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STAGGERED MOVING AVERAGE TECHNIQUE (SMAT): A TOOL TO OPTIMIZE COMPONENT MANUFACTUREBAKER GO; HOCHHEISER CM.1972; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1972; VOL. 1; NO 2; PP. 15-18Serial Issue

PRODUCIBILITY: THE CRITICAL ENGINEERING MANUFACTURING INTERFACE1972; WESCON TECH. PAPERS; U.S.A.; DA. 1972; VOL. 16; PP. (24 P.); BIBL. DISSEM.Serial Issue

THE BS 9000 SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITYCLARKSTONE KH.1973; POST OFF. ELECTR. ENGRS J.; G.B.; DA. 1973; VOL. 65; NO 4; PP. 228-233; BIBL. 4 REF.Serial Issue

SYSTEMLOESUNG ZUM RATIONELLEN BESTUECKEN UND LOETEN VON ELEKTRONISCHEN BAUGRUPPEN = SYSTEMES RATIONNELS DE MONTAGE ET DE SOUDAGE DE COMPOSANTS ELECTRONIQUESMUTH D.1973; RADIO FERNECHEN ELEKTRON.; DTSCH.; DA. 1973; VOL. 22; NO 5; PP. 155-156Serial Issue

MICROWAVE SMALL-SIGNAL BIPOLAR TRANSISTOR. HOW THIS DEVICE EVOLVED, FOUND A NICHE, AND BECAME PRICE-COMPETITIVETHOMAS J; CONDRON D.1973; MICROWAVE J.; U.S.A.; DA. 1973; VOL. 16; NO 2; PP. 43-45; BIBL. 4 REF.Serial Issue

COMPUTER CONTROL OF DIFFUSION SYSTEMSROCKHILL RA; WERYCH ER.1973; SOLID STATE TECHNOL.; U.S.A.; DA. 1973; VOL. 16; NO 2; PP. 29-32Serial Issue

ZERSTOERUNGSFREIE PRUEFUNG VON LOETSTELLEN = CONTROLE NON DESTRUCTIF DES SOUDURESFAULSTICH K.1973; FEINGERAETETECHNIK; DTSCH.; DA. 1973; VOL. 22; NO 1; PP. 13-14; BIBL. 7 REF.Serial Issue

MICROWAVE TRANSISTORS1972; FUJITSU SCI. TECH. J.; JAP.; DA. 1972; VOL. 8; NO 3; PP. 153-175; BIBL. 16 REF.Serial Issue

PHOTODETECTOR ARRAY FOR A HOLOGRAPHIC OPTICAL MEMORY SYSTEM = RESEAU PHOTODETECTEUR POUR UN SYSTEME DE MEMOIRE OPTIQUE HOLOGRAPHIQUEYAMAOKA T; FUJIWARA T; NISHI H et al.1972; FUJITSU SCI. TECH. J.; JAP.; DA. 1972; VOL. 8; NO 3; PP. 137-151; BIBL. 5 REF.Serial Issue

APPAREIL PNEUMATIQUE POUR LE CONTROLE DE LA HAUTEUR DE PIECES QUI SE DETERIORENT FACILEMENTBOCHKOV VM; GREBEN YU I.1972; IZMERITEL. TEKH.; S.S.S.R.; DA. 1972; NO 10; PP. 90-91; BIBL. 1 REF.Serial Issue

SURVEY OF CURRENT COMPONENT RELIABILITY PROBLEMS AND METHODS FOR PREVENTIONHAMITER L; VILLELLA F.sdIN: COMPOSANTS ELECTRON. HAUTE FIABILITE. COLLOQ. INT. TOULOUSE, 1972; BAGNEUX; IMPR. SOPEDI; DA. S.D.; PP. 3-24Conference Proceedings

ASSURANCE DE LA QUALITEsdIN: COMPOSANTS ELECTRON. HAUTE FIABILITE. COLLOQ. INT. TOULOUSE, 1972; BAGNEUX; IMPR. SOPEDI; DA. S.D.; PP. 197-435; ABS. ANGL. FR.; BIBL. DISSEM.Conference Proceedings

L'INDUSTRIE DES COMPOSANTS ELECTRONIQUESBAUMONT G.1973; INDUSTR. ELECTR. ELECTRON.; FR.; DA. 1973; NO 4; PP. 5-14Serial Issue

ABOVE-AMBIENT TEMPERATURE CONTROL USING A THERMOELECTRIC HEAT PUMPGOLDSMID HJ.1983; SOLID-STATE ELECTRONICS; ISSN 0038-1101; GBR; DA. 1983; VOL. 26; NO 4; PP. 365-366; BIBL. 2 REF.Article

LA METALLISATION: PROTECTION ET DECORATION DES SURFACESFERRETTI M.1976; TRAITEMENTS DE SURFACE; FR.; DA. 1976; VOL. 17; NO 144; PP. 31-46 (14 P.)Article

A SELF-SCANNED SILICON DIODE ARRAY FOR ASTRONOMICAL PHOTOMETRY.DRAVINS D.1975; ASTROPHYS. SPACE SCI. LIBRARY; NETHERL.; DA. 1975; VOL. 54; PP. 97-102; BIBL. 6 REF.; (IMAGE PROCESS. TECH. ASTRON. PROC. CONF.; UTRECHT; 1975)Conference Paper

HOW RELIABILITY OF ELECTRONIC PARTS IS GUARANTEEDSHIOMI H.1972; JAP. ELECTRON. ENGNG; JAP.; DA. 1972; NO 73; PP. 54-59Serial Issue

THE TRANSISTOR-25 YEARS OLDSHUNAMAN F.1972; RADIO ELECTRON.; U.S.A.; DA. 1972; VOL. 43; NO 12; PP. 35-38Serial Issue

FIABILITE PHYSIQUE DES COMPOSANTSsdIN: COMPOSANTS ELECTRON. HAUTE FIABILITE. COLLOQ. INT. TOULOUSE, 1972; BAGNEUX; IMPR. SOPEDI; DA. S.D.; PP. 1-196; ABS. ANGL. FR.; BIBL. DISSEM.Conference Proceedings

TECHNIQUES DE CONSTRUCTION AVEC DU VERRE ET VITRO-CERAMIQUES DANS LES COMPOSANTS ELECTRONIQUES DE PRECISIONKAHL FO.1973; MICROTECNIC; SUISSE; DA. 1973; VOL. 27; NO 1; PP. 53-56Serial Issue

DESIGNING CONTROL LOGIC WITH C MOSWALLACE J.1973; CONTROL ENGNG; U.S.A.; DA. 1973; VOL. 20; NO 7; PP. 48-51Serial Issue

RELIABILITY ASSESSMENT AND SCREENING BY RELIABILITY INDICATOR METHODSMOELTOFT J.1983; ELECTROCOMPONENT SCIENCE AND TECHNOLOGY; ISSN 0305-3091; GBR; DA. 1983; VOL. 11; NO 1; PP. 71-84; BIBL. 17 REF.Article

ZEITRAFFENDE ZUVERLAESSIGKEITSUNTERSUCHUNGEN AN MIKROELEKTRONISCHEN BAUELEMENTEN = LA REDUCTION DU TEMPS PASSE AUX ETUDES DE FIABILITE SUR LES COMPOSANTS EN MICROELECTRONIQUEFISCHER W.1982; RADIO FERNSEHEN ELEKTRONIK; ISSN 0033-7900; DDR; DA. 1982; VOL. 31; NO 4; PP. 213-216; BIBL. 21 REF.Article

HOW PARTS FAILDOYLE EA JR.1981; IEEE SPECTRUM; ISSN 0018-9235; USA; DA. 1981; VOL. 18; NO 10; PP. 36-43Article

"SUPERCOMPOSANTS" A BASE DE MEMOIRES A TRES GRAND DEGRE D'INTEGRATION-BASE ELEMENTAIRE D'AVENIR DES SYSTEMES NUMERIQUES DE LA 4EME GENERATIONALEKSENKO AG; LAPSHINSKIJ VA.1980; MIKROELEKTRONIKA; SUN; DA. 1980; VOL. 9; NO 1; PP. 3-14; BIBL. 11 REF.Article

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