MAKING LSI CIRCUITS: A COMPARISON OF PROCESSING TECHNIQUESSCHMID H.1972; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1972; VOL. 1; NO 2; PP. 19-31; BIBL. 1 P.Serial Issue

INTEGRATED SOLID-STATE DEVICES.WHEATLEY CF JR.1974; S.A.E. TRANS.; U.S.A.; DA. 1974; VOL. 83; NO 1; PP. 58-86; BIBL. 17 REF.Article

Monolithic integrated mm-wave circuits on high resistivity siliconSCHÖLLHORN, Claus; KASPER, Erich.Recent research developments in microwave theory & techniques Vol. 2 - 2004. Recent research developments in microwave theory & techniques. 2004, pp 155-182, isbn 81-7895-150-9, 28 p.Book Chapter

TECHNOLOGIES MODERNES POUR APPAREILS DE TELECOMMUNICATION.TIESNES M.1977; REV. BROWN BOVERI; SUISSE; DA. 1977; VOL. 64; NO 8; PP. 474-477Article

INTEGRATED SOLID-STATE DEVICES.WHEATLEY CF JR.1974; IN: AUTOMOT. ELECTRON. SOC. AUTOMOT. ENG. INST. ELECTR. ELECTRON. ENG. CONF. TUTORIAL SESS.; DETROIT, MICH.; 1974; NEW YORK; SOC. AUTOMOT. ENG.; DA. 1974; PP. 38-66; BIBL. 26 REF.Conference Paper

A THICK AND THIN FILM APPROACH TO FABRICATING MCA SUBSTRATES.CALEY RW.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 12; PP. 135-149 (12P.); BIBL. 18 REF.Article

LECS TO CONFOUND PESSIMISTS.1975; ELECTRON. COMPON.; G.B.; DA. 1975; VOL. 17; NO 8; PP. 13-23 (6P.)Article

SUR LA QUESTION DE LA MICROMINIATURISATION COMPLEXE DES DISPOSITIFS HFIRLIN AV; KEMPA YA M.1976; POLUPROVODN. TEKH. MIKROELEKTRON., U.S.S.R.; S.S.S.R.; DA. 1976; NO 24; PP. 4-20; BIBL. 19 REF.Article

BAUSTEINE UND SCHALTUNGSKREISE HYBRIDER FORMEN. = COMPOSANTS ET CIRCUITS DE FORME HYBRIDEDUENBOSTEL W.1975; OESTERR. Z. ELEKTR.-WIRTSCH.; OESTERR.; DA. 1975; VOL. 28; NO 7; PP. 375-393; ABS. ANGL. FR.; BIBL. 19 REF.Article

LINEAR MICROCIRCUITS. A TESTING CHALLENGE.CROMER EG.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 10; PP. 44-51 (6P.); BIBL. 8 REF.Article

Conception d'ASIC: avant tout une affaire de formationMesures (1983). 1989, pp 21-22, issn 0755-219X, 2 p., no. specArticle

Conception et test de circuits intégrés personnalisés = Designing and testing personalized integrated circuitsREY, G.1986, 6 p.Report

ASIC: dépasser les choix techniquesPEYRUCAT, J.-F.Mesures (1983). 1989, pp 18-19, issn 0755-219X, 2 p., no. specArticle

Test d'ASIC: on n'est jamais mieux servi que par soi-même = ASIC testing: better help yourselfRENARD, P.Mesures (1983). 1988, Vol 53, Num 13, pp 51-53, issn 0755-219XArticle

Trends in medical electronics using surface mounted components and hybridsHICKS, R. E; CHARLES, H. K. JR; WAGNER, G. D et al.Solid state technology. 1983, Vol 26, Num 12, pp 145-150, issn 0038-111XArticle

Compact formulation for exact analysis of nonideal SC circuitsSANZ, M; PUERTA, A.Electronics Letters. 1987, Vol 23, Num 11, pp 554-555, issn 0013-5194Article

Matériaux utilisés en technologie des couches épaisses et fiabilité des circuits hybridesGRAVES, P. W.Revue des Télécommunications. 1982, Vol 57, Num 2, pp 127-131, issn 0373-8582Article

Ka-Band front end with monolithic, hybrid, and lumped-element IC'sMEIER, P. J; CALVIELLO, J. A; CAPPELLO, A. J et al.IEEE transactions on microwave theory and techniques. 1986, Vol 34, Num 4, pp 412-419, issn 0018-9480Article

Silicon hybrid wafer-scale package technologyJOHNSON, R. W; DAVIDSON, J. L; JAEGER, R. C et al.IEEE journal of solid-state circuits. 1986, Vol 21, Num 5, pp 845-851, issn 0018-9200Article

International mixed-signals testing workshopKAMINSKA, Bozena; SUNTER, Stephen; MIR, Salvador et al.Microelectronics journal. 2005, Vol 36, Num 12, issn 0959-8324, 62 p.Conference Proceedings

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

HIGH RELIABILITY TA/A1 THIN-FILM HYBRID CIRCUITS.DUCKWORTH RG.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 2; PP. 141-146; BIBL. 4 REF.Article

MODE-SELECTIVE PROPERTIES OF A METAL-CLAD-DIELECTRIC-SLAB WAVEGUIDE FOR INTEGRATED OPTICSBATCHMAN TE; RASHLEIGH SC.1972; I.E.E.E. J. QUANTUM ELECTRON.; U.S.A.; DA. 1972; VOL. 8; NO 11; PP. 848-850; BIBL. 4 REF.Serial Issue

A VLSI model of the bat lateral superior olive for azimuthal echolocationSHI, R. Z; HORIUCHI, T. K.IEEE International Symposium on Circuits and Systems. 2004, pp 900-903, isbn 0-7803-8251-X, 4 p.Conference Paper