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ELECTRICAL AND CHEMICAL REQUIREMENTS OF HIGH-ALUMINA SUBSTRATES FOR MICROSTRIP APPLICATIONS.CLASS W.1978; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1978; VOL. 18; NO 3; PP. 58-64; BIBL. 2 REF.Article

OPTIMIZATION AND SPECIFICATION OF DRY ETCHING PROCESSESHUTT M; CLASS W.1980; SOLID STATE TECHNOL.; USA; DA. 1980; VOL. 23; NO 3; PP. 92-97Article

THE MEASUREMENT AND SOURCES OF SUBSTRATE HEAT FLUX ENCOUNTERED WITH MAGNETRON SPUTTERING = MESURE ET SOURCES DES FLUX DE CHALEUR TRANSMIS AU SUPPORT PENDANT LA PULVERISATION PAR MAGNETRONCLASS W; HIERONYMI R.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 12; PP. 55-61; BIBL. 6 REF.Article

MATERIALS CONTROL FOR THE MANUFACTURE OF THIN-FILM HYBRID CIRCUITS.CLASS W; MURRAY GT.1975; SOLID STATE TECHNOL.; U.S.A.; DA. 1975; VOL. 18; NO 5; PP. 34-41; BIBL. 6 REF.Article

Performance characteristics of a new high rate magnetron sputtering cathode = Performances d'une nouvelle cathode de pulvérisation à haute puissance à magnétronCLASS, W. H.Thin solid films. 1983, Vol 107, Num 4, pp 379-385, issn 0040-6090Article

Low-energy high flux reactive ion etching by rf magnetron plasmaI, L; HINSON, D. C; CLASS, W. H et al.Applied physics letters. 1984, Vol 44, Num 2, pp 185-187, issn 0003-6951Article

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