Optimum computer aided design for hybrid ICsKOHARA, H; USHIGOME, M; KAWASHIMA, S et al.NEC research & development. 1988, Num 91, pp 104-110, issn 0547-051XArticle

A new type hybrid IC in a transfer-molded standard packageNITTA, H; SASAMOTO, T; YAMANAKA, M et al.NEC research & development. 1988, Num 91, pp 65-72, issn 0547-051XArticle

Electrostatic discharge (ESD) sensitivity of thin-film hybrid passive componentsTHIET THE LAI.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 4, pp 627-638, issn 0148-6411Conference Paper

Molded hybrid IC packagesRANJIT BISWAS; CURTIS, H. III; DEANE, P. A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 4, pp 514-520, issn 0148-6411Conference Paper

The Gain-Bandwidth of hybrid optical transistorsIBRAHIM, M. M.IEEE journal of quantum electronics. 1988, Vol 24, Num 11, pp 2227-2230, issn 0018-9197Article

Organics in optoelectronics : advances and roadmapELDADA, Louay.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 61240X.1-61240X.15, issn 0277-786X, isbn 0-8194-6166-0, 1VolConference Paper

Ein Verdrahtungssystem zum rechnergestützten Layoutentwurf von Multichipträgern = Routing algorithms for computer-aided-design of hybrid circuitsLEINIG, J.Wissenschaftliche Zeitschrift der Technischen Universität Dresden. 1991, Vol 40, Num 5-6, pp 157-161, issn 0043-6925Article

Variation de l'état contraint de la plaque de commutation d'un circuit intégré hybride dans les conditions de fort refroidissementKOZLOV, A. V; PLATONOV, B. D; CHUJKOV, D. V et al.Radiotehnika i èlektronika. 1989, Vol 34, Num 9, pp 1939-1944, issn 0033-8494Article

Internal thermal resistance of a multi-chip packaging design for VLSI based systemsLEE, Y. C; GHAFFARI, H. T; SEGELKEN, J. M et al.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 2, pp 163-169, issn 0148-6411Conference Paper

A method of investigating fine shorting whiskers within a leadframe molded packageYEN, Andrew C; ZHENG HONGYU; WYNN, Richard Thet et al.IEEE transactions on advanced packaging. 2001, Vol 24, Num 1, pp 99-103, issn 1521-3323Article

A microsensor array for biochemical sensingVAN STEENKISTE, F; BAERT, K; DEBRUYKER, D et al.Sensors and actuators. B, Chemical. 1997, Vol 44, Num 1-3, pp 409-412, issn 0925-4005Conference Paper

Plating blockout during gold electroplating of hybrid microwave integrated circuitsREAGAN, J; QUTUB, O.Plating and surface finishing. 1991, Vol 78, Num 1, pp 29-31, issn 0360-3164, 3 p.Article

Optical interconnections using a silica-based waveguide on a silicon substrateYAMADA, Y; YAMADA, M; TERUI, H et al.Optical engineering (Bellingham. Print). 1989, Vol 28, Num 12, pp 1281-1287, issn 0091-3286Conference Paper

Silicon hybrid wafer-scale package technologyJOHNSON, R. W; DAVIDSON, J. L; JAEGER, R. C et al.IEEE journal of solid-state circuits. 1986, Vol 21, Num 5, pp 845-851, issn 0018-9200Article

Hybrid integrated circuits and single chip parallel optical transceiversTREZZA, John A.Lasers and Electro-optics Society. 2004, isbn 0-7803-8557-8, 2Vol, Vol2, 579-580Conference Paper

SNaP: A novel hybrid method for circuit reliability assessment under multiple faultsPAGLIARINI, S. N; BEN DHIA, A; DE B. NAVINER, L. A et al.Microelectronics and reliability. 2013, Vol 53, Num 9-11, pp 1230-1234, issn 0026-2714, 5 p.Conference Paper

Robust titanate-modified encapsulants for high voltage potting application of multichip module/hybrid ICWONG, C. P; MCBRIDE, R.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 8, pp 868-875, issn 0148-6411Conference Paper

Self-oscillation and period adding from resonant tunnelling diode-laser diode circuitFIGUEIREDO, J. M. L; ROMEIRA, B; SLIGHT, T. J et al.Electronics Letters. 2008, Vol 44, Num 14, pp 876-878, issn 0013-5194, 3 p.Article

A novel four-port directional structure with strongly coupled transmission lines based on microwave hybrid integrated circuitsSTARODUBROVSKII, R. K.Journal of communications technology & electronics. 1999, Vol 44, Num 6, pp 711-714, issn 1064-2269Article

A compact millimeter-wave finline and microstrip hybrid integrated front-endTAO, Y. M; DELISLE, G. Y; FANG, D. G et al.International journal of infrared and millimeter waves. 1996, Vol 17, Num 2, pp 457-463, issn 0195-9271Article

Integrated planar optical imaging system with high interconnection densityJAHNS, J; ACKLIN, B.Optics letters. 1993, Vol 18, Num 19, pp 1594-1596, issn 0146-9592Article

Primary investigation of anodized aluminium as a substrate for hybrid microelectronics. I: Electrical and mechanical propertiesVAEZI-NEJAD, S. M.International journal of electronics. 1990, Vol 68, Num 1, pp 59-68, issn 0020-7217Article

A custom hybrid GaAs driver and sensor device for a high-speed test systemSHENG-JEN TSAI; HECHTMAN, C. D.IEEE transactions on industrial electronics (1982). 1989, Vol 36, Num 2, pp 175-184, issn 0278-0046Article

Assembly of Optical MUX/DEMUX on Silicon Optical Bench with High Placement AccuraciesTAN CHEE WEI; LIM TECK GUAN; LI JING et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 68990N.1-68990N.8, issn 0277-786X, isbn 978-0-8194-7074-4, 1VolConference Paper

Multi-valued static random access memory (SRAM) cell with single-electron and MOSFET hybrid circuitYU, Y. S; KYE, H. W; SONG, B. N et al.Electronics Letters. 2005, Vol 41, Num 24, pp 1316-1317, issn 0013-5194, 2 p.Article