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Encres conductrices thermodurcissables et leurs applicationsBERTEAUD, A. J.Revue de physique appliquée. 1986, Vol 21, Num 11, pp 665-668, issn 0035-1687Conference Paper

Macromolecular electronic deviceKOEZUKA, H; FUCHIGAMI, H; HAMANO, K et al.Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals. 1994, Vol 255, pp 221-230, issn 1058-725XConference Paper

Universell einsetzbare mikrorechnergesteuerte Druckregelung für Vakuumanlagen in Feinvakuumbereich = Système de réglage de pression commandé par micro-ordinateur et utilisable universellement, pour des installations à vide = Pressure adjustment system controlled by microcomputer and used in vacuum installationsHÜGL, M.Wissenschaftliche Zeitschrift der Technischen Universität Dresden. 1988, Vol 37, Num 3, pp 221-223, issn 0043-6925Article

Supramolecular approaches to organic electronics and nanotechnology. Proceedings of symposium F, E-MRS Spring Meeting 2004, May 24-28, 2004, Strasbourg, FranceSAMORI, Paolo; CACIALLI, Franco; ANDERSON, Harry L et al.Synthetic metals. 2004, Vol 147, Num 1-3, issn 0379-6779, 317 p.Conference Proceedings

SPECIAL ISSUE ON THE 2010 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)GYU-HYEONG CHO; MURMANN, Boris; HALONEN, Kari et al.IEEE journal of solid-state circuits. 2010, Vol 45, Num 12, issn 0018-9200, 424 p.Conference Proceedings

Workshop of Recent Advances on Low Dimensional Structures and Devices (WRA-LDSD)SAIDANE, Abdelkader.Microelectronics journal. 2009, Vol 40, Num 3, issn 0959-8324, 273 p.Conference Proceedings

Flexible electronics technology, Part I: Systems & applicationsNATHAN, Arokia; CHALAMALA, Babu R.Proceedings of the IEEE. 2005, Vol 93, Num 7, issn 0018-9219, 145 p.Serial Issue

Production de composants optoélectroniques = Production of optoelectronic componentsAMOUROUX, C; PESTIE, J.-P; ISERT, I. R et al.Revue des Télécommunications. 1988, Vol 62, Num 3-4, pp 251-258, issn 0373-8582Article

Recherche sur les composants optoélectroniques = Research on optoelectronic componentsHILDEBRAND, O; BENOIT, J; DUDA, E et al.Revue des Télécommunications. 1988, Vol 62, Num 3-4, pp 242-250, issn 0373-8582Article

17th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2006), Wuppertal, Germany, 3-6 October 2006BALK, L. J; GERLING, W. H; WOLFGANG, E et al.Microelectronics and reliability. 2006, Vol 46, Num 9-11, issn 0026-2714, 544 p.Conference Proceedings

Improved components increase thermal-imaging qualityBURMESTER, W.Laser focus (1983). 1988, Vol 24, Num 7, pp 145-151, issn 0740-2511, 4 p.Article

Optoelectronic and Electronic Materials and DevicesPOPESCU, Mihai.Journal of materials science. Materials in electronics. 2006, Vol 17, Num 4, issn 0957-4522Serial Issue

LCP für Elektronikbauteile = LCPs for electronic componentsHUBER, H.-J.Kunststoffe. 1996, Vol 86, Num 4, pp 530-532, issn 0023-5563Article

Lasertechnik in der Leiterplattenfertigung : Mikrostrukturieren von LeiterplattenKICKELHAIN, J.Metalloberfläche. 1991, Vol 45, Num 8, pp 349-358, issn 0026-0797Article

Reliability modelling of electronic componentsVERMA, A. K; MURTY, A. S. R.Microelectronics and reliability. 1987, Vol 27, Num 1, pp 29-32, issn 0026-2714Article

SPECIAL ISSUE ON THE 2010 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCEKAZUTAMI ARIMOTO; TAKEUCHI, Ken; KARNIK, Tanay et al.IEEE journal of solid-state circuits. 2011, Vol 46, Num 1, issn 0018-9200, 364 p.Conference Proceedings

Selected Papers from ISDRS 2009ILIADIS, Agis A; AKTURK, Akin.Solid-state electronics. 2010, Vol 54, Num 10, issn 0038-1101, 191 p.Conference Proceedings

Special Issue on the 2008 IEEE International Solid-State Circuits conference (ISSCC)HAM, Donhee; HIDAKA, Hideto; HO, Ron et al.IEEE journal of solid-state circuits. 2009, Vol 44, Num 1, issn 0018-9200, 313 p.Conference Proceedings

2007 Reliability of Compound Semiconductors (ROCS). WorkshopERSLAND, Peter; MENOZZI, Roberto.Microelectronics and reliability. 2008, Vol 48, Num 7, pp 958-993, issn 0026-2714, 35 p.Conference Paper

Reliability physics of advanced electron devicesSTOJADINOVIC, Ninoslav.Microelectronics and reliability. 1996, Vol 36, Num 7-8, issn 0026-2714, 296 p.Serial Issue

Konstruktiv-technologische Gestaltung elektronischer Baugruppen für Erzeugnisse des maschinenbaues = Structural-production-technological shaping electronic units for products of machine buildingTIEROK, M; REUSSE, D.Maschinenbautechnik. 1990, Vol 39, Num 5, pp 200-201, issn 0025-4495, 2 p.Article

An axial component PCB assembly system for inventory/throughput optimizationKASENCHAK, R. T; MARIKOS, M. R.Electronic manufacturing. 1989, Vol 35, Num 1, pp 18-21, 4 p.Article

Low Dimensional Structures and Devices ConferenceHENINI, Mohamed; HERNANDEZ-CALDERON, Isaac.Microelectronics journal. 2005, Vol 36, Num 3-6, issn 0959-8324, 440 p.Conference Proceedings

Flexible electronics technology, Part 2: Materials & devicesNATHAN, Arokia; CHALAMALA, Babu R.Proceedings of the IEEE. 2005, Vol 93, Num 8, issn 0018-9219, 121 p.Serial Issue

Prototype miniature split Stirling cryo-coolerCHHATWAL, H. L; GOSWAMI, T. R; DEWAKAR, R. K et al.Indian journal of pure & applied physics. 1993, Vol 31, Num 11, pp 794-797, issn 0019-5596Article

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