au.\*:("CONDRA, L")
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Comparison of plastic and hermetic microcircuits under temperature cycling and temperature humidity biasCONDRA, L; O'REAR, S; FREEDMAN, T et al.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 5, pp 640-650, issn 0148-6411Article
Packaging reliability for high temperature electronics : A materials focusMCLUSKEY, F. P; CONDRA, L; TORRI, T et al.Microelectronics international. 1996, Vol 41, Num SEP, pp 23-26, issn 1356-5362Article
Reliability assessment of aerospace electronic equipment : Customer demands for quality and reliability for critical applicationsCONDRA, L; BOSCO, C; DEPPE, R et al.Quality and reliability engineering international. 1999, Vol 15, Num 4, pp 253-260, issn 0748-8017Article
Packaging of electronics for high temperature applicationsMCCLUSKEY, P; DAS, D; JORDAN, J et al.The International journal of microcircuits and electronic packaging. 1997, Vol 20, Num 3, pp 409-423, issn 1063-1674Conference Paper
Evaluation of manufacturing variables in the reliability of surface mount capacitorsCONDRA, L. W; JOHNSON, G. M; PECHT, M. G et al.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 4, pp 542-552, issn 0148-6411Article