Electroplating important in manufacturing cofired multilayer ceramic modules and packagesSISOLAK, R.Electri.onics. 1983, Vol 29, Num 10, pp 25-26, issn 0745-4309Article

INNOVATIONS IN HYBRID PACKAGINGMARKSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 9; PP. 40-44; (4 P.); BIBL. 1 REF.Article

Optimum computer aided design for hybrid ICsKOHARA, H; USHIGOME, M; KAWASHIMA, S et al.NEC research & development. 1988, Num 91, pp 104-110, issn 0547-051XArticle

Nitrogen-filled storage cabinets avoid oxidation of hybrid componentsVOGEL, J.Electri.onics. 1983, Vol 29, Num 9, pp 29-30, issn 0745-4309Article

A new type hybrid IC in a transfer-molded standard packageNITTA, H; SASAMOTO, T; YAMANAKA, M et al.NEC research & development. 1988, Num 91, pp 65-72, issn 0547-051XArticle

Choosing an automatic component distribution system for hybrid circuit manufacturingPELLATON, J. P; GABUS, J.-C.Electri.onics. 1983, Vol 29, Num 7, pp 43-47, issn 0745-4309Article

Conception de circuits intégrés hybrides de générateurs de la gamme microondePETROV, G. V.Mikroèlektronika (Moskva). 1984, Vol 13, Num 2, pp 138-147, issn 0544-1269Article

Application of the plasma spraying process to the production of metal-ceramics substrates for hybrid microelectronicsGORECKA-DRZAZGA, A; GOLONKA, L; PAWLOWSKI, L et al.Revue internationale des hautes températures et des réfractaires. 1984, Vol 21, Num 3-4, pp 153-165, issn 0035-3434Article

Trends in medical electronics using surface mounted components and hybridsHICKS, R. E; CHARLES, H. K. JR; WAGNER, G. D et al.Solid state technology. 1983, Vol 26, Num 12, pp 145-150, issn 0038-111XArticle

DEVELOPING A NANUFACTURING TECHNOLOGY FOR POWER HYBRIDSHAMILL AT; MARTHINUSS JE; RAZZETTI LA et al.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 9; PP. 72-76; 4 P.Article

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

QUALITY AND RELIABILITY IN HYBRID CIRCUITSREAD RF.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 555-560Conference Paper

UNIVERSELLER FREQUENZTEILER IN HYBRIDTECHNIK = DIVISEUR DE FREQUENCE UNIVERSEL EN TECHNIQUE HYBRIDEWETZKO M; STREUBEL P; ALTHUS J et al.1979; RADIO FERNSEHEN ELEKTRON.; DDR; DA. 1979; VOL. 28; NO 1; PP. 19-21; BIBL. 8 REF.Article

HYBRID TECHNOLOGY-BEST SUPPORTING ACTOR.BOUCHARD JG.1977; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1977; VOL. 6; NO 4; PP. 65-68; BIBL. 9 REF.Article

RELIABILITY TESTING OF B.A.C. HYBRID CIRCUITS.TAYLOUR CH.1977; MICROELECTRON. AND RELIAB.; G.B.; DA. 1977; VOL. 16; NO 4; PP. 295-302; (SEMICOND. TECHNOL. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1977)Conference Paper

CONVERTISSEURS A/N MONO OU QUADRUPLE COMMUTATEUR.1977; TOUTE ELECTRON.; FR.; DA. 1977; NO 424; PP. 63-67Article

PROBLEMI CONNESSI ALLA VALUTAZIONE ED ALL' IMPIEGO DI CONTENITORI PLASTICI IN APPLICAZIONI A VITA UTILE MOLTO LUNGA. = PROBLEMES LIES A L'EVALUATION ET A EMPLOI DE CONTAINERS EN PLASTIQUE A DUREE DE VIE TRES LONGUEBASILE L; FANTINI F.1976; ALTA FREQ.; ITAL.; DA. 1976; VOL. 45; NO 5; PP. 324-332; BIBL. 54 REF.Article

PROBLEMES ET SOLUTIONS DE L'INTEGRATION HYBRIDE EN HYPERFREQUENCE.BENOIT JJ.1975; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1975; NO 205; PP. 19-21Article

CARACTERISTIQUES ECONOMIQUES DE CONSTRUCTION DE GRANDS CIRCUITS INTEGRES HYBRIDESPOPOV VP; IVANTSOV VP; CHERNOV IV et al.1975; IZVEST. VYSSH. UCHEBN. ZAVED., RADIOELEKTRON.; S.S.S.R.; DA. 1975; VOL. 18; NO 12; PP. 3-10; BIBL. 5 REF.Article

AN APPROACH FOR EVALUATING EPOXY ADHESIVES FOR USE IN HYBRID MICROELECTRONIC ASSEMBLY.PLANTING PY.1975; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1975; VOL. 11; NO 4; PP. 305-311; BIBL. 5 REF.Article

COMPUTER-AIDED DESIGN OF HYBRID IC MASK.KOJIMA T; YANAGI M; UYEHARA T et al.1974; FUJITSU SCI. TECH. J.; JAP.; DA. 1974; VOL. 10; NO 1; PP. 75-93; BIBL. 5 REF.Article

BUILD A 12 OCTAVE HYBRID AMPLIFIER.STURZU P.1974; MICROWAVES; U.S.A.; DA. 1974; VOL. 13; NO 6; PP. 54-57; BIBL. 9 REF.Article

Matériaux utilisés en technologie des couches épaisses et fiabilité des circuits hybridesGRAVES, P. W.Revue des Télécommunications. 1982, Vol 57, Num 2, pp 127-131, issn 0373-8582Article

MORE RELIABLE CONNECTIONS TO CONDENSATION-SOLDERED TERMINALSGUTBIER EA; CHAVERS RA; OUELLETTE PJ et al.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 10; PP. 99-104; BIBL. 4 REF.Article