Electrical design of signal lines for multilayer printed circuit boardsCHANG, C. S.IBM journal of research and development. 1988, Vol 32, Num 5, pp 647-657, issn 0018-8646Article

An approximation algorithm for the via placement problemGONZALEZ, T. F; SHASHISHEKHAR KURKI-GOWDARA.IEEE transactions on computer-aided design of integrated circuits and systems. 1989, Vol 8, Num 3, pp 219-228, issn 0278-0070, 10 p.Article

On the usefulness of additional vias in multilayer printed wiring boardsGHAMESHLU, M; YOSHIDA, N.Transactions of the Institute of Electronics and Communication Engineers of Japan. Section E. 1988, Vol 71, Num 11, pp 1091-1094, issn 0387-236XArticle

How to implement PWB engineering change orders with a wireless, dry PTF processDESMARAIS, R. C.Electri.onics. 1987, Vol 33, Num 7, pp 35-36, issn 0745-4309Article

Comparison of current solder masking technologiesFRAULA, D.Electri.onics. 1986, Vol 32, Num 11, pp 11-14, issn 0745-4309Article

Wirability of knock-knee layouts with 45° wiresCHIANG, C; MAJID SARRAFZADEH.IEEE transactions on circuits and systems. 1991, Vol 38, Num 6, pp 613-624, issn 0098-4094, 12 p.Article

Trends in PWB laminate performanceKUSH, D.Electri.onics. 1987, Vol 33, Num 9, pp 33-34, issn 0745-4309Article

An automatic wafer inspection system using pipelined image processing techniquesYODA, H; OHUCHI, Y; TANIGUCHI, Y et al.IEEE transactions on pattern analysis and machine intelligence. 1988, Vol 10, Num 1, pp 4-16, issn 0162-8828Article

Differential scanning calorimetry of prepregs for multilayer printed circuits boardsKRETZSCHMAR, K; HOFFMANN, K. W; FISCHER, L et al.Siemens Forschungs- und Entwicklungsberichte. 1987, Vol 16, Num 3, pp 101-104, issn 0370-9736Article

Oxide selection tips for multilayer PWB fabricationNARGI, K.Electri.onics. 1987, Vol 33, Num 4, pp 19-20, issn 0745-4309Article

Reliability, thermal analysis and optimization wirability design of multi-layer PCB boardsTIAN, Xijin; PALUSINSKI, Olgierd A.Proceedings. Annual Reliability and Maintainability Symposium. 2002, pp 392-398, issn 0149-144X, isbn 0-7803-7348-0, 7 p.Conference Paper

Miniaturized magnetostrictive delay line arrangement using multilayer-like structurePLETEA, M; CHIRIAC, H; HRISTOFOROU, E et al.Sensors and actuators. A, Physical. 2001, Vol 92, Num 1-3, pp 115-118, issn 0924-4247Conference Paper

New polymeric materials for designing photoresistors and photodetective assemblies based on CdHgTeKHITROVA, L. M; TROSHKIN, Y. S; BELYAEV, V. P et al.SPIE proceedings series. 1999, pp 167-169, isbn 0-8194-3305-5Conference Paper

A comparative analysis of interconnection technologies for integrated multilayer inductorsO'REILLY, S; FLANNERY, J; O'DONNELL, T et al.Microelectronics international. 1998, Vol 45, Num JAN, pp 6-10, issn 1356-5362Conference Paper

D.P.S. 500: la métallisation des C.I sans cuivre chimique. Un nouveau concept de fabrication qui, déjà, a fait ses preuves = D.P.S. 500: metallization of printed circuits without electroless copper. A new fabrication conceptIBORRA, M.-F.Galvano organo. Le professionnel des traitements de surface. 1993, Vol 62, Num 639, pp 921-923Article

How to evaluate CAE equipment for PWB layout. IIMILLER, T. C.Electri.onics. 1987, Vol 33, Num 14, issn 0745-4309, 51Article

Résines pour microlithographie = Resist for microlithographyERANIAN, A; DUBOIS, J. C.Revue technique - Thomson-CSF. 1987, Vol 19, Num 1, pp 95-212, issn 0035-4279Article

Choices in standard and custom busing for multilayer backplanesSTERANKO, J.Electri.onics. 1986, Vol 32, Num 13, pp 50-53, issn 0745-4309Article

Reaction and sintering for the mixture of kaolin and calcium carbonate below 1000°CKOBAYASHI, Y; SUMI, K; KATO, E et al.Nippon seramikkusu kyokai gakujutsu ronbunshi. 1997, Vol 105, Num 8, pp 670-674, issn 0914-5400Article

Schnelle Multilayer für höchste Anforderungen : Warum ECL- und GaAs-Applikationen neue Leiterplatten-Technologien erfordern = Fast multilayer for ECL/GaAs-applicationsTHÜRINGER, R; BUCK, T.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1996, Vol 104, Num 11-12, pp 849-852, issn 0944-1018Article

High density multilayer printed circuit board for HITAC M-880TAKAHASHI, A; OOKI, N; NAGAI, A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 4, pp 418-425, issn 0148-6411Conference Paper

Implementing a CIM system for multilayer PWB fabricationSAGE, D. L.Electri.onics. 1987, Vol 33, Num 11, pp 31-33, issn 0745-4309Article

Embedding graphs in books: a layout problem with applications to VLSI designCHUNG, F. R. K; THOMSON LEIGHTON, F; ROSENBERG, A. L et al.SIAM journal on algebraic and discrete methods. 1987, Vol 8, Num 1, pp 33-58, issn 0196-5212Article

Analysis of long term reliability of plated-through holes in multilayer interconnection boards. A: Stress analyses and material characterizationVECCHIO, K. S; HERTZBERG, R. W.Microelectronics and reliability. 1986, Vol 26, Num 4, pp 715-732, issn 0026-2714Article

Analysis and design of multilayer printed antennas : a modular approachHERSCOVICI, N. I; POZAR, D. M.IEEE transactions on antennas and propagation. 1993, Vol 41, Num 10, pp 1371-1378, issn 0018-926XArticle