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MAKING LSI CIRCUITS: A COMPARISON OF PROCESSING TECHNIQUESSCHMID H.1972; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1972; VOL. 1; NO 2; PP. 19-31; BIBL. 1 P.Serial Issue

INTEGRATED SOLID-STATE DEVICES.WHEATLEY CF JR.1974; S.A.E. TRANS.; U.S.A.; DA. 1974; VOL. 83; NO 1; PP. 58-86; BIBL. 17 REF.Article

INTEGRIERTE SCHALTUNGEN. EINE EINFUEHRUNGHAURI ER.1973; P.T.T. BULL. TECH.; SUISSE; DA. 1973; VOL. 51; NO 2; PP. 44-52; ABS. ITAL.; BIBL. 20 REF.; MEME ART. FRSerial Issue

DUENNSCHICHTSYSTEM FUER HYBRIDSCHALTKREISE - HERGESTELLT DURCH PLASMATRONZERSTAEUBEN = ENSEMBLE DE FILMS MINCES SUPERPOSES POUR CIRCUITS HYBRIDES FABRIQUE PAR PULVERISATION PAR PLASMATRONSCHILLER S; HEISIG U; GOEDICKE K et al.1982; NACHRICHTENTECH., ELEKTRON.; ISSN 0323-4657; DDR; DA. 1982; VOL. 32; NO 3; PP. 105-108; BIBL. 11 REF.Article

Monolithic integrated mm-wave circuits on high resistivity siliconSCHÖLLHORN, Claus; KASPER, Erich.Recent research developments in microwave theory & techniques Vol. 2 - 2004. Recent research developments in microwave theory & techniques. 2004, pp 155-182, isbn 81-7895-150-9, 28 p.Book Chapter

2007 Radio Frequency Integrated Circuits (RFIC) SymposiumRUDELL, Jacques C.IEEE journal of solid-state circuits. 2008, Vol 43, Num 5, pp 1054-1194, issn 0018-9200, 140 p.Conference Paper

Automating thick film processes improves hybrid circuitsCUNDY, A. S.Electri.onics. 1983, Vol 29, Num 11, pp 27-30, issn 0745-4309Article

Bipolar/BiCMOS Circuits and Technology MeetingHECHT, Bruce.IEEE journal of solid-state circuits. 2008, Vol 43, Num 9, pp 1875-1930, issn 0018-9200, 55 p.Conference Paper

How to select adhesives for hybrid circuit assemblyLEFEVER, D. W.Electri.onics. 1985, Vol 31, Num 3, pp 23-26, issn 0745-4309Article

Encres à base de métaux non nobles pour circuits hybrides à couches épaissesHINOUL, M; VERMEIRSCH, M; VLAEMINCK, R et al.Revue des Télécommunications. 1982, Vol 57, Num 2, pp 137-141, issn 0373-8582Article

TECHNOLOGIES MODERNES POUR APPAREILS DE TELECOMMUNICATION.TIESNES M.1977; REV. BROWN BOVERI; SUISSE; DA. 1977; VOL. 64; NO 8; PP. 474-477Article

INTEGRATED SOLID-STATE DEVICES.WHEATLEY CF JR.1974; IN: AUTOMOT. ELECTRON. SOC. AUTOMOT. ENG. INST. ELECTR. ELECTRON. ENG. CONF. TUTORIAL SESS.; DETROIT, MICH.; 1974; NEW YORK; SOC. AUTOMOT. ENG.; DA. 1974; PP. 38-66; BIBL. 26 REF.Conference Paper

APPLICATIONS OF MICRO-ELECTRONICSHAJELA SK.1980; J. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; IND; DA. 1980; VOL. 26; NO 2; PP. 152-160Article

A THICK AND THIN FILM APPROACH TO FABRICATING MCA SUBSTRATES.CALEY RW.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 12; PP. 135-149 (12P.); BIBL. 18 REF.Article

LECS TO CONFOUND PESSIMISTS.1975; ELECTRON. COMPON.; G.B.; DA. 1975; VOL. 17; NO 8; PP. 13-23 (6P.)Article

HYBRID INTEGRATED CIRCUIT MANUFACTURING PROCESS AS CONTROLLED BY SHOP INFORMATION SYSTEMSKRAUSE DL; LOCY DA.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 345-353; BIBL. 4 REF.Article

INGENIEURTECHNISCHE UND TECHNOLOGISCHE PROBLEME DER HYBRID-INTEGRATION = LES PROBLEMES DE L'INGENIEUR ET LES PROBLEMES TECHNOLOGIQUES DE L'INTEGRATION HYBRIDEKIENAST W.1979; NACHR.-TECH. ELEKTRON.; DDR; DA. 1979; VOL. 29; NO 4; PP. 147-150; BIBL. 15 REF.Article

RESISTOR LOOPS IN HYBRID CIRCUITS.SWART PL; VAN WYK JD.1976; MICROELECTRONICS; G.B.; DA. 1976; VOL. 7; NO 3; PP. 53-55Article

SUR LA QUESTION DE LA MICROMINIATURISATION COMPLEXE DES DISPOSITIFS HFIRLIN AV; KEMPA YA M.1976; POLUPROVODN. TEKH. MIKROELEKTRON., U.S.S.R.; S.S.S.R.; DA. 1976; NO 24; PP. 4-20; BIBL. 19 REF.Article

BAUSTEINE UND SCHALTUNGSKREISE HYBRIDER FORMEN. = COMPOSANTS ET CIRCUITS DE FORME HYBRIDEDUENBOSTEL W.1975; OESTERR. Z. ELEKTR.-WIRTSCH.; OESTERR.; DA. 1975; VOL. 28; NO 7; PP. 375-393; ABS. ANGL. FR.; BIBL. 19 REF.Article

LINEAR MICROCIRCUITS. A TESTING CHALLENGE.CROMER EG.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 10; PP. 44-51 (6P.); BIBL. 8 REF.Article

Conception d'ASIC: avant tout une affaire de formationMesures (1983). 1989, pp 21-22, issn 0755-219X, 2 p., no. specArticle

Conception et test de circuits intégrés personnalisés = Designing and testing personalized integrated circuitsREY, G.1986, 6 p.Report

Proceedings of the 11th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2004)Chung, Steve S.International Symposium on the Physical & Failure Analysis of Integrated Circuits. 2004, isbn 0-7803-8454-7, 1Vol, 326 p., isbn 0-7803-8454-7Conference Proceedings

ECONOMICS AND THE MARKETEFFENBERGER E.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 6; NO 3-4; PP. 205-207; BIBL. 3 REF.Article

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