Modelling of void initiation and breaking phenomena in a packed bedSINGH, V; GUPTA, G. S; RAJNEESH, S et al.Ironmaking & steelmaking. 2006, Vol 33, Num 2, pp 101-110, issn 0301-9233, 10 p.Article

On the Utility of Microscopy and C-Scan Techniques in the Study of Defects Arising From Resin Infusion Process and a Study on the Influence of Voids on the Impact Behavior of CFRP Composites = Vom Nutzen mikroskopischer und C-Bild-Verfahren bei der Untersuchung von Defekten, die durch das Harzinfusionsverfahren entstehen und eine Untersuchung des Einflusses von Lunkern auf das Impactverhalten von CFK-VerbundwerkstoffenSURESH KUMAR, M; AMBRESHA; RANGANATH, V. R et al.Praktische Metallographie. 2014, Vol 51, Num 5, pp 353-366, issn 0032-678X, 14 p.Article

Kirkendall Void Formation During Selective OxidationYONG FENG GONG; DE COOMAN, Bruno C.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 9, pp 2180-2183, issn 1073-5623, 4 p.Article

Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositingJINGLIN BI; HUIQIN LING; ANMIN HU et al.Applied surface science. 2011, Vol 257, Num 8, pp 3723-3727, issn 0169-4332, 5 p.Article

1,8,14,20-Tetraoxa-11,23-dithiatricyclo[21.3.0.0^9,13]hexacosa-9,12,21,24-tetraeneWAGNER, Pawel; LAPKOWSKI, Mieczyslaw; KUBICKI, Maciej et al.Acta crystallographica. Section C, Crystal structure communications. 2006, Vol 62, issn 0108-2701, o155-o156, 4Article

Vacancy Cluster : Hélium Synergy in Void NucleationRUSSELL, Kenneth C.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2008, Vol 39, Num 5, pp 956-963, issn 1073-5623, 8 p.Conference Paper

High quality voids free oxide depositionPAI, C. S.Materials chemistry and physics. 1996, Vol 44, Num 1, pp 1-8, issn 0254-0584Article

Kinetics of isothermal annealing of vacancy voidsVITOL', E. N.Physics of metals and metallography. 1992, Vol 74, Num 2, pp 142-143, issn 0031-918XArticle

Effect of the hydrogen induced degradation of steel on the internal friction spectraLUNARSKA, E; OSOSKOV, Y; JAGODZINSKI, Y et al.Journal de physique. IV. 1996, Vol 6, Num 8, pp C8.59-C8.62, issn 1155-4339Conference Paper

Acid-base interactions : adhesion and the elimination of cavities in the production of synthetic marbleENYIEGBULAM, M. E.International journal of adhesion and adhesives. 1992, Vol 12, Num 2, pp 117-119, issn 0143-7496Article

A microscopic model for the void growth behaviorKAMEDA, J.Acta metallurgica. 1989, Vol 37, Num 7, pp 2067-2076, issn 0001-6160, 10 p.Article

A study of stress-driven diffusive growth of voids in encapsulated interconnect linesSAUTER, A. I; NIX, W. D.Journal of materials research. 1992, Vol 7, Num 5, pp 1133-1143, issn 0884-2914Article

Estimating lifetime of PP, PI and PVDF under artificial void conditions using step-stress testsKHACHEN, W; LAGHARI, J. R.IEEE transactions on electrical insulation. 1992, Vol 27, Num 5, pp 1022-1025, issn 0018-9367Article

Preparation of void-free calcium phosphate glass-ceramicsWATANABE, A; MITSUDOU, M; KIHARA, S et al.Journal of the American Ceramic Society. 1989, Vol 72, Num 8, pp 1499-1500, issn 0002-7820Article

The effect of void or precipitate growth on their growth rateBRAILSFORD, A. D.Journal of nuclear materials. 1985, Vol 135, Num 2-3, pp 222-231, issn 0022-3115Article

Processing-related fracture origins. IV: Elimination of voids produced by organic inclusionsLANGE, F. F; DAVIS, B. I; WRIGHT, E et al.Journal of the American Ceramic Society. 1986, Vol 69, Num 1, pp 66-69, issn 0002-7820Article

Void Nucleation and Growth in Dual-Phase Steel 600 during Uniaxial Tensile TestingAVRAMOVIC-CINGARA, G; SALEH, Ch. A. R; JAIN, M. K et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2009, Vol 40, Num 13, pp 3117-3127, issn 1073-5623, 11 p.Article

Vacuum : a void full of questionsPAPARAZZO, Ernesto.Surface and interface analysis. 2008, Vol 40, Num 3-4, pp 450-453, issn 0142-2421, 4 p.Conference Paper

Microcavity of organic semiconductorBEI ZHANG; LEI ZHUANG; YONG LIN et al.Solid state communications. 1996, Vol 97, Num 6, pp 445-449, issn 0038-1098Article

Ring macromolecules in topologically restricted environmentsGERSAPPE, D; OLVERA DE LA CRUZ, M.Physical review letters. 1993, Vol 70, Num 4, pp 461-464, issn 0031-9007Article

Void evolution and the large-scale structureDUBINSKI, J; DA COSTA, L. N; GOLDWIRTH, D. S et al.The Astrophysical journal. 1993, Vol 410, Num 2, pp 458-468, issn 0004-637X, 1Article

Heterogenous void growth revealed by in situ 3-D X-ray microtomography using automatic cavity trackingLECARME, L; MAIRE, E; KUMAR K.C., A et al.Acta materialia. 2014, Vol 63, pp 130-139, issn 1359-6454, 10 p.Article

X-ray tomographical observations of cracks and voids in 3D carbon/carbon compositesSHARMA, Rajneesh; DESHPANDE, Vinit V; BHAGAT, Atul R et al.Carbon (New York, NY). 2013, Vol 60, pp 335-345, issn 0008-6223, 11 p.Article

Phase-field modeling of void formation and growth under irradiationSEMENOV, A. A; WOO, C. H.Acta materialia. 2012, Vol 60, Num 17, pp 6112-6119, issn 1359-6454, 8 p.Article

Damage fluctuations in creep deformed copper studied with synchrotron X-ray microtomographyABBASI, Ramin; RENVERSADE, Loïc; DZIECIOL, Krzysztof et al.International journal of materials research. 2012, Vol 103, Num 2, pp 228-233, issn 1862-5282, 6 p.Article