EFFECT OF CODEPOSITION OF POLYMER ON THE MORPHOLOGY OF ELECTRODEPOSITED COPPERDESPIC AR; MAGLIC GS; JACOVIC M et al.1979; J. APPL. ELECTROCHEM.; GBR; DA. 1979; VOL. 9; NO 2; PP. 147-153; BIBL. 5 REF.Article

ELECTRODEPOSITION OF COPPER ON A COPPER SINGLE-CRYSTAL (100) FACE AND ON A COPPER POLYCRYSTALLINE SURFACE IN THE PRESENCE OF SULPHAGUANIDINESUBRAMANIAN K; NAGESWAR S.1979; SURF. TECHNOL.; CHE; DA. 1979; VOL. 9; NO 2; PP. 103-109; BIBL. 12 REF.Article

THE MEASUREMENT AND INTERPRETATION OF THE MACROSTRESS GENERATED DURING THEE LECTRODEPOSITION OF COPPERHARRISON JA; STRONACH PJ.1979; ELECTROCHIM. ACTA; GBR; DA. 1979; VOL. 24; NO 2; PP. 191-194; BIBL. 27 REF.Article

POLYETHYLENE GLYCOL IN COPPER ELECTRODEPOSITION ONTO A ROTATING DISK ELECTRODE.HILL MRH; ROGERS GT.1978; J. ELECTROANAL. CHEM. INTERFACIAL ELECTROCHEM.; NETHERL.; DA. 1978; VOL. 86; NO 1; PP. 179-188; BIBL. 17 REF.Article

CROISSANCE, MICROSTRUCTURE ET TRANSITIONS DE PHASE DANS LES DEPOTS DE CU-COSHIMIZU Y; TANABE Y; TOMITA H et al.1978; J. METAL FINISHG SOC. JAP.; JAP.; DA. 1978; VOL. 29; NO 3; PP. 131-136; ABS. ANGL.; BIBL. 19 REF.Article

DETERMINATION DES PROPRIETES MECANIQUES DE TUBES BIMETALLIQUESMALYSH AD; BURNOS VA; MUZYKA SV et al.1978; ZAVODSK. LAB.; SUN; DA. 1978; VOL. 44; NO 10; PP. 1266-1267; BIBL. 3 REF.Article

INFLUENCE DE L'ADSORPTION DE L'ANION PYROPHOSPHATE SUR LE PROCESSUS D'ELECTRODEPOSITION DU CUIVRE DANS LES SOLUTIONS ACIDES DE SULFATE DE CUIVRELEZHAVA TI; TSANAVA BV; KHENNIG KH et al.1978; ELEKTROKHIMIJA; SUN; DA. 1978; VOL. 14; NO 12; PP. 1820-1824; BIBL. 9 REF.Article

ELECTRODEPOSITION OF METALS IN FLUIDIZED BED ELECTRODES. II: AN EXPERIMENTAL INVESTIGATION OF COPPER ELECTRODEPOSITION AT HIGH CURRENT DENSITYSABACKY BJ; EVANS JW.1979; J. ELECTROCHEM. SOC.; USA; DA. 1979; VOL. 126; NO 7; PP. 1180-1187; BIBL. 19 REF.Article

BREVET SOLUTIONS DE REVETEMENT NON ELECTROLYTIQUE DE CUIVRE, RENFERMANT DE L'ACIDE TELLURIQUE OU TELLUREUX OU UN SEL DE CES PRODUITS1979; ; FRA; DA. 1979-01-12; FR/A1/2.390.510; DEP.77-14820/1977-05-13Patent

ELECTRODEPOSITION DU CUIVRE DANS LES SOLUTIONS DE CYANURE AVEC ADDITIFS. 2 - ETUDE RADIOMETRIQUE DE L'INTERACTION DE CU AVEC CN^- ET LE BUTYNE-2-DIOL-1,4FRANTSKYAVICHYUTE D YU; STEPONAVICHYUS AA.1978; LIET. T.S.R. MOKSLU AKAD. DARB., B; SUN; DA. 1978; NO 6; PP. 9-13; ABS. LIT; BIBL. 7 REF.Article

BEHAVIOUR OF SODIUM THROSULFATE IN NI PLATING ELECTROLYTEZHEJMITE OS; BUTKYAVICHYUS YU P; BODNEVAS AI et al.1980; DARB.-LIET. TSR MOKSLU AKAD. SER. B; ISSN 0132-2729; SUN; DA. 1980; NO 3; PP. 13-21; ABS. LIT; BIBL. 11 REF.Article

ELECTRODEPOSITION OF COPPER-TIN ALLOY (BRONZE) POWDERS FROM ACID CITRATE BATHS.DUBE RK; PRADAD PM.1977; J. ELECTROCHEM. SOC. INDIA; INDIA; DA. 1977; VOL. 26; NO 3; PP. 1-5; BIBL. 17 REF.Article

REACTION DE TRANSITION DANS LA FORMATION ELECTROLYTIQUE DE GERMES DE CUIVRETROFIMENKO VV; KOVALENKO VS; LOSHKAREV YU M et al.1977; DOKL. AKAD. NAUK S.S.S.R.; S.S.S.R.; DA. 1977; VOL. 233; NO 6; PP. 1142-1145; BIBL. 6 REF.Article

THE THEORY AND PRACTICE OF ELECTROLESS COPPER DEPOSITION AND USE OF ELECTROLESS PLATING IN THE ELECTRONICS INDUSTRY.NORSWORTHY BE.1977; TRANS. INST. METAL FINISHG; G.B.; DA. 1977; VOL. 55; NO 1; PP. 31-34; BIBL. 4 REF.Article

MODERNE ASPEKTE DER CHEMISCHEN VERKUPFERUNG ZUR HERSTELLUNG GEDRUCKTER SCHALTUNGEN. = ASPECTS MODERNES DU CUIVRAGE CHIMIQUE POUR LA FABRICATION DES CIRCUITS IMPRIMESEHRICH HJ.1977; GALVANOTECHNIK; DTSCH.; DA. 1977; VOL. 68; NO 11; PP. 960-969; ABS. ANGL. FR.; BIBL. 20 REF.Article

CUIVRE CHIMIQUE EPAIS POUR LA REALISATION DE CIRCUITS IMPRIMES A TROUS METALLISES = THICK ELECTROLESS COPPER FOR PRINTED CIRCUITS WITH METALLIZED HOLESPOSKANZER A.1980; GALVANO-ORGANO; ISSN 0302-6477; FRA; DA. 1980; VOL. 49; NO 502; PP. 45-46Article

DEPOTS DECORATIFS DE LAITON SUR NICKEL BRILLANT = DECORATIVE COATINGS OF BRASS ON BRIGHT NICKELGRUENWALD E; VARHELYI.1980; GALVANO-ORGANO; ISSN 0302-6477; FRA; DA. 1980; VOL. 49; NO 505; PP. 352-354; BIBL. 3 REF.Article

LE TRAITEMENT DE SURFACE DES CIRCUITS IMPRIMES = SURFACE TREATMENT OF PRINTED CIRCUITSASSOULINE A; GUILBERT J; GRUNWALD J et al.1980; GALVANO-ORGANO; ISSN 0302-6477; FRA; DA. 1980; VOL. 49; NO 507; PP. 531-536Article

DISTRIBUTION OF LOCAL CURRENT DENSITIES DURING COPPER ELECTRODEPOSITION ON A PLANE VERTICAL CATHODEAWAKURA Y; EBATA A; KONDO Y et al.1979; J. ELECTROCHEM. SOC.; USA; DA. 1979; VOL. 126; NO 1; PP. 23-30; BIBL. 26 REF.Article

STABILIZATION OF SENSITIZER USED IN THE ELECTROLESS DEPOSITION OF COPPER ON CERAMIC MATERIALS = STABILISATION DU SENSIBILISATEUR UTILISE DANS LE DEPOT CHIMIQUE DE CU SUR DES CERAMIQUESBHATGADDE LG; MAHAPATRA S.1979; INDIAN J. TECHNOL.; ISSN 0019-5669; IND; DA. 1979; VOL. 17; NO 2; PP. 58-60; BIBL. 12 REF.Article

CATHODIC LIMITING CURRENT DENSITIES IN COPPER PLATING FROM COPPER SULFATE AND COPPER FLUOBORATE BATHS, AND THE DIFFUSION COEFFICIENTS OF THE SALTSKONISHI S; KATO S; GOTO S et al.1979; KINZOKU HYOMEN GIJUTSU; ISSN 0026-0614; JPN; DA. 1979; VOL. 30; NO 8; PP. 402-406; ABS. ENG; BIBL. 12 REF.Article

ELECTROLYTE POUR LE CUIVRAGE DE L'ACIER ET DES ALLIAGES DE ZINCPILAVOV SH G; EGOROVA AI.1979; ELEKTROKHIMIJA; SUN; DA. 1979; VOL. 15; NO 2; PP. 283-284; BIBL. 2 REF.Article

CONTINUOUS PLANTS FOR THE PATENTING AND ELECTRO-PLATING OF STEEL WIREKIMMERL P; GAABS S.1978; WIRE WORLD INTERNATION.; DEU; DA. 1978; VOL. 20; NO 5; PP. 186-191; ABS. FRE/ITA/SPAArticle

DETERMINATION OF THE SIZE OF THE CRYSTALLITES THAT FORM BRIGHT GALVANIC COPPER COATINGSSTOYCHEV DS; TOMOV I; VITANOVA I et al.1978; SURF. TECHNOL.; CHE; DA. 1978; VOL. 7; NO 6; PP. 433-441; BIBL. 18 REF.Article

EFFECT OF SOME PLATING VARIABLES ON THE ELECTRODEPOSITION OF CU-ZN ALLOYS FROM ALKALINE TARTRATE BATHS.ABD EL REHIM SS; EL AYASHY ME.1978; J. APPL. ELECTROCHEM.; G.B.; DA. 1978; VOL. 8; NO 1; PP. 33-39; BIBL. 20 REF.Article