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Results 1 to 25 of 1636

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Electrochemical Preparation of Mg-Li-Zn-Mn Alloys by CodepositionPENG CAO; MI LIN ZHANG; WEI HAN et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2011, Vol 42, Num 4, pp 914-920, issn 1073-5615, 7 p.Article

Electrochemical Codeposition and Heat Treatment of Nickel-Titanium Alloy LayersSRIKOMOL, Sangthum; BOONYONGMANEERAT, Yuttanant; TECHAPIESANCHAROENKIJ, Ratchatee et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2013, Vol 44, Num 1, pp 53-62, issn 1073-5615, 10 p.Article

Electrochemical Codeposition of Quaternary Mg-Li-Ce-La Alloys from Molten SaltWEI HAN; YANXIA ZHANG; KE YE et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2010, Vol 41, Num 5, pp 1123-1128, issn 1073-5615, 6 p.Article

Codéposition électrolytique par courant pulsé d'alliages Ni-P et Fe-Cr-Ni = Pulse codeposition of Ni-P and Fe-Cr-Ni alloysPouderoux, Patrick; Rousset, Abel.1991, 207 p.Thesis

INCORPORATION AND BEHAVIOR OF HELIUM IN CO-DEPOSITED FILMS.BERG RS; KOMINIAK GJ; MATTOX DM et al.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 1; PP. 52-55; BIBL. 16 REF.; (20TH NATL. SYMP. AM. VAC. SOC. 11TH CONF. MICROBALANCE TECH. PROC.; NEW YORK; 1973)Conference Paper

Elaboration et caractérisation de composites à matrice métallique Ni/Al2O3 et Ni/Cr2O3 par codéposition électrochimique. Application à l'électroformage de sphères creuses = Elaboration and characterisation of metal matrix composites Ni/Al2O3 and Ni/Cr2O3 by electrolytic codeposition. Application to electroforming of hollow ballsVerelst, Marc; Rousset, Abel.1991, 216 p.Thesis

QUANTITATIVE AUGER ELECTRON SPECTROSCOPY USING CO-ADSORPTION.ARGILE C; RHEAD GE.1974; J. PHYS. C; G.B.; DA. 1974; VOL. 7; NO 14; PP. L261-L264; BIBL. 6 REF.Article

Codeposition behavior of impurities during electrogalvanization in sulfate baths in the presence of fe ionsNAKANO, Hiroaki; OUE, Satoshi; HISANO, Shoji et al.ISIJ international. 2007, Vol 47, Num 7, pp 1029-1033, issn 0915-1559, 5 p.Article

Low pressure chemical vapour deposition of AlN-Si3N4 codepositsHENRY, F; ARMAS, B; BERJOAN, R et al.Journal of the European Ceramic Society. 1997, Vol 17, Num 15-16, pp 1803-1806, issn 0955-2219Conference Paper

DOUBLE-LAYER EPITAXIAL GROWTH OF SI AND B13P2 ON SI SUBSTRATES AND SOME ELECTRICAL PROPERTIES OF SI LAYERS.TAKENAKA T; SHOHNO K.1974; JAP. J. APPL. PHYS.; JAP.; DA. 1974; VOL. 13; NO 8; PP. 1211-1215; BIBL. 6 REF.Article

VARIATION DE L'EPAISSEUR CRITIQUE D'INTRODUCTION DES DISLOCATIONS D'INCOMPATIBILITE EN FONCTION DE L'ORIENTATION DE LA LIMITE D'INTERPHASEIEVLEV VM; BUGAKOV AV; SOLOV'EV KS et al.1976; FIZ. TVERD. TELA; S.S.S.R.; DA. 1976; VOL. 18; NO 1; PP. 76-80; BIBL. 7 REF.Article

Enhancing buckypaper conductivity through co-deposition with copper nanowiresYAJUAN XING; XIAOHUA ZHANG; HONGYUAN CHEN et al.Carbon (New York, NY). 2013, Vol 61, pp 501-506, issn 0008-6223, 6 p.Article

Electrochemical Formation of Mg―Li―Sm Alloys by Codeposition from LiCl―KCl―MgCl2―SmCl3 Molten SaltsWEI HAN; FENGLI WANG; YANG TIAN et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2011, Vol 42, Num 6, pp 1376-1382, issn 1073-5615, 7 p.Article

Effects of impurities on surface morphology : some examplesHAMOUDA, Ajmi B. H; STASEVICH, T. J; PIMPINELLI, Alberto et al.Journal of physics. Condensed matter (Print). 2009, Vol 21, Num 8, issn 0953-8984, 084215.1-084215.10Article

Performance evaluation of acid copper plating films for via fillingHAGIWARA, H; KIMIZUKA, R; HONMA, H et al.Transactions of the Institute of Metal Finishing. 2006, Vol 84, pp 260-265, issn 0020-2967, 6 p., 5Article

Ellipsometric study of the initial layer formation of the preferential Zn deposition in Zn-Ni electroplatingOHTSUKA, T; KUWAMURA, E; KOMORI, A et al.ISIJ international. 1995, Vol 35, Num 7, pp 892-899, issn 0915-1559Article

The influence of saccharin and sodium lauryl sulfate on the electrodeposition process of Co-Ni alloysBURZYNSKA, Lidia; RUDNIK, E. W. A.Archives of metallurgy. 2000, Vol 45, Num 3, pp 277-285, issn 0860-7052Conference Paper

Serial cosputtering of metals : modelling of sputtering from a periodically codeposited surfaceCARLSSON, P; BERG, S; BELKIND, A et al.Surface & coatings technology. 1993, Vol 61, Num 1-3, pp 287-292, issn 0257-8972Conference Paper

D. C. conduction in thin films of SiOx/V2O5 co-evaporated assemblies prior to electroformingAL-RAMADHAN, F. A. S; HOGARTH, C. A.Journal of materials science. 1985, Vol 20, Num 11, pp 3931-3938, issn 0022-2461Article

Characterisation of co-sputtered Nb:Cr coatings grown by the combined cathodic are/unbalanced magnetron sputtering techniquePARITONG, H; LEMBKE, M; LEWIS, D. B et al.Surface & coatings technology. 1999, Vol 116-19, pp 1145-1151, issn 0257-8972Conference Paper

Effects of organic additives on magnetoresistance of electrodeposited Ni-Cu thin filmsHONG, Kimin; KIM, Jin-Kyu; LEE, Seung-Kwon et al.Physica status solidi. B. Basic research. 2004, Vol 241, Num 7, pp 1681-1685, issn 0370-1972, 5 p.Article

Organic electroluminescent devices fabricated with a co-deposited hole transport layerDO, L.-M; GANZORIG, C; KOIKE, A et al.Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals. 1997, Vol 294-95, pp 333-336, issn 1058-725XConference Paper

The effect of Si/Ir codeposition ratio on the Ir silicide/Si(100) interface roughnessCHUNG, C. K; HWANG, J.Materials chemistry and physics. 1996, Vol 43, Num 2, pp 191-194, issn 0254-0584Article

Codéposition des alliages amorphes à base de cobaltJYOKO, Y; HARUYAMA, S.Nippon Kinzoku Gakkaishi (1952). 1989, Vol 53, Num 1, pp 100-105, issn 0021-4876Article

Calorimetry of the Pd + D codepositionSZPAK, S; MOSIER-BOSS, P. A; MILES, M. H et al.Fusion technology. 1999, Vol 36, Num 2, pp 234-241, issn 0748-1896Article

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