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Thermomechanical treatments of a 1050 pearlite steel = Thermomechanische Behandlungen eines perlitischen Stahles des Typs 1050CHEN, L.J; WU, T.W; CHENG, H.C et al.Metallurgical transactions. A, Physical metallurgy and materials science. 1983, Vol 14A, Num 3, pp 365-378, issn 0360-2133Article

The ARTS compendium : FHWA's electronic rural ITS project tracking system = Le manuel ARTS (Advanced Rural Transportation System) : le système électronique de répérage des projets ITS en Zone rurale, par la FHWABELFOR, G; CHEN, L.J; LIU, C et al.Public roads. 1997, Num 6, pp 23-26, issn 0033-3735Article

Advanced short-time thermal processing for Si-based CMOS devices II (San Antonio TX, 10-12 May 2004)Öztürk, M.C; Chen, L.J; Timans, P.J et al.Proceedings - Electrochemical Society. 2004, issn 0161-6374, isbn 1-56677-406-3, XII, 428 p, isbn 1-56677-406-3Conference Proceedings

Enhancement of manufacturibility in polycrystalline silicon process by using disilane precursor at 65nm CMOS technologyYUANNING CHEN; HAOWEN BU; CUNNINGHAM, Kevin L et al.Proceedings - Electrochemical Society. 2004, pp 244-251, issn 0161-6374, isbn 1-56677-406-3, 8 p.Conference Paper

Gate-source/drain extension overlap control with angled implants: TCAD modeling studyTHIRUPAPULIYUR, Sunderraj; AL-BAYATI, Amir; JAIN, Amitabh et al.Proceedings - Electrochemical Society. 2004, pp 127-134, issn 0161-6374, isbn 1-56677-406-3, 8 p.Conference Paper

Formation and characterization of nickel silicided shallow N+P junctions using implantation through silicide and low temperature furnace annealingWANG, Chao-Chun; CHEN, Mao-Chieh.Proceedings - Electrochemical Society. 2004, pp 183-190, issn 0161-6374, isbn 1-56677-406-3, 8 p.Conference Paper

The effect of ramp rate: Short process time and partial reactions on cobalt and nickel silicide formationPAGES, X; VAN DER JEUGD, K; KUZNETSOV, V et al.Proceedings - Electrochemical Society. 2004, pp 174-182, issn 0161-6374, isbn 1-56677-406-3, 9 p.Conference Paper

First principles modelling of the deposition process for high-K dielectric filmsELLIOTT, Simon D.Proceedings - Electrochemical Society. 2003, pp 231-242, issn 0161-6374, isbn 1-56677-396-2, 12 p.Conference Paper

New metal gate architecture achieved by chemical vapor deposition for a complete tunnel fillREGNIER, C; WACQUANT, F; LEVERD, F et al.Proceedings - Electrochemical Society. 2003, pp 391-396, issn 0161-6374, isbn 1-56677-396-2, 6 p.Conference Paper

Performance of nitrided Hf-silicate high-K gate dielectricsJEON, Joong; QI XIANG; ARASNIA, Farzad et al.Proceedings - Electrochemical Society. 2003, pp 451-457, issn 0161-6374, isbn 1-56677-396-2, 7 p.Conference Paper

Application of high-K dielectrics in CMOS technology and emerging new technologyLIU, Rich; WU, Tai-Bor.Proceedings - Electrochemical Society. 2003, pp 207-216, issn 0161-6374, isbn 1-56677-396-2, 10 p.Conference Paper

Effect of thermal annealing on MIST-deposited HFSIO4/SIOX/SI structuresCHANG, K; LEE, D.-O; SHANMUGASUNDARAM, K et al.Proceedings - Electrochemical Society. 2003, pp 429-435, issn 0161-6374, isbn 1-56677-396-2, 7 p.Conference Paper

Effect of starting surface in atomic layer depositionHAUKKA, Suvi; TUOMINEN, Marko; VAINONEN-AHLGREN, Elizaveta et al.Proceedings - Electrochemical Society. 2003, pp 405-416, issn 0161-6374, isbn 1-56677-396-2, 12 p.Conference Paper

Atomic layer deposition of high-K metal oxides for gate and capacitor dielectricsSENZAKI, Yoshihide; PARK, S. G; HIGUCHI, Randall et al.Proceedings - Electrochemical Society. 2003, pp 423-428, issn 0161-6374, isbn 1-56677-396-2, 6 p.Conference Paper

Batch atomic layer deposition for MIM capacitorsDE BLANK, René; JAN SNIJDERS, Gert; BEULENS, Sjaak et al.Proceedings - Electrochemical Society. 2003, pp 225-229, issn 0161-6374, isbn 1-56677-396-2, 5 p.Conference Paper

Rapid thermal annealing of atomic layer deposited hafnium-silicate / poly-silicon layersRITTERSMA, Z. M; MASSOUBRE, D; TUOMINEN, M et al.Proceedings - Electrochemical Society. 2003, pp 273-280, issn 0161-6374, isbn 1-56677-396-2, 8 p.Conference Paper

Rapid thermal solid phase epitaxy annealing for ultra-shallow junction formationLERCH, W; PAUL, S; DOWNEY, D. F et al.Proceedings - Electrochemical Society. 2003, pp 43-49, issn 0161-6374, isbn 1-56677-396-2, 7 p.Conference Paper

Silicon damage and dopant behavior studies of rapidly thermally processed arsenic-implanted siliconGIRGINOUDI, D; GEORGOULAS, N; THANAILAKIS, A et al.Proceedings - Electrochemical Society. 2003, pp 397-402, issn 0161-6374, isbn 1-56677-396-2, 6 p.Conference Paper

Ultra-shallow implant anneal using a short wavelength flash light sourceWOO SIK YOO; KITAEK KANG.Proceedings - Electrochemical Society. 2003, pp 111-116, issn 0161-6374, isbn 1-56677-396-2, 6 p.Conference Paper

Defect behavior and control in advanced CMOs process technologiesCLAEYS, C; SIMOEN, E.Proceedings - Electrochemical Society. 2004, pp 50-65, issn 0161-6374, isbn 1-56677-406-3, 16 p.Conference Paper

Electrical characterization of HfOxNy gate dielectric with different nitrogen concentration profiles formed by rapid thermal annealingCHENG, Chin-Lung; CHANG-LIAO, Kuei-Shu; WANG, Tien-Ko et al.Proceedings - Electrochemical Society. 2004, pp 286-291, issn 0161-6374, isbn 1-56677-406-3, 6 p.Conference Paper

Further optimization of plasma nitridation of ultra-thin oxides for 65nm node MOSFETsKRAUS, P. A; CHUA, T. C; NOURI, F et al.Proceedings - Electrochemical Society. 2004, pp 236-243, issn 0161-6374, isbn 1-56677-406-3, 8 p.Conference Paper

Integration of low and high temperature junction anneals for 45 NM CMOsLINDSAY, R; PAWLAK, B. J; MAEX, K et al.Proceedings - Electrochemical Society. 2004, pp 145-156, issn 0161-6374, isbn 1-56677-406-3, 12 p.Conference Paper

Reduced poly-SI gate depletion effect by pulsed excimer laser annealingHIU YUNG WONG; TAKEUCHI, Hideki; KING, Tsu-Jae et al.Proceedings - Electrochemical Society. 2004, pp 205-215, issn 0161-6374, isbn 1-56677-406-3, 11 p.Conference Paper

Silicon precursors for gate dielectric and electrode applicationsHOOVER, Cynthia A; MEIERE, Scott H; LITWIN, Michael M et al.Proceedings - Electrochemical Society. 2004, pp 354-360, issn 0161-6374, isbn 1-56677-406-3, 7 p.Conference Paper

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