kw.\*:("Carte électronique")
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Responsabilité du fabricant de cartes électroniques pour négligence dans l'établissement de celles-ci ― mise à jour = Liability of electronic chartmaker for negligent charting ― an updated versionOBLOY, E. J.Revue hydrographique internationale. 1990, Vol 67, Num 2, pp 139-159, issn 0373-7535, 21 p.Article
Board-level boundary scan : regaining observability with an additional ICBALLEW, W. D; STREB, L. M.IEEE transactions on computer-aided design of integrated circuits and systems. 1992, Vol 11, Num 1, pp 68-75, issn 0278-0070Article
Optimales Layout durch richtigen Autorouter-Einsatz = Optimal design by the use of the right routerSCHINNERL, C.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1995, Vol 103, Num 7-8, pp 404-407, issn 0944-1018Article
Combined effects of linear and angular errors in pc board assemblyRADHAKRISHNAN, T.International journal of production research. 1992, Vol 30, Num 5, pp 1037-1044, issn 0020-7543Article
Degrading effect of high-altitude corona on electronic circuit boardsKARADY, G. G; SIRKIS, M. D; OLIVA, J. R et al.IEEE transactions on electrical insulation. 1991, Vol 26, Num 6, pp 1216-1219, issn 0018-9367Article
Map information theories and adaptive visualization of electronic map in feature class-based zoomingNIU FANGQU; ZHU DEHAI; CHENG CHANGXIU et al.Proceedings of SPIE, The International Society for Optical Engineering. 2006, pp 64200L.1-64200L.8, issn 0277-786X, isbn 0-8194-6529-1Conference Paper
Integral capacitors built as an embedded layer in printed wiring boardsDOUGHERTY, Joseph P; KLINGER, Tim; BRENNEMAN, Dick et al.SPIE proceedings series. 2000, pp 489-494, isbn 0-930815-62-9Conference Paper
Simulation thermique de cartes électroniques. Les données nécessaires. Obtention et utilisation. Comparaison simulation/expérimentation = Thermal simulation of electronic boards. The required data. Acquisition and utilization. Simulation/experimentation comparisonFROMONT, T.Colloque national sur la thermique, l'énergie et l'environnement des matériels de télécommunications, informatique, bureautique et autres systèmes électroniques. 2. 1985, pp 75-81Conference Paper
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulsesTSAI, Tsung-Yueh; YEH, Chang-Lin; LAI, Yi-Shao et al.Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1239-1245, issn 0026-2714, 7 p.Article
Fortschritte bei recyclingfähigen Leiterplatten = Advances in the recycling capability of printed circuit boardsRÖHRS, G; SABEV, P; KOSTELNIK, J et al.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1997, Vol 105, Num 11-12, pp 800-804, issn 0944-1018, 4 p.Article
Schnellere Montage im 19-Raster : Leistungsprofil eines neuen Baugruppenträgers = 19 grid for fast mountingHAAG, V.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1996, Vol 104, Num 11-12, pp 831-832, issn 0944-1018Article
Justifying flexible automation for PCB assembly : Electronic assemblyHOLCOMB, G. W.Assembly automation. 1995, Vol 15, Num 2, pp 14-16, issn 0144-5154Article
Efficient PCB/Component testing based on manufacturing flowDOUGLAS, P. N.Electronic manufacturing. 1990, Vol 36, Num 2, pp 19-21, 3 p.Article
Implementation of Magnifier Effect in Multi-Scale Display of Electronic MapJIA, Fenli; YOU, Xiong; LIU, Yingzhen et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7143, pp 714339.1-714339.8, issn 0277-786X, isbn 978-0-8194-7385-1 0-8194-7385-5, 2Conference Paper
Reliable and secure operation of smart cardsHENN, H. H.Lecture notes in computer science. 1999, issn 0302-9743, isbn 3-540-66483-1, p. 3Conference Paper
Efficient breakout routing in printed circuit boardsHERSHBERGER, J; SURI, S.Lecture notes in computer science. 1997, pp 462-471, issn 0302-9743, isbn 3-540-63307-3Conference Paper
Minimal size packaging solutions : A comparisonGREATHOUSE, S.Microelectronics international. 1996, Vol 40, Num MAI, pp 27-32, issn 1356-5362Article
Artificial neural network approach for functional fault diagnosis of complex printed circuit boardsARSLAN, T; AL-JUMAH, A. A.International conference on applications of artificial intelligence in engineering. 1996, pp 61-62, isbn 1-85312-410-9Conference Paper
SIPAD verspricht höhere Qualität zum kleineren Preis: Leiterplatten mit Massivlotdepot setzen sich durch = SIPAD promises a higher quality at a lower priceMAIWALD, W. J.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1995, Vol 103, Num 7-8, pp 413-418, issn 0944-1018, 5 p.Article
Les cartes électroniques TRANSAS = The TRANSAS electronic mapsKOMRAKOV, E.Revue hydrographique internationale. 1995, Vol 72, Num 1, pp 81-84, issn 0373-7535Article
A parallel algorithm for channel routing problemsFUNABIKI, N; TAKEFUJI, Y.IEEE transactions on computer-aided design of integrated circuits and systems. 1992, Vol 11, Num 4, pp 464-474, issn 0278-0070Article
Count-based BIST compaction schemes and aliasing probability computationIVANOV, A; ZORIAN, Y.IEEE transactions on computer-aided design of integrated circuits and systems. 1992, Vol 11, Num 6, pp 768-777, issn 0278-0070Article
Printed circuit repair kit (RPU)SILKIN, S. I; CHAGINA, V. G.Soviet electrical engineering. 1991, Vol 62, Num 6, pp 78-79, issn 0038-5379Article
Considerations in PCB backpanel packagingTOPP, M; SARGENT, D.Electronic manufacturing. 1990, Vol 36, Num 2, pp 22-24, 3 p.Article
Broadband printed circuit board folded dipole antennaYANG, Jeffrey M; PRATA, Aluizio JR.IEEE antennas and propagation society international symposiumNational radio science meeting. 2004, pp 771-774, isbn 0-7803-8302-8, 4Vol, 4 p.Conference Paper