Electrical design of signal lines for multilayer printed circuit boardsCHANG, C. S.IBM journal of research and development. 1988, Vol 32, Num 5, pp 647-657, issn 0018-8646Article

Micromechanics of multilayer printed circuit boardsLEE, L. C; DAREKAR, V. S; LIM, C. K et al.IBM journal of research and development. 1984, Vol 28, Num 6, pp 711-718, issn 0018-8646Article

An approximation algorithm for the via placement problemGONZALEZ, T. F; SHASHISHEKHAR KURKI-GOWDARA.IEEE transactions on computer-aided design of integrated circuits and systems. 1989, Vol 8, Num 3, pp 219-228, issn 0278-0070, 10 p.Article

Uniform plasma etching of printed circuit boardsRUST, R. D; RHODES, R. J; PARKER, A. A et al.Solid state technology. 1984, Vol 27, Num 4, pp 270-275, issn 0038-111XArticle

On the usefulness of additional vias in multilayer printed wiring boardsGHAMESHLU, M; YOSHIDA, N.Transactions of the Institute of Electronics and Communication Engineers of Japan. Section E. 1988, Vol 71, Num 11, pp 1091-1094, issn 0387-236XArticle

Formable hardboard circuit replaces boards, flex circuits, connectorsGURLEY, S.Electri.onics. 1984, Vol 30, Num 4, issn 0745-4309, 43Article

Selection and control of plating chemistry for multilayer printed wiring boards. IElectri.onics. 1985, Vol 31, Num 9, pp 17-19, issn 0745-4309Article

Printed circuit laminate specification guideElectri.onics. 1985, Vol 31, Num 10, pp 36-41, issn 0745-4309Article

Wire laying methods as an alternative to multilayer PCB'sMESSNER, G; PLONSKI, P; MARTENS, A et al.Electrocomponent science and technology. 1984, Vol 11, Num 2, pp 117-122, issn 0305-3091Article

IMPLANTATION DES LIAISONS CONDUCTRICES DES PLAQUES IMPRIMEES A PLUSIEURS COUCHES EN UTILISANT DES MICROCIRCUITS DE COMMUTATIONTESLENKO VP; ROMASHKO VI; POLYANSKIJ GA et al.1975; ELEKTRON. I MODELIROVAN, U.S.S.R.; S.S.S.R.; DA. 1975; NO 7; PP. 82-83; BIBL. 2 REF.Article

TOLERANCE ANALYSIS FOR MULTILAYER PC'S. = ANALYSE DE TOLERANCE POUR CIRCUITS IMPRIMES MULTICOUCHESJONES RA.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 6; PP. 62-68 (5P.)Article

SURVEYING TODAY'S MULTILAYER PC SUPPLIERS.MARKSTEIN HW.1978; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1978; VOL. 18; NO 6; PP. 64-68; (4 P.)Article

How to implement PWB engineering change orders with a wireless, dry PTF processDESMARAIS, R. C.Electri.onics. 1987, Vol 33, Num 7, pp 35-36, issn 0745-4309Article

Comparison of current solder masking technologiesFRAULA, D.Electri.onics. 1986, Vol 32, Num 11, pp 11-14, issn 0745-4309Article

Single-row routing in Narrow streetsHAN, S; SAHNI, S.IEEE transactions on computer-aided design of integrated circuits and systems. 1984, Vol 3, Num 3, pp 235-241, issn 0278-0070Article

Wirability of knock-knee layouts with 45° wiresCHIANG, C; MAJID SARRAFZADEH.IEEE transactions on circuits and systems. 1991, Vol 38, Num 6, pp 613-624, issn 0098-4094, 12 p.Article

Trends in PWB laminate performanceKUSH, D.Electri.onics. 1987, Vol 33, Num 9, pp 33-34, issn 0745-4309Article

Composite, process developments keyed to increasing PWB demandsARTHUR, D.Electri.onics. 1986, Vol 32, Num 4, pp 19-21, issn 0745-4309Article

New multilayer PC board with blind via holeMATSUMOTO, M; ATARASHI, T; MITSUI, S et al.NEC research & development. 1985, Num 76, pp 78-84, issn 0547-051XArticle

Analyzing applications, performance in multilayer, multiwire board technologySTOEHR, G.Electri.onics. 1984, Vol 30, Num 12, pp 21-24, issn 0745-4309Article

An automatic wafer inspection system using pipelined image processing techniquesYODA, H; OHUCHI, Y; TANIGUCHI, Y et al.IEEE transactions on pattern analysis and machine intelligence. 1988, Vol 10, Num 1, pp 4-16, issn 0162-8828Article

Differential scanning calorimetry of prepregs for multilayer printed circuits boardsKRETZSCHMAR, K; HOFFMANN, K. W; FISCHER, L et al.Siemens Forschungs- und Entwicklungsberichte. 1987, Vol 16, Num 3, pp 101-104, issn 0370-9736Article

Oxide selection tips for multilayer PWB fabricationNARGI, K.Electri.onics. 1987, Vol 33, Num 4, pp 19-20, issn 0745-4309Article

Considerations for laser soldering surface mounted connectorsLISH, E. F.Electri.onics. 1984, Vol 30, Num 6, pp 28-32, issn 0745-4309Article

Automated layout techniques offer circuit design solutionsFITZGIBBON, P; DUNLAP, J.Electri.onics. 1984, Vol 30, Num 11, pp 31-32, issn 0745-4309Article