Pascal and Francis Bibliographic Databases


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Results 1 to 25 of 4939

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Low-frequency noise in thick-film structures caused by traps in glass barriersMRAK, I; JEVTIC, M; STANIMIROVIC, Z et al.International conference on microelectronic. 1997, pp 413-416, isbn 0-7803-3664-X, 2VolConference Paper

Des circuits hybrides à couches épaisses aux modules multipucesRAPPOLD, H. M; RYCKEBUSCH, M; STARK, M et al.Revue des télécommunications (Paris. 1992). 1996, Num 2, pp 110-113, issn 1243-7492Article

Ellipsométrie de couches «épaisses»BORSHCHAGOVSKIJ, E. G; GETSKO, O. M; SNITKO, O. V et al.Optika i spektroskopiâ. 1989, Vol 66, Num 2, pp 404-410, issn 0030-4034, 7 p.Article

Surface-modified RuO2-based thick film resistors using Nd:YAG laserGOFUKU, E; OGAMA, T; TAKASAGO, H et al.Journal of applied physics. 1989, Vol 66, Num 12, pp 6126-6131, issn 0021-8979, 6 p.Article

Gas sensing properties of mixed a Fe2O3 - SnO2 nanoparticles prepared under hydrothermal conditionsTOMESCU, A; ROESCU, R; DUMITRIU, I et al.International Semiconductor Conference. 2004, pp 109-112, isbn 0-7803-8499-7, 4 p.Conference Paper

Extending gold thick film technology through materials and process developmentTREDINNICK, Meg; MALANGA, David; SABO, Chuck et al.SPIE proceedings series. 2000, pp 340-345, isbn 0-930815-62-9Conference Paper

PEMS - Dickschicht - Heizelemente auf Email = PEMS - Thick film heating elements on enamelled steelKLOPPERS, G. J.Mitteilungen des Vereins deutscher Emailfachleute E.V. (1990). 1995, Vol 43, Num 6, pp 77-80, issn 0938-9865Conference Paper

Polymerdickfilmtechnologie: kostengünstige Erweiterung der konventionellen Leiterplattenherstellung = Technology of thick polymer films: A profit-earning development of conventional printed circuits manufacturingANDEREGG, F; GILGEN, H.Technische Mitteilungen PTT. 1989, Vol 67, Num 3, pp 108-113, issn 0040-1471, 6 p.Article

Study of cross-linking reactions in negative-type thick-film resistsSENSU, Yoshihisa; SEKIGUCHI, Atsushi; KONO, Yoshiyuki et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6196-2, 2Vol, Part 2, 61533S.1-61533S.12Conference Paper

Investigating polymer thick-films on silicon for the implementation of hybrid microsystemsPAPAKOSTAS, Thomas V; WHITE, Neil M.SPIE proceedings series. 2000, pp 432-437, isbn 0-930815-62-9Conference Paper

Thick film on stainless steel; applications, methods and processesELLIS, M. Ed; RICHTER, Fred; LEVITSKY, Mary E et al.SPIE proceedings series. 2000, pp 330-334, isbn 0-930815-62-9Conference Paper

Glass modified sensitive surface thick film humidity sensorGWIRC, S. N.Sensors and actuators. B, Chemical. 1994, Vol 18, Num 1-3, pp 107-110, issn 0925-4005Conference Paper

Organometallic chemical vapor deposition routes to high Tc superconducting Tl-Ba-Ca-Cu-O filmsRICHESON, D. S; TONGE, L. M; JING ZHAO et al.Applied physics letters. 1989, Vol 54, Num 21, pp 2154-2156, issn 0003-6951, 3 p.Article

The effect of Al2O3 nanolayers on the efficiency of organic light-emitting devicesLIANBIN NIU; FUJIA ZHANG.Semiconductor science and technology. 2006, Vol 21, Num 12, pp 1639-1642, issn 0268-1242, 4 p.Article

Impedance spectroscopy of carbon black-filled polyesterimide thick filmsNITSCH, K; DZIEDZIC, A; CZARCZYNSKA, H et al.International journal of electronics. 1994, Vol 76, Num 5, pp 981-986, issn 0020-7217Conference Paper

Photoconductivity in solid films of C60/70MORT, J; OKUMURA, K; MACHONKIN, M et al.Chemical physics letters. 1991, Vol 186, Num 2-3, pp 281-283, issn 0009-2614Article

Low temperature firing of Pb-contained thick film dielectricsSHEN-LI FU; GUNG-FUN CHEN.Active and passive electronic components. 1987, Vol 12, Num 4, pp 281-290, issn 0882-7516Article

A laser power detector built up by application of thick-film technologyNICOLICS, J; SMETANA, W.Sensors and actuators. A, Physical. 1991, Vol 25, Num 1-3, pp 235-239Article

Lubrification en mise en forme Régime de lubrification par films épais = Lubhrication in forming. Regime of lubrication with thick filmsFELDER, Eric.Techniques de l'ingénieur. Matériaux métalliques. 2008, Vol MC1, Num 3017, issn 1762-8733, M3017.1-M3017.15, doc M3017.1-4 [21 p.]Article

Oxygen semipermeability of mixed-conductive oxide thick-film prepared by slip castingMIURA, N; OKAMOTO, Y; TAMAKI, J et al.Solid state ionics. 1995, Vol 79, pp 195-200, issn 0167-2738Conference Paper

A very low-cost pressure sensor with extremely high sensitivityCZASZAR, C; HARSANYI, G; AGARWAL, R. P et al.Sensors and actuators. A, Physical. 1994, Vol 42, Num 1-3, pp 417-420, issn 0924-4247Conference Paper

The ultimate thick film gold compositionOLLIVIER, P. J; BACHER, R. J; CRUMPTON, J. C et al.SPIE proceedings series. 2000, pp 335-339, isbn 0-930815-62-9Conference Paper

Analysis of thick film thermistor geometriesALEKSIC, O. S; NIKOLIC, P. M; JOKIC, V. D et al.International conference on microelectronic. 1997, pp 431-434, isbn 0-7803-3664-X, 2VolConference Paper

Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and MicrosystemsSLOSARCIK, Stanislav; VEHEC, Igor; GMITERKO, Alexander et al.Journal of microelectronics and electronic packaging. 2009, Vol 6, Num 3, pp 158-163, issn 1551-4897, 6 p.Article

New Mega-Farad UltracapacitorsBAKHOUM, Ezzat G.IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 2009, Vol 56, Num 1, pp 14-21, issn 0885-3010, 8 p.Article

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