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Monolithic integrated mm-wave circuits on high resistivity siliconSCHÖLLHORN, Claus; KASPER, Erich.Recent research developments in microwave theory & techniques Vol. 2 - 2004. Recent research developments in microwave theory & techniques. 2004, pp 155-182, isbn 81-7895-150-9, 28 p.Book Chapter

Conception d'ASIC: avant tout une affaire de formationMesures (1983). 1989, pp 21-22, issn 0755-219X, 2 p., no. specArticle

ASIC: dépasser les choix techniquesPEYRUCAT, J.-F.Mesures (1983). 1989, pp 18-19, issn 0755-219X, 2 p., no. specArticle

Silicon hybrid wafer-scale package technologyJOHNSON, R. W; DAVIDSON, J. L; JAEGER, R. C et al.IEEE journal of solid-state circuits. 1986, Vol 21, Num 5, pp 845-851, issn 0018-9200Article

Natural convection heat transfer characteristics of simulated microelectronic chipsPARK, K.-A; BERGLES, A. E.Journal of heat transfer. 1987, Vol 109, Num 1, pp 90-96, issn 0022-1481Conference Paper

Markets and marketing strategies for smart power ICsWILSON, P.Microelectronics journal. 1993, Vol 24, Num 1-2, pp 5-9, issn 0959-8324Article

Ein Verdrahtungssystem zum rechnergestützten Layoutentwurf von Multichipträgern = Routing algorithms for computer-aided-design of hybrid circuitsLEINIG, J.Wissenschaftliche Zeitschrift der Technischen Universität Dresden. 1991, Vol 40, Num 5-6, pp 157-161, issn 0043-6925Article

C-band 6-bit GaAs monolithic phase shifterANDRICOS, C; BAHL, I. J; GRIFFIN, E. L et al.I.E.E.E. transactions on electron devices. 1985, Vol 32, Num 12, pp 2760-2765, issn 0018-9383Article

Functional programming aspects of wafer scale integrationSHUTE, M. J.Microelectronics. 1988, Vol 19, Num 3, pp 31-40, issn 0026-2692Article

The 2007 Symposium on VLSI CircuitsYANO, Kazuo; NAJAMURA, Katsu.IEEE journal of solid-state circuits. 2008, Vol 43, Num 4, issn 0018-9200, 294 p.Conference Proceedings

2008 Compound Semiconductor Integrated Circuit SymposiumIEEE journal of solid-state circuits. 2008, Vol 43, Num 10, pp 2175-2227, issn 0018-9200, 52 p.Conference Paper

NORCHIP '06VESTERBACKA, Mark; MADSEN, Jan.IET computers & digital techniques (Print). 2008, Vol 2, Num 4, issn 1751-8601, 76 p.Serial Issue

Novel failure mechanism and anomalous acceleration factor on a beam-lead ICSCARFF, P. L; IANNUZZI-GLOGOVSKY, M.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 1, pp 144-151, issn 0148-6411, 8 p.Article

Emerging technology and business solutions for system chipsLU, Nicky C. C.IEEE International Solid-State Circuits Conference. 2004, pp 25-31, isbn 0-7803-8267-6, 2Vol, 7 p.Conference Paper

A high-performance directly insertable self-aligned ultra-rad-hard and enhanced isolation field-oxide technology for Gigahertz silicon NMOS/CMOS VLSIMANCHANDA, L; HILLENIUS, S. J; LYNCH, W. T et al.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 4, pp 651-658, issn 0018-9383, 8 p.Article

Multigigahertz CMOS dual-modulus prescalar ICHONG-IH CONG; ANDREWS, J. M; BOULIN, D. M et al.IEEE journal of solid-state circuits. 1988, Vol 23, Num 5, pp 1189-1194, issn 0018-9200Article

IEEE International Solid-State Circuits Conference (ISSCC 2005), [San Francisco, CA, USA, February 6-10, 2005]VAN DER SPIEGEL, Jan; KRISHNAMURTHY, Ram K; NATARAJAN, Sreedhar et al.IEEE journal of solid-state circuits. 2006, Vol 41, Num 1, issn 0018-9200, 306 p.Conference Proceedings

IEEE Compound Semiconductor Integrated Circuit Symposium (formerly GaAs IC Symposium)IEEE journal of solid-state circuits. 2007, Vol 42, Num 10, pp 2077-2302, issn 0018-9200, 225 p.Conference Paper

Contact potentials and magnetic flux periodicity in micron length scale circuitsPOULTON, D. A; WIDOM, A; CLARK, T. D et al.Physics letters. A. 1989, Vol 137, Num 4-5, pp 229-231, issn 0375-9601, 3 p.Article

Optimisation paramétrique des grands circuits intégrés linéairesKATSNEL'SON, L. Z; KEL'MAN, E. S.Radiotehnika (Moskva). 1988, Num 11, pp 90-92, issn 0033-8486Article

IEEE 2004 international interconnect technology conference (Proccedings)IEEE international interconnect technology conference. 2004, isbn 0-7803-8308-7, 1Vol, 253 p., isbn 0-7803-8308-7Conference Proceedings

The 1998 ISSCC lives up to its cutting-edge reputationElectronic design. 1998, Vol 46, Num 3, pp 44-76, issn 0013-4872, 17 p.Conference Proceedings

Optimum computation of capacitance coefficients of multilevel interconnecting lines for advanced packageAHMADOUCHE, A; CHILO, J.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 1, pp 124-129, issn 0148-6411, 6 p.Article

Transit times in the high-density interconnections on GaAs-based VHSICGOEL, A. K.IEE proceedings. Part I. Solid-state and electron devices. 1988, Vol 135, Num 5, pp 129-135, issn 0143-7100Article

Planarized via-hole filling with molybdenum by bias sputteringMOGAMI, T; OKABAYASHI, H; MORIMOTO, M et al.Japanese journal of applied physics. 1988, Vol 27, Num 8, pp 1516-1520, issn 0021-4922Article

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