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INNOVATIONS IN HYBRID PACKAGINGMARKSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 9; PP. 40-44; (4 P.); BIBL. 1 REF.Article

PACKAGING A HIGH-DENSITY HYBRID MULTIPLEXER.POLIN D; WILLIAMSON M.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 11; PP. 79-81Article

DEVELOPING A NANUFACTURING TECHNOLOGY FOR POWER HYBRIDSHAMILL AT; MARTHINUSS JE; RAZZETTI LA et al.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 9; PP. 72-76; 4 P.Article

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

QUALITY AND RELIABILITY IN HYBRID CIRCUITSREAD RF.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 555-560Conference Paper

UNIVERSELLER FREQUENZTEILER IN HYBRIDTECHNIK = DIVISEUR DE FREQUENCE UNIVERSEL EN TECHNIQUE HYBRIDEWETZKO M; STREUBEL P; ALTHUS J et al.1979; RADIO FERNSEHEN ELEKTRON.; DDR; DA. 1979; VOL. 28; NO 1; PP. 19-21; BIBL. 8 REF.Article

HYBRID TECHNOLOGY-BEST SUPPORTING ACTOR.BOUCHARD JG.1977; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1977; VOL. 6; NO 4; PP. 65-68; BIBL. 9 REF.Article

RELIABILITY TESTING OF B.A.C. HYBRID CIRCUITS.TAYLOUR CH.1977; MICROELECTRON. AND RELIAB.; G.B.; DA. 1977; VOL. 16; NO 4; PP. 295-302; (SEMICOND. TECHNOL. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1977)Conference Paper

PROBLEMI CONNESSI ALLA VALUTAZIONE ED ALL' IMPIEGO DI CONTENITORI PLASTICI IN APPLICAZIONI A VITA UTILE MOLTO LUNGA. = PROBLEMES LIES A L'EVALUATION ET A EMPLOI DE CONTAINERS EN PLASTIQUE A DUREE DE VIE TRES LONGUEBASILE L; FANTINI F.1976; ALTA FREQ.; ITAL.; DA. 1976; VOL. 45; NO 5; PP. 324-332; BIBL. 54 REF.Article

PROBLEMES ET SOLUTIONS DE L'INTEGRATION HYBRIDE EN HYPERFREQUENCE.BENOIT JJ.1975; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1975; NO 205; PP. 19-21Article

CARACTERISTIQUES ECONOMIQUES DE CONSTRUCTION DE GRANDS CIRCUITS INTEGRES HYBRIDESPOPOV VP; IVANTSOV VP; CHERNOV IV et al.1975; IZVEST. VYSSH. UCHEBN. ZAVED., RADIOELEKTRON.; S.S.S.R.; DA. 1975; VOL. 18; NO 12; PP. 3-10; BIBL. 5 REF.Article

AN APPROACH FOR EVALUATING EPOXY ADHESIVES FOR USE IN HYBRID MICROELECTRONIC ASSEMBLY.PLANTING PY.1975; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1975; VOL. 11; NO 4; PP. 305-311; BIBL. 5 REF.Article

COMPUTER-AIDED DESIGN OF HYBRID IC MASK.KOJIMA T; YANAGI M; UYEHARA T et al.1974; FUJITSU SCI. TECH. J.; JAP.; DA. 1974; VOL. 10; NO 1; PP. 75-93; BIBL. 5 REF.Article

BUILD A 12 OCTAVE HYBRID AMPLIFIER.STURZU P.1974; MICROWAVES; U.S.A.; DA. 1974; VOL. 13; NO 6; PP. 54-57; BIBL. 9 REF.Article

ETAGE DE SEUIL THERMOSTABLE, SENSIBLEZHERNOV AI; PRONKIN NS; VORONOVICH AP et al.1981; PRIB. TEH. EKSP.; ISSN 0032-8162; SUN; DA. 1981; NO 6; PP. 117-118; BIBL. 1 REF.Article

COMPONENT VERIFICATION SYSTEMSCHROEDER DD; HINES RE.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 367-369Article

RESISTOR GRIDS IN HYBRID CIRCUITSBAPESWARA RAO VV; MURTHY MJR.1980; MICROELECTRON J.; GBR; DA. 1980; VOL. 11; NO 4; PP. 24-26; BIBL. 4 REF.Article

A TECHNIQUE FOR THE MEASUREMENT OF HOT SPOTS AND ISOTHERM PROFILES AT THE SURFACES OF THE ELEMENTS OF HYBRID MICROCIRCUITSSINNADURAI FN.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 6; NO 3-4; PP. 177-183; BIBL. 6 REF.Article

ETUDE DE FIABILITE DES SEMICONDUCTEURS POUR CIRCUITS HYBRIDES DANS DIFFERENTS TYPES D'ENCAPSULATION COLLECTIVEVAL C; FORGEOT D'ARC B.1979; ; FRA; DA. 1979; CNET-78 9B 115; NON PAG.: DIAGR.; 30 CMReport

HYBRID TECHNOLOGY TAKES ON JOBS TOO THROUGH FOR MONOLITHIC ICS.TACHIKAWA I.1976; J. ELECTRON. ENGNG; JAP.; DA. 1976; NO 110; PP. 42-45Article

FILTRES ACTIFS EN HYBRIDE: EVOLUTION ET MARCHES.CUNTZ G.1976; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1976; NO 219; PP. 15-21Article

LOW TEMPERATURE PROCESSING IN HYBRID MANUFACTURING INCREASES SURVIVAL RATE.GILLIS TG.1975; INSULAT. CIRCUITS; U.S.A.; DA. 1975; VOL. 21; NO 6; PP. 19-22; BIBL. 1 REF.Article

AUFBAU UND TECHNOLOGIE VON MIC-ZIRKULATOREN HOHER GUETE. = STRUCTURE ET TECHNOLOGIE DES CIRCULATEURS MIC DE HAUTE QUALITEBRUN D; DEUTSCH J.1975; NACHR.-TECH. Z.; DTSCH.; DA. 1975; VOL. 28; NO 9; PP. 289-291; ABS. ANGL.; BIBL. 4 REF.Article

SUBSTRATE CHOICE AND RESULTANT HYBRID CONSTRUCTION TECHNIQUES.FREEMAN GS.1975; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1975; VOL. 14; NO 4; PP. 371Article

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