1975; VOL. 4; NO 1; PP. 14-20Article

FINE LINE PROCESSING GUIDELINESPRATHER JB; SLOWINSKI RP.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 3; PP. 67-78 (7 P.)Serial Issue

THICK FILM CIRCUIT MODULES FOR C.R.T. DISPLAYSEASTWOOD S.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 118-121; (2 P.)Article

SCREENED MULTILAYER CERAMICS FOR THICK FILM HYBRIDS.IHOCHI T.1974; I.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1974; VOL. 10; NO 2; PP. 115-119; BIBL. 4 REF.Article

HYBRIDSCHALTUNGEN IN DICKFILMTECHNIK = CIRCUITS HYBRIDES A COUCHES EPAISSESWINIGER F.1973; P.T.T. BULL. TECH.; SUISSE; DA. 1973; VOL. 51; NO 2; PP. 68-73; ABS. FR. ITALSerial Issue

IN-HOUSE ARTWORK AND SCREEN FABRICATION FOR PROTOTYPE THICK FILM CIRCUITRYSOOKIKIAN V.1972; SOLID STATE TECHNOL.; U.S.A.; DA. 1972; VOL. 15; NO 6; PP. 42-47Serial Issue

UNDERSTANDING THICK AND THIN FILM NETWORKSHART PJ.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 104-106; (3 P.)Article

GE EXTENDS AUTOMATION OF THICK-FILM HYBRID PRODUCTION.GISLER HJ JR.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 11; PP. 105-110 (4P.)Article

"A THICK FILM ELECTRONIC HYBRID COIL".JACKSON LN.1975; PROC. I.R.E.E.; AUSTRAL.; DA. 1975; VOL. 36; NO 5; PP. 117-118; BIBL. 2 REF.Article

INFLUENCE OF ENCAPSULATING RESINS ON THE STABILITY OF THICK-FILM RESISTORS.CATTANEO A; MAGNETI MARELLI FI.1974; ALTA FREQ.; ITAL.; DA. 1974; VOL. 43; NO 12; PP. 1047-1050; BIBL. 6 REF.Article

PRODUCTION OF THICK FILM CIRCUITS BY PLASMA SPRAYING.SMYTH RT.1974; IN: SCI. TECHNOL. SURF. COATING. NATO ADV. STUDY INST.; LONDON; 1972; LONDON; ACAD. PRESS; DA. 1974; PP. 300-307; BIBL. 1 REF.Conference Paper

A HIGH DENSITY THICK FILM MULTILAYER PROCESS FOR LSI CIRCUITS.ILGENFRITZ RW; MOGEY LE; WALTER DW et al.1974; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1974; VOL. 10; NO 3; PP. 165-168; BIBL. 3 REF.; (ELECTRON. COMPONENTS CONF.; WASHINGTON; 1974)Conference Paper

REALISATION DE CIRCUITS ACTIFS HYBRIDES A COUCHE EPAISSECHMIELEWSKI JW; KSEPKO J.1973; ZESZ. NAUK. POLITECH. GDANSK., ELEKTRON.; POLSKA; DA. 1973; NO 31; PP. 79-91; ABS. ANGL. RUSSE; BIBL. 14 REF.Article

CUSTOM DESIGN OF THICK-FILM HYBRID ICS1982; JEE. JOURNAL OF ELECTRONIC ENGINEERING; ISSN 0385-4507; JPN; DA. 1982; VOL. 19; NO 190; PP. 40-43Article

SOME PROBLEMS AND POSSIBLE SOLUTIONS FOR HYBRID MICRO-CIRCUIT RELIABILITYSINNADURA FN; WILSON KJ; BRACE DWJ et al.1980; MICROELECTRON. J.; GBR; DA. 1980; VOL. 11; NO 1; PP. 26-36; BIBL. 12 REF.Article

STENCIL SCREENS FOR FINE-LINE PRINTINGSTALNECKER SG JR.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 507-516; BIBL. 3 REF.Conference Paper

HIGH-SPEED THICK FILM PRINTING ASSESSING THE CRITICAL VARIABLES.POLINSKY PW.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 26-30 (3P.)Article

HYBRID INTERCONNECTION OF I.C.'S BY MEANS OF PATTERNS ON FLEXIBLE TAPE.VAN DER DRIFT A; NICKL VAN NIKELSBERG KF.1977; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1977; VOL. 4; NO 2; PP. 53-56; BIBL. 3 REF.Article

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